OPTICAL CLEAR RESIN AND ELECTRONIC DEVICE MANUFACTURED BY USING THE SAME

The present invention relates to: an optical transparent resin comprising 1) a polyorganosiloxane resin represented by chemical formula 1: (R1SiO_3/2)_a(R2SiO_3/2)_b(R3_2SiO_2/2)_c(R4SiO_3/2)_d(Me_3SiO_1/2)_e, 2) at least one photoinitiator, and 3) an adhesion promoter represented by chemical formul...

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Bibliographische Detailangaben
Hauptverfasser:	PARK HYUNJIN, PARK INGUI, KIM CHEONKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to: an optical transparent resin comprising 1) a polyorganosiloxane resin represented by chemical formula 1: (R1SiO_3/2)_a(R2SiO_3/2)_b(R3_2SiO_2/2)_c(R4SiO_3/2)_d(Me_3SiO_1/2)_e, 2) at least one photoinitiator, and 3) an adhesion promoter represented by chemical formula 2; and an electronic element formed by using the same. The optical transparent resin according to an embodiment of the present invention is characterized by having a faster photocuring speed than conventional silicon materials. 본 발명은 1) 상기 화학식 1로 표시되는 폴리오가노실록산 수지, 2) 1종 이상의 광개시제, 및 3) 상기 화학식 2로 표시되는 접착 촉진제를 포함하는 광학 투명 레진 및 이를 이용하여 형성된 전자 소자에 관한 것이다.