3 APPARATUS AND METHOD FOR MEASURING DEPTH OF THREE DIMENSIONS

According to the present disclosure, a three-dimensional depth measuring method using a structured light camera including a first projector, a second projector, and an optical sensor, includes the steps of: allowing a first projector to project a first light pattern; allowing a second projector to p...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: VAVDIIUK DMYTRO, SAFONOV IVAN, ILIUKHIN SERHII, LAVRENYUK YAROSLAV, KLIMENKOV OLEKSANDR, SUKHARIEV ANDRII, BUT ANDRII, IERMOLENKO RUSLAN, MOROZOV KOSTIANTYN
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator VAVDIIUK DMYTRO
SAFONOV IVAN
ILIUKHIN SERHII
LAVRENYUK YAROSLAV
KLIMENKOV OLEKSANDR
SUKHARIEV ANDRII
BUT ANDRII
IERMOLENKO RUSLAN
MOROZOV KOSTIANTYN
description According to the present disclosure, a three-dimensional depth measuring method using a structured light camera including a first projector, a second projector, and an optical sensor, includes the steps of: allowing a first projector to project a first light pattern; allowing a second projector to project a second light pattern; filtering, by a color filter, a third light pattern in which the first light pattern and the second light pattern reflected from an object overlap, so as to separate the third light pattern into a first filtered pattern and a second filtered pattern; localizing the first filtered pattern and classifying first feature points of the first filtered pattern; localizing the second filtered pattern and classifying second feature points of the second filtered pattern; and obtaining position information of the object based on the first feature points and the second feature points. 본 개시에 따른 제1 투사기, 제2 투사기 및 광 센서를 포함하는 구조적 광 카메라를 이용한 3차원 깊이 측정 방법은, 상기 제1 투사기에 의하여 제1 광 패턴이 투사되는 과정과, 상기 제2 투사기에 의하여 제2 광 패턴이 투사되는 과정과, 오브젝트에서 반사된 상기 제1 광 패턴과 상기 제2 광 패턴이 중첩된 제3 광 패턴을 칼라 필터에 의하여 필터링하여, 필터링된 제1 패턴과 필터링된 제2 패턴으로 분리하는 과정과, 상기 필터링된 제1 패턴을 국소화하고, 상기 제1 패턴의 제1 특징점들을 분류하는 과정과, 상기 필터링된 제2 패턴을 국소화하고, 상기 제2 패턴의 제2 특징점들을 분류하는 과정과, 상기 제1 특징점들과 상기 제2 특징점들에 기초하여, 상기 오브젝트의 위치 정보를 획득하는 과정을 포함한다.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20200049958A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20200049958A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20200049958A3</originalsourceid><addsrcrecordid>eNrjZLAzVnAMCHAMcgwJDVZw9HNR8HUN8fB3UXDzDwIyHYNDgzz93BVcXANCPBT83RRCPIJcXRVcPH1d_YI9_f2CeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGRgYGBiaWlqYWjMXGqANDQKrQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>3 APPARATUS AND METHOD FOR MEASURING DEPTH OF THREE DIMENSIONS</title><source>esp@cenet</source><creator>VAVDIIUK DMYTRO ; SAFONOV IVAN ; ILIUKHIN SERHII ; LAVRENYUK YAROSLAV ; KLIMENKOV OLEKSANDR ; SUKHARIEV ANDRII ; BUT ANDRII ; IERMOLENKO RUSLAN ; MOROZOV KOSTIANTYN</creator><creatorcontrib>VAVDIIUK DMYTRO ; SAFONOV IVAN ; ILIUKHIN SERHII ; LAVRENYUK YAROSLAV ; KLIMENKOV OLEKSANDR ; SUKHARIEV ANDRII ; BUT ANDRII ; IERMOLENKO RUSLAN ; MOROZOV KOSTIANTYN</creatorcontrib><description>According to the present disclosure, a three-dimensional depth measuring method using a structured light camera including a first projector, a second projector, and an optical sensor, includes the steps of: allowing a first projector to project a first light pattern; allowing a second projector to project a second light pattern; filtering, by a color filter, a third light pattern in which