VACUUM PROCESSING APPARATUS VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD
The present invention provides a technique advantageous for miniaturization and simplification of an apparatus for processing vacuum. In a processing container of the apparatus for processing vacuum, first and second conveyance spaces are extended and installed in a horizontal direction at position...
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| creator | KOBAYASHI TAMIHIRO YAMAGISHI TAKAYUKI |
| description | The present invention provides a technique advantageous for miniaturization and simplification of an apparatus for processing vacuum. In a processing container of the apparatus for processing vacuum, first and second conveyance spaces are extended and installed in a horizontal direction at position where the first and second conveyance spaces are adjacent to each other while a middle wall unit is provided between the first and second conveyance spaces in the extension and installation direction. One or more processing spaces are disposed in the extension and installation direction in the first conveyance space and two or more processing spaces are disposed in the extension and installation direction in the second conveyance space. In addition, in the middle wall unit, a plurality of exhaust passages provided in each of the three or more processing spaces and joint exhaust passage to which a plurality of exhaust passages joint are formed. Since the joint exhaust passage is provided in the processing container, the apparatus for processing vacuum may be miniaturized and simplified.
본 발명은, 진공 처리 장치의 소형화나 간소화에 유리한 기술을 제공하는 것이다. 진공 처리 장치의 처리 용기 내에서, 서로 인접하는 위치에, 제1 및 제2 반송 공간이 수평 방향으로 연장 설치됨과 함께, 상기 연장 설치 방향을 따라서, 제1 및 제2 반송 공간의 사이에 중간 벽부가 마련된다. 제1 반송 공간에는, 연장 설치 방향을 따라서 1개 이상의 상기 처리 공간이 배치되고, 제2 반송 공간에는, 연장 설치 방향을 따라서 2개 이상의 상기 처리 공간이 배치된다. 그리고, 중간 벽부 내에는, 상기 3개 이상의 처리 공간에 대하여 각각 마련된 복수의 배기로와, 이들 복수의 배기로가 합류하는 합류 배기로가 형성되어 있다. 처리 용기 내에 합류 배기로가 마련되므로, 진공 처리 장치의 소형화 및 간소화를 도모할 수 있다. |
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본 발명은, 진공 처리 장치의 소형화나 간소화에 유리한 기술을 제공하는 것이다. 진공 처리 장치의 처리 용기 내에서, 서로 인접하는 위치에, 제1 및 제2 반송 공간이 수평 방향으로 연장 설치됨과 함께, 상기 연장 설치 방향을 따라서, 제1 및 제2 반송 공간의 사이에 중간 벽부가 마련된다. 제1 반송 공간에는, 연장 설치 방향을 따라서 1개 이상의 상기 처리 공간이 배치되고, 제2 반송 공간에는, 연장 설치 방향을 따라서 2개 이상의 상기 처리 공간이 배치된다. 그리고, 중간 벽부 내에는, 상기 3개 이상의 처리 공간에 대하여 각각 마련된 복수의 배기로와, 이들 복수의 배기로가 합류하는 합류 배기로가 형성되어 있다. 처리 용기 내에 합류 배기로가 마련되므로, 진공 처리 장치의 소형화 및 간소화를 도모할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191226&DB=EPODOC&CC=KR&NR=20190142211A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191226&DB=EPODOC&CC=KR&NR=20190142211A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOBAYASHI TAMIHIRO</creatorcontrib><creatorcontrib>YAMAGISHI TAKAYUKI</creatorcontrib><title>VACUUM PROCESSING APPARATUS VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD</title><description>The present invention provides a technique advantageous for miniaturization and simplification of an apparatus for processing vacuum. In a processing container of the apparatus for processing vacuum, first and second conveyance spaces are extended and installed in a horizontal direction at position where the first and second conveyance spaces are adjacent to each other while a middle wall unit is provided between the first and second conveyance spaces in the extension and installation direction. One or more processing spaces are disposed in the extension and installation direction in the first conveyance space and two or more processing spaces are disposed in the extension and installation direction in the second conveyance space. In addition, in the middle wall unit, a plurality of exhaust passages provided in each of the three or more processing spaces and joint exhaust passage to which a plurality of exhaust passages joint are formed. Since the joint exhaust passage is provided in the processing container, the apparatus for processing vacuum may be miniaturized and simplified.
