SEAL RINGS IN ELECTROCHEMICAL PROCESSORS

A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against the wafer surface. The seal ring may be installed on a rotor of the processor, and has an outer wall jointed to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid sup...

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Hauptverfasser: MATTINGER GEORGE, ZIMMERMAN NOLAN L, WILSON GREGORY J, ENGLHARDT ERIC A, RAMASAMY BALAMURUGAN
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ZIMMERMAN NOLAN L
WILSON GREGORY J
ENGLHARDT ERIC A
RAMASAMY BALAMURUGAN
description A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against the wafer surface. The seal ring may be installed on a rotor of the processor, and has an outer wall jointed to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings which slip or deflect laterally on the wafer surface may also be used. In these designs, slipping is substantially uniform and consistent, thereby resulting improvement in performance. 전기화학적 프로세서의 시일 링은 웨이퍼 표면에 대해 압착될 때 측방향으로 미끄러지거나 변형되지 않는다. 시일 링은 프로세서의 로터 상에 설치될 수 있으며, 시일 링은 단부를 통해 팁 원호에 연결되는 외벽을 갖는다. 외벽은 직선형 벽체일 수 있다. 더 정밀한 밀봉 치수를 제공하기 위해 비교적 강성의 지지 링이 시일 링에 부착될 수 있다. 웨이퍼 표면에서 측방향으로 변형되거나 미끄러지는 나이프 에지 시일 링들이 사용될 수도 있다. 이러한 구조들에 있어서, 미끄러짐이 실질적으로 균일하고 일관됨으로써, 성능 개선으로 이어진다.
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title SEAL RINGS IN ELECTROCHEMICAL PROCESSORS
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