the first light pattern and the second light pattern reflected from an object overlap, so as to separate the third light pattern into a first filtered pattern and a second filtered pattern; localizing the first filtered pattern and classifying first feature points of the first filtered pattern; localizing the second filtered pattern and classifying second feature points of the second filtered pattern; and obtaining position information of the object based on the first feature points and the second feature points. 본 개시에 따른 제1 투사기, 제2 투사기 및 광 센서를 포함하는 구조적 광 카메라를 이용한 3차원 깊이 측정 방법은, 상기 제1 투사기에 의하여 제1 광 패턴이 투사되는 과정과, 상기 제2 투사기에 의하여 제2 광 패턴이 투사되는 과정과, 오브젝트에서 반사된 상기 제1 광 패턴과 상기 제2 광 패턴이 중첩된 제3 광 패턴을 칼라 필터에 의하여 필터링하여, 필터링된 제1 패턴과 필터링된 제2 패턴으로 분리하는 과정과, 상기 필터링된 제1 패턴을 국소화하고, 상기 제1 패턴의 제1 특징점들을 분류하는 과정과, 상기 필터링된 제2 패턴을 국소화하고, 상기 제2 패턴의 제2 특징점들을 분류하는 과정과, 상기 제1 특징점들과 상기 제2 특징점들에 기초하여, 상기 오브젝트의 위치 정보를 획득하는 과정을 포함한다.</description><language>eng ; kor</language><subject>CALCULATING ; COMPUTING ; COUNTING ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; TESTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200511&amp;DB=EPODOC&amp;CC=KR&amp;NR=20200049958A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200511&amp;DB=EPODOC&amp;CC=KR&amp;NR=20200049958A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VAVDIIUK DMYTRO</creatorcontrib><creatorcontrib>SAFONOV IVAN</creatorcontrib><creatorcontrib>ILIUKHIN SERHII</creatorcontrib><creatorcontrib>LAVRENYUK YAROSLAV</creatorcontrib><creatorcontrib>KLIMENKOV OLEKSANDR</creatorcontrib><creatorcontrib>SUKHARIEV ANDRII</creatorcontrib><creatorcontrib>BUT ANDRII</creatorcontrib><creatorcontrib>IERMOLENKO RUSLAN</creatorcontrib><creatorcontrib>MOROZOV KOSTIANTYN</creatorcontrib><title>3 APPARATUS AND METHOD FOR MEASURING DEPTH OF THREE DIMENSIONS</title><description>According to the present disclosure, a three-dimensional depth measuring method using a structured light camera including a first projector, a second projector, and an optical sensor, includes the steps of: allowing a first projector to project a first light pattern; allowing a second projector to project a second light pattern; filtering, by a color filter, a third light pattern in which the first light pattern and the second light pattern reflected from an object overlap, so as to separate the third light pattern into a first filtered pattern and a second filtered pattern; localizing the first filtered pattern and classifying first feature points of the first filtered pattern; localizing the second filtered pattern and classifying second feature points of the second filtered pattern; and obtaining position information of the object based on the first feature points and the second feature points. 본 개시에 따른 제1 투사기, 제2 투사기 및 광 센서를 포함하는 구조적 광 카메라를 이용한 3차원 깊이 측정 방법은, 상기 제1 투사기에 의하여 제1 광 패턴이 투사되는 과정과, 상기 제2 투사기에 의하여 제2 광 패턴이 투사되는 과정과, 오브젝트에서 반사된 상기 제1 광 패턴과 상기 제2 광 패턴이 중첩된 제3 광 패턴을 칼라 필터에 의하여 필터링하여, 필터링된 제1 패턴과 필터링된 제2 패턴으로 분리하는 과정과, 상기 필터링된 제1 패턴을 국소화하고, 상기 제1 패턴의 제1 특징점들을 분류하는 과정과, 상기 필터링된 제2 패턴을 국소화하고, 상기 제2 패턴의 제2 특징점들을 분류하는 과정과, 상기 제1 특징점들과 상기 제2 특징점들에 기초하여, 상기 오브젝트의 위치 정보를 획득하는 과정을 포함한다.