METHOD FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET
본 발명은 스퍼터링 타깃의 제조 비용을 저감하면서, 또한 제조되는 스퍼터링 타깃의 불순물 농도를 저감하는 것이다. 스퍼터링 타깃의 제조 방법은, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나에 대하여 표면 처리를 행하는 공정과, 표면 처리 후에, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나를 용해하여 잉곳을 제작하는 공정과, 잉곳에 대하여 단조 가공과 압연 가공과 열처리와 기계 가공을 행함으로써, 스퍼터링 타깃을 제조하는 공정을 구비한다. The manufacturing cost of a sputtering ta...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NAKASHIMA NOBUAKI KOMATSU TOORU |
| description | 본 발명은 스퍼터링 타깃의 제조 비용을 저감하면서, 또한 제조되는 스퍼터링 타깃의 불순물 농도를 저감하는 것이다. 스퍼터링 타깃의 제조 방법은, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나에 대하여 표면 처리를 행하는 공정과, 표면 처리 후에, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나를 용해하여 잉곳을 제작하는 공정과, 잉곳에 대하여 단조 가공과 압연 가공과 열처리와 기계 가공을 행함으로써, 스퍼터링 타깃을 제조하는 공정을 구비한다.
The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20200037461A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20200037461A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20200037461A3</originalsourceid><addsrcrecordid>eNrjZLDxdQ3x8HdRcPMPUggI8ncJdfb0c1cIDggNCXENAjFDHIPcXUMUHP1cMEV5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgZGBgYGxuYmZoaMxcaoAzu4qrw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET</title><source>esp@cenet</source><creator>NAKASHIMA NOBUAKI ; KOMATSU TOORU</creator><creatorcontrib>NAKASHIMA NOBUAKI ; KOMATSU TOORU</creatorcontrib><description>본 발명은 스퍼터링 타깃의 제조 비용을 저감하면서, 또한 제조되는 스퍼터링 타깃의 불순물 농도를 저감하는 것이다. 스퍼터링 타깃의 제조 방법은, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나에 대하여 표면 처리를 행하는 공정과, 표면 처리 후에, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나를 용해하여 잉곳을 제작하는 공정과, 잉곳에 대하여 단조 가공과 압연 가공과 열처리와 기계 가공을 행함으로써, 스퍼터링 타깃을 제조하는 공정을 구비한다.
The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.</description><language>eng ; kor</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; FORGE FURNACES ; FORGING ; HAMMERING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; METALLURGY ; PERFORMING OPERATIONS ; PRESSING METAL ; PUNCHING METAL ; RIVETING ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200408&DB=EPODOC&CC=KR&NR=20200037461A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200408&DB=EPODOC&CC=KR&NR=20200037461A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKASHIMA NOBUAKI</creatorcontrib><creatorcontrib>KOMATSU TOORU</creatorcontrib><title>METHOD FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET</title><description>본 발명은 스퍼터링 타깃의 제조 비용을 저감하면서, 또한 제조되는 스퍼터링 타깃의 불순물 농도를 저감하는 것이다. 스퍼터링 타깃의 제조 방법은, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나에 대하여 표면 처리를 행하는 공정과, 표면 처리 후에, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나를 용해하여 잉곳을 제작하는 공정과, 잉곳에 대하여 단조 가공과 압연 가공과 열처리와 기계 가공을 행함으로써, 스퍼터링 타깃을 제조하는 공정을 구비한다.
The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>FORGE FURNACES</subject><subject>FORGING</subject><subject>HAMMERING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRESSING METAL</subject><subject>PUNCHING METAL</subject><subject>RIVETING</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDxdQ3x8HdRcPMPUggI8ncJdfb0c1cIDggNCXENAjFDHIPcXUMUHP1cMEV5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgZGBgYGxuYmZoaMxcaoAzu4qrw</recordid><startdate>20200408</startdate><enddate>20200408</enddate><creator>NAKASHIMA NOBUAKI</creator><creator>KOMATSU TOORU</creator><scope>EVB</scope></search><sort><creationdate>20200408</creationdate><title>METHOD FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET</title><author>NAKASHIMA NOBUAKI ; KOMATSU TOORU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200037461A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>FORGE FURNACES</topic><topic>FORGING</topic><topic>HAMMERING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRESSING METAL</topic><topic>PUNCHING METAL</topic><topic>RIVETING</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKASHIMA NOBUAKI</creatorcontrib><creatorcontrib>KOMATSU TOORU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKASHIMA NOBUAKI</au><au>KOMATSU TOORU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET</title><date>2020-04-08</date><risdate>2020</risdate><abstract>본 발명은 스퍼터링 타깃의 제조 비용을 저감하면서, 또한 제조되는 스퍼터링 타깃의 불순물 농도를 저감하는 것이다. 스퍼터링 타깃의 제조 방법은, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나에 대하여 표면 처리를 행하는 공정과, 표면 처리 후에, 사용 완료된 스퍼터링 타깃 및 스크랩재 중 적어도 하나를 용해하여 잉곳을 제작하는 공정과, 잉곳에 대하여 단조 가공과 압연 가공과 열처리와 기계 가공을 행함으로써, 스퍼터링 타깃을 제조하는 공정을 구비한다.
The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; kor |
| recordid | cdi_epo_espacenet_KR20200037461A |
| source | esp@cenet |
| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FORGE FURNACES FORGING HAMMERING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PRESSING METAL PUNCHING METAL RIVETING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | METHOD FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T13%3A40%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKASHIMA%20NOBUAKI&rft.date=2020-04-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20200037461A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |