LIGHTING MODULE HAVING ENHANCED HEAT RADIATION PERFORMANCE BENT TYPE HEAT PLATE USED THEREFOR AND METHOD FOR MANUFACTURING BENT TYPE HEAT PLATE

LIGHTING MODULE HAVING ENHANCED HEAT RADIATION PERFORMANCE BENT TYPE HEAT PLATE USED THEREFOR AND METHOD FOR MANUFACTURING BENT TYPE HEAT PLATE

Provided are a light emitting module having improved heat radiation performance, a bending type heat plate used therefor, and a manufacturing method of the bending type heat plate. The light emitting module having improved heat radiation performance comprises: a light source; a circuit board on whic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHO YOUNG SOO, KONG YU CHAN, KIM BYOUNG HO
Format: Patent
Sprache:eng ; kor
Schlagworte:
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:Provided are a light emitting module having improved heat radiation performance, a bending type heat plate used therefor, and a manufacturing method of the bending type heat plate. The light emitting module having improved heat radiation performance comprises: a light source; a circuit board on which the light source is mounted; and a heat plate coupled with the circuit board and discharging heat generated in the light source. The heat plate includes: a heat collection unit disposed to face a bottom surface of the circuit board so as to support the circuit board and receiving the heat from the light source through the circuit board; and a heat diffusion and discharge unit bent and extended from the heat collection unit to be disposed to face a side surface of the circuit board and diffusing and discharging the heat received from the heat collection unit. 본 발명은, 광원; 상기 광원이 실장되는 회로기판; 및 상기 회로기판과 결합되고, 상기 광원에서 발생한 열을 배출하는 히트 플레이트를 포함하고, 상기 히트 플레이트는, 상기 회로기판의 저면과 마주하도록 배치되어 상기 회로기판을 지지하고, 상기 회로기판을 통해 상기 열을 상기 광원으로부터 전달받는 열수집부; 및 상기 열수집부에서 절곡 연장되어 상기 회로기판의 측면과 마주하도록 배치되고, 상기 열수집부로부터 전달받은 상기 열을 확산 배출하는 열확산배출부를 포함하는, 개선된 방열 성능을 갖는 발광 모듈, 그에 사용되는 벤딩형 히트 플레이트, 및 벤딩형 히트 플레이트 제조 방법을 제공한다.