Touch Panel Adopted Robust Structure for Bonding and Manufacturing Method Thereof
The present invention relates to a touch panel applied with a robust bonding structure and a manufacturing method thereof. The touch panel of the present invention has a structure capable of increasing a yield by improving the reliability of a flexible printed circuit board (FPCB) bonding process th...
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| creator | KIM WOO KUK YANG SIN JU KIM TAE JOONG KIM JIN HEE CHO YEONG HWA KIM JI HWAN |
| description | The present invention relates to a touch panel applied with a robust bonding structure and a manufacturing method thereof. The touch panel of the present invention has a structure capable of increasing a yield by improving the reliability of a flexible printed circuit board (FPCB) bonding process through a structure capable of performing FPCB bonding on robust wiring electrodes without defective wiring electrodes due to wiring cracks around an FPCB bonded area even in the application of the wiring electrodes having fine circuit line widths.
본 발명은 본딩 강건 구조가 적용된 터치 패널 및 그 제조 방법에 관한 것으로서, 본 발명의 터치 패널은, 미세 회로 선폭을 가지는 배선 전극의 적용에서도 FPCB(Flexible Printed Circuit Board) 본딩 주위의 배선 크랙(crack)에 의한 배선 전극의 불량 없이 강건한 배선 전극에 FPCB 본딩이 가능한 구조를 통하여 FPCB 본딩 공정의 신뢰성을 향상시켜 수율을 높일 수 있는 구조를 갖는다. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20200045801A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20200045801A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20200045801A3</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHPxIOofFjwLsSp4raIIUtDae9kmGyOUbEg2_5eCD_A0MDNz9ey4GA8PDDRCbTkKWWh5KFngJakYKYnAcYITB_sJb8BgocFQHE5tMg2JZwudp0TslmrmcMy0-nGh1tdLd75tKHJPOaKhQNLf20pXWuv94ai39e6_6wttWTgB</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Touch Panel Adopted Robust Structure for Bonding and Manufacturing Method Thereof</title><source>esp@cenet</source><creator>KIM WOO KUK ; YANG SIN JU ; KIM TAE JOONG ; KIM JIN HEE ; CHO YEONG HWA ; KIM JI HWAN</creator><creatorcontrib>KIM WOO KUK ; YANG SIN JU ; KIM TAE JOONG ; KIM JIN HEE ; CHO YEONG HWA ; KIM JI HWAN</creatorcontrib><description>The present invention relates to a touch panel applied with a robust bonding structure and a manufacturing method thereof. The touch panel of the present invention has a structure capable of increasing a yield by improving the reliability of a flexible printed circuit board (FPCB) bonding process through a structure capable of performing FPCB bonding on robust wiring electrodes without defective wiring electrodes due to wiring cracks around an FPCB bonded area even in the application of the wiring electrodes having fine circuit line widths.
본 발명은 본딩 강건 구조가 적용된 터치 패널 및 그 제조 방법에 관한 것으로서, 본 발명의 터치 패널은, 미세 회로 선폭을 가지는 배선 전극의 적용에서도 FPCB(Flexible Printed Circuit Board) 본딩 주위의 배선 크랙(crack)에 의한 배선 전극의 불량 없이 강건한 배선 전극에 FPCB 본딩이 가능한 구조를 통하여 FPCB 본딩 공정의 신뢰성을 향상시켜 수율을 높일 수 있는 구조를 갖는다.</description><language>eng ; kor</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200506&DB=EPODOC&CC=KR&NR=20200045801A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200506&DB=EPODOC&CC=KR&NR=20200045801A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM WOO KUK</creatorcontrib><creatorcontrib>YANG SIN JU</creatorcontrib><creatorcontrib>KIM TAE JOONG</creatorcontrib><creatorcontrib>KIM JIN HEE</creatorcontrib><creatorcontrib>CHO YEONG HWA</creatorcontrib><creatorcontrib>KIM JI HWAN</creatorcontrib><title>Touch Panel Adopted Robust Structure for Bonding and Manufacturing Method Thereof</title><description>The present invention relates to a touch panel applied with a robust bonding structure and a manufacturing method thereof. The touch panel of the present invention has a structure capable of increasing a yield by improving the reliability of a flexible printed circuit board (FPCB) bonding process through a structure capable of performing FPCB bonding on robust wiring electrodes without defective wiring electrodes due to wiring cracks around an FPCB bonded area even in the application of the wiring electrodes having fine circuit line widths.