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAzVnAMCHAMcgwJDVZw9HNR8HUN8fB3UXDzDwIyHYNDgzz93BVcXANCPBT83RRCPIJcXRVcPH1d_YI9_f2CeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGRgYGBiaWlqYWjMXGqANDQKrQ</recordid><startdate>20200511</startdate><enddate>20200511</enddate><creator>VAVDIIUK DMYTRO</creator><creator>SAFONOV IVAN</creator><creator>ILIUKHIN SERHII</creator><creator>LAVRENYUK YAROSLAV</creator><creator>KLIMENKOV OLEKSANDR</creator><creator>SUKHARIEV ANDRII</creator><creator>BUT ANDRII</creator><creator>IERMOLENKO RUSLAN</creator><creator>MOROZOV KOSTIANTYN</creator><scope>EVB</scope></search><sort><creationdate>20200511</creationdate><title>3 APPARATUS AND METHOD FOR MEASURING DEPTH OF THREE DIMENSIONS</title><author>VAVDIIUK DMYTRO ; SAFONOV IVAN ; ILIUKHIN SERHII ; LAVRENYUK YAROSLAV ; KLIMENKOV OLEKSANDR ; SUKHARIEV ANDRII ; BUT ANDRII ; IERMOLENKO RUSLAN ; MOROZOV KOSTIANTYN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200049958A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>VAVDIIUK DMYTRO</creatorcontrib><creatorcontrib>SAFONOV IVAN</creatorcontrib><creatorcontrib>ILIUKHIN SERHII</creatorcontrib><creatorcontrib>LAVRENYUK YAROSLAV</creatorcontrib><creatorcontrib>KLIMENKOV OLEKSANDR</creatorcontrib><creatorcontrib>SUKHARIEV ANDRII</creatorcontrib><creatorcontrib>BUT ANDRII</creatorcontrib><creatorcontrib>IERMOLENKO RUSLAN</creatorcontrib><creatorcontrib>MOROZOV KOSTIANTYN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VAVDIIUK DMYTRO</au><au>SAFONOV IVAN</au><au>ILIUKHIN SERHII</au><au>LAVRENYUK YAROSLAV</au><au>KLIMENKOV OLEKSANDR</au><au>SUKHARIEV ANDRII</au><au>BUT ANDRII</au><au>IERMOLENKO RUSLAN</au><au>MOROZOV KOSTIANTYN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>3 APPARATUS AND METHOD FOR MEASURING DEPTH OF THREE DIMENSIONS</title><date>2020-05-11</date><risdate>2020</risdate><abstract>According to the present disclosure, a three-dimensional depth measuring method using a structured light camera including a first projector, a second projector, and an optical sensor, includes the steps of: allowing a first projector to project a first light pattern; allowing a second projector to project a second light pattern; filtering, by a color filter, a third light pattern in which the first light pattern and the second light pattern reflected from an object overlap, so as to separate the third light pattern into a first filtered pattern and a second filtered pattern; localizing the first filtered pattern and classifying first feature points of the first filtered pattern; localizing the second filtered pattern and classifying second feature points of the second filtered pattern; and obtaining position information of the object based on the first feature points and the second feature points. 본 개시에 따른 제1 투사기, 제2 투사기 및 광 센서를 포함하는 구조적 광 카메라를 이용한 3차원 깊이 측정 방법은, 상기 제1 투사기에 의하여 제1 광 패턴이 투사되는 과정과, 상기 제2 투사기에 의하여 제2 광 패턴이 투사되는 과정과, 오브젝트에서 반사된 상기 제1 광 패턴과 상기 제2 광 패턴이 중첩된 제3 광 패턴을 칼라 필터에 의하여 필터링하여, 필터링된 제1 패턴과 필터링된 제2 패턴으로 분리하는 과정과, 상기 필터링된 제1 패턴을 국소화하고, 상기 제1 패턴의 제1 특징점들을 분류하는 과정과, 상기 필터링된 제2 패턴을 국소화하고, 상기 제2 패턴의 제2 특징점들을 분류하는 과정과, 상기 제1 특징점들과 상기 제2 특징점들에 기초하여, 상기 오브젝트의 위치 정보를 획득하는 과정을 포함한다.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; kor
recordid cdi_epo_espacenet_KR20200049958A
source esp@cenet
subjects CALCULATING
COMPUTING
COUNTING
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
title 3 APPARATUS AND METHOD FOR MEASURING DEPTH OF THREE DIMENSIONS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T15%3A20%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=VAVDIIUK%20DMYTRO&rft.date=2020-05-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20200049958A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true