SPUTTERTING APPARATUS

According to an embodiment of the present invention, a sputtering apparatus can comprise: a stage rotatable in a state in which the stage supports a substrate provided with a fine pattern; a target facing the substrate; and a blocking member including a blocking body disposed between the stage and t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IWAHASHI TERUAKI, JEONG BYEONG HWA, JANG YONG SEOK, YAGINUMA KANJI, PARK DA HEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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