본 발명은 본딩 강건 구조가 적용된 터치 패널 및 그 제조 방법에 관한 것으로서, 본 발명의 터치 패널은, 미세 회로 선폭을 가지는 배선 전극의 적용에서도 FPCB(Flexible Printed Circuit Board) 본딩 주위의 배선 크랙(crack)에 의한 배선 전극의 불량 없이 강건한 배선 전극에 FPCB 본딩이 가능한 구조를 통하여 FPCB 본딩 공정의 신뢰성을 향상시켜 수율을 높일 수 있는 구조를 갖는다.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHPxIOofFjwLsSp4raIIUtDae9kmGyOUbEg2_5eCD_A0MDNz9ey4GA8PDDRCbTkKWWh5KFngJakYKYnAcYITB_sJb8BgocFQHE5tMg2JZwudp0TslmrmcMy0-nGh1tdLd75tKHJPOaKhQNLf20pXWuv94ai39e6_6wttWTgB</recordid><startdate>20200506</startdate><enddate>20200506</enddate><creator>KIM WOO KUK</creator><creator>YANG SIN JU</creator><creator>KIM TAE JOONG</creator><creator>KIM JIN HEE</creator><creator>CHO YEONG HWA</creator><creator>KIM JI HWAN</creator><scope>EVB</scope></search><sort><creationdate>20200506</creationdate><title>Touch Panel Adopted Robust Structure for Bonding and Manufacturing Method Thereof</title><author>KIM WOO KUK ; YANG SIN JU ; KIM TAE JOONG ; KIM JIN HEE ; CHO YEONG HWA ; KIM JI HWAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200045801A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM WOO KUK</creatorcontrib><creatorcontrib>YANG SIN JU</creatorcontrib><creatorcontrib>KIM TAE JOONG</creatorcontrib><creatorcontrib>KIM JIN HEE</creatorcontrib><creatorcontrib>CHO YEONG HWA</creatorcontrib><creatorcontrib>KIM JI HWAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM WOO KUK</au><au>YANG SIN JU</au><au>KIM TAE JOONG</au><au>KIM JIN HEE</au><au>CHO YEONG HWA</au><au>KIM JI HWAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Touch Panel Adopted Robust Structure for Bonding and Manufacturing Method Thereof</title><date>2020-05-06</date><risdate>2020</risdate><abstract>The present invention relates to a touch panel applied with a robust bonding structure and a manufacturing method thereof. The touch panel of the present invention has a structure capable of increasing a yield by improving the reliability of a flexible printed circuit board (FPCB) bonding process through a structure capable of performing FPCB bonding on robust wiring electrodes without defective wiring electrodes due to wiring cracks around an FPCB bonded area even in the application of the wiring electrodes having fine circuit line widths.
본 발명은 본딩 강건 구조가 적용된 터치 패널 및 그 제조 방법에 관한 것으로서, 본 발명의 터치 패널은, 미세 회로 선폭을 가지는 배선 전극의 적용에서도 FPCB(Flexible Printed Circuit Board) 본딩 주위의 배선 크랙(crack)에 의한 배선 전극의 불량 없이 강건한 배선 전극에 FPCB 본딩이 가능한 구조를 통하여 FPCB 본딩 공정의 신뢰성을 향상시켜 수율을 높일 수 있는 구조를 갖는다.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Touch Panel Adopted Robust Structure for Bonding and Manufacturing Method Thereof |
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