BATCH PROCESSING SYSTEM WITH VACUUM ISOLATION

A vapor deposition system comprises a vacuum chamber and two or more process modules each configured for processing a semiconductor substrate. Each process module is removably connected to each port of the vacuum chamber such that each process module is in vacuum communication with the vacuum chambe...

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Bibliographische Detailangaben
Hauptverfasser:	GOODMAN DANIEL L, KEIGLER ARTHUR, BARBERA KEVIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A vapor deposition system comprises a vacuum chamber and two or more process modules each configured for processing a semiconductor substrate. Each process module is removably connected to each port of the vacuum chamber such that each process module is in vacuum communication with the vacuum chamber when connected to each port. A port sealing mechanism is configured to create a vacuum seal at each port such that when a first port is sealed and a first process module is disconnected from the first port, a vacuum condition is maintained within the vacuum chamber while the first process module is open to atmospheric pressure. 증착 시스템은 진공 챔버, 및 각각 반도체 기판을 처리하도록 구성된 2개 이상의 프로세스 모듈을 포함한다. 각각의 프로세스 모듈은 각각의 포트에 연결될 때 각각의 프로세스 모듈이 진공 챔버와 진공 연통하도록 진공 챔버의 각각의 포트에 제거 가능하게 연결된다. 포트 밀봉 메커니즘은, 제1 포트가 밀봉되고 제1 프로세스 모듈이 제 1 포트로부터 분리될 때, 제1 프로세스 모듈이 대기압으로 개방된 동안 진공 상태가 진공 챔버 내에서 유지되도록 각각의 포트에서 진공 밀봉을 생성하도록 구성된다.