본 발명은, 진공 처리 장치의 소형화나 간소화에 유리한 기술을 제공하는 것이다. 진공 처리 장치의 처리 용기 내에서, 서로 인접하는 위치에, 제1 및 제2 반송 공간이 수평 방향으로 연장 설치됨과 함께, 상기 연장 설치 방향을 따라서, 제1 및 제2 반송 공간의 사이에 중간 벽부가 마련된다. 제1 반송 공간에는, 연장 설치 방향을 따라서 1개 이상의 상기 처리 공간이 배치되고, 제2 반송 공간에는, 연장 설치 방향을 따라서 2개 이상의 상기 처리 공간이 배치된다. 그리고, 중간 벽부 내에는, 상기 3개 이상의 처리 공간에 대하여 각각 마련된 복수의 배기로와, 이들 복수의 배기로가 합류하는 합류 배기로가 형성되어 있다. 처리 용기 내에 합류 배기로가 마련되므로, 진공 처리 장치의 소형화 및 간소화를 도모할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgMc3QODfVVCAjyd3YNDvb0c1dwDAhwDHIMCQ1WwJQLjgwOcfVVcPRzwSLp6xri4e_Cw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkvivYOMDAwtDQxNjIwMDR2NiVMFALH6MLY</recordid><startdate>20191226</startdate><enddate>20191226</enddate><creator>KOBAYASHI TAMIHIRO</creator><creator>YAMAGISHI TAKAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20191226</creationdate><title>VACUUM PROCESSING APPARATUS VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD</title><author>KOBAYASHI TAMIHIRO ; YAMAGISHI TAKAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190142211A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KOBAYASHI TAMIHIRO</creatorcontrib><creatorcontrib>YAMAGISHI TAKAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOBAYASHI TAMIHIRO</au><au>YAMAGISHI TAKAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VACUUM PROCESSING APPARATUS VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD</title><date>2019-12-26</date><risdate>2019</risdate><abstract>The present invention provides a technique advantageous for miniaturization and simplification of an apparatus for processing vacuum. In a processing container of the apparatus for processing vacuum, first and second conveyance spaces are extended and installed in a horizontal direction at position where the first and second conveyance spaces are adjacent to each other while a middle wall unit is provided between the first and second conveyance spaces in the extension and installation direction. One or more processing spaces are disposed in the extension and installation direction in the first conveyance space and two or more processing spaces are disposed in the extension and installation direction in the second conveyance space. In addition, in the middle wall unit, a plurality of exhaust passages provided in each of the three or more processing spaces and joint exhaust passage to which a plurality of exhaust passages joint are formed. Since the joint exhaust passage is provided in the processing container, the apparatus for processing vacuum may be miniaturized and simplified.
본 발명은, 진공 처리 장치의 소형화나 간소화에 유리한 기술을 제공하는 것이다. 진공 처리 장치의 처리 용기 내에서, 서로 인접하는 위치에, 제1 및 제2 반송 공간이 수평 방향으로 연장 설치됨과 함께, 상기 연장 설치 방향을 따라서, 제1 및 제2 반송 공간의 사이에 중간 벽부가 마련된다. 제1 반송 공간에는, 연장 설치 방향을 따라서 1개 이상의 상기 처리 공간이 배치되고, 제2 반송 공간에는, 연장 설치 방향을 따라서 2개 이상의 상기 처리 공간이 배치된다. 그리고, 중간 벽부 내에는, 상기 3개 이상의 처리 공간에 대하여 각각 마련된 복수의 배기로와, 이들 복수의 배기로가 합류하는 합류 배기로가 형성되어 있다. 처리 용기 내에 합류 배기로가 마련되므로, 진공 처리 장치의 소형화 및 간소화를 도모할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | VACUUM PROCESSING APPARATUS VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD |
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