인터커넥트 회로 방법 및 장치

A method of forming a flexible interconnect circuit is described. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islan...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEGO PAUL HENRY, BROWN MALCOLM PARKER, YANG DONGAO, MILLER MICHAEL LAWRENCE, COAKLEY KEVIN MICHAEL
Format:	Patent
Sprache:	kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
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