SPUTTERTING APPARATUS
According to an embodiment of the present invention, a sputtering apparatus can comprise: a stage rotatable in a state in which the stage supports a substrate provided with a fine pattern; a target facing the substrate; and a blocking member including a blocking body disposed between the stage and t...
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| creator | IWAHASHI TERUAKI JEONG BYEONG HWA JANG YONG SEOK YAGINUMA KANJI PARK DA HEE |
| description | According to an embodiment of the present invention, a sputtering apparatus can comprise: a stage rotatable in a state in which the stage supports a substrate provided with a fine pattern; a target facing the substrate; and a blocking member including a blocking body disposed between the stage and the target and a through hole formed in the blocking body and separated from the target to enable at least a portion of a membrane material that progresses to the substrate to pass therethrough.
일 실시 예에 따른 스퍼터링 장치는, 미세 패턴을 구비하는 기판을 지지한 상태로 회전 가능한 스테이지; 상기 기판과 마주하는 타겟; 및 상기 스테이지 및 타겟 사이에 배치되는 차단 바디와, 상기 차단 바디에 형성되고 상기 타겟으로부터 분리되어 상기 기판으로 진행하는 성막 물질의 적어도 일부를 통과시키는 통과 홀을 포함하는 차단 부재를 포함할 수 있다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20200001839A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20200001839A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20200001839A3</originalsourceid><addsrcrecordid>eNrjZBANDggNCXENCvH0c1dwDAhwDHIMCQ3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkYGQGBoYWzpaEycKgAzDSAE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SPUTTERTING APPARATUS</title><source>esp@cenet</source><creator>IWAHASHI TERUAKI ; JEONG BYEONG HWA ; JANG YONG SEOK ; YAGINUMA KANJI ; PARK DA HEE</creator><creatorcontrib>IWAHASHI TERUAKI ; JEONG BYEONG HWA ; JANG YONG SEOK ; YAGINUMA KANJI ; PARK DA HEE</creatorcontrib><description>According to an embodiment of the present invention, a sputtering apparatus can comprise: a stage rotatable in a state in which the stage supports a substrate provided with a fine pattern; a target facing the substrate; and a blocking member including a blocking body disposed between the stage and the target and a through hole formed in the blocking body and separated from the target to enable at least a portion of a membrane material that progresses to the substrate to pass therethrough.
일 실시 예에 따른 스퍼터링 장치는, 미세 패턴을 구비하는 기판을 지지한 상태로 회전 가능한 스테이지; 상기 기판과 마주하는 타겟; 및 상기 스테이지 및 타겟 사이에 배치되는 차단 바디와, 상기 차단 바디에 형성되고 상기 타겟으로부터 분리되어 상기 기판으로 진행하는 성막 물질의 적어도 일부를 통과시키는 통과 홀을 포함하는 차단 부재를 포함할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200107&DB=EPODOC&CC=KR&NR=20200001839A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200107&DB=EPODOC&CC=KR&NR=20200001839A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IWAHASHI TERUAKI</creatorcontrib><creatorcontrib>JEONG BYEONG HWA</creatorcontrib><creatorcontrib>JANG YONG SEOK</creatorcontrib><creatorcontrib>YAGINUMA KANJI</creatorcontrib><creatorcontrib>PARK DA HEE</creatorcontrib><title>SPUTTERTING APPARATUS</title><description>According to an embodiment of the present invention, a sputtering apparatus can comprise: a stage rotatable in a state in which the stage supports a substrate provided with a fine pattern; a target facing the substrate; and a blocking member including a blocking body disposed between the stage and the target and a through hole formed in the blocking body and separated from the target to enable at least a portion of a membrane material that progresses to the substrate to pass therethrough.
일 실시 예에 따른 스퍼터링 장치는, 미세 패턴을 구비하는 기판을 지지한 상태로 회전 가능한 스테이지; 상기 기판과 마주하는 타겟; 및 상기 스테이지 및 타겟 사이에 배치되는 차단 바디와, 상기 차단 바디에 형성되고 상기 타겟으로부터 분리되어 상기 기판으로 진행하는 성막 물질의 적어도 일부를 통과시키는 통과 홀을 포함하는 차단 부재를 포함할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBANDggNCXENCvH0c1dwDAhwDHIMCQ3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkYGQGBoYWzpaEycKgAzDSAE</recordid><startdate>20200107</startdate><enddate>20200107</enddate><creator>IWAHASHI TERUAKI</creator><creator>JEONG BYEONG HWA</creator><creator>JANG YONG SEOK</creator><creator>YAGINUMA KANJI</creator><creator>PARK DA HEE</creator><scope>EVB</scope></search><sort><creationdate>20200107</creationdate><title>SPUTTERTING APPARATUS</title><author>IWAHASHI TERUAKI ; JEONG BYEONG HWA ; JANG YONG SEOK ; YAGINUMA KANJI ; PARK DA HEE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200001839A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>IWAHASHI TERUAKI</creatorcontrib><creatorcontrib>JEONG BYEONG HWA</creatorcontrib><creatorcontrib>JANG YONG SEOK</creatorcontrib><creatorcontrib>YAGINUMA KANJI</creatorcontrib><creatorcontrib>PARK DA HEE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IWAHASHI TERUAKI</au><au>JEONG BYEONG HWA</au><au>JANG YONG SEOK</au><au>YAGINUMA KANJI</au><au>PARK DA HEE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SPUTTERTING APPARATUS</title><date>2020-01-07</date><risdate>2020</risdate><abstract>According to an embodiment of the present invention, a sputtering apparatus can comprise: a stage rotatable in a state in which the stage supports a substrate provided with a fine pattern; a target facing the substrate; and a blocking member including a blocking body disposed between the stage and the target and a through hole formed in the blocking body and separated from the target to enable at least a portion of a membrane material that progresses to the substrate to pass therethrough.
일 실시 예에 따른 스퍼터링 장치는, 미세 패턴을 구비하는 기판을 지지한 상태로 회전 가능한 스테이지; 상기 기판과 마주하는 타겟; 및 상기 스테이지 및 타겟 사이에 배치되는 차단 바디와, 상기 차단 바디에 형성되고 상기 타겟으로부터 분리되어 상기 기판으로 진행하는 성막 물질의 적어도 일부를 통과시키는 통과 홀을 포함하는 차단 부재를 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SPUTTERTING APPARATUS |
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