APPARATUS AND METHOD FOR CUTTING SUBSTRATE

APPARATUS AND METHOD FOR CUTTING SUBSTRATE

According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit pressurizing a scribing wheel to form a scribing line on a substrate; a dummy removing unit removing a dummy portion along the scribing line formed on the dummy portion of the substrate by th...

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Hauptverfasser: PARK JI WOONG, HA WAN YONG, JUNG HA JIN, JANG HUI DONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PARK JI WOONG
HA WAN YONG
JUNG HA JIN
JANG HUI DONG
description According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit pressurizing a scribing wheel to form a scribing line on a substrate; a dummy removing unit removing a dummy portion along the scribing line formed on the dummy portion of the substrate by the scribing unit; a cut surface measuring unit measuring a shape of a cut surface of the dummy portion removed by the dummy removing unit; and a control unit adjusting pressurizing force of the scribing wheel pressurized on the substrate based on the shape of the cut surface of the dummy portion measured by the cut surface measuring unit. 본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 휠을 가압하여 스크라이빙 라인을 형성하는 스크라이빙 유닛; 스크라이빙 유닛에 의해 기판의 더미 부분에 형성된 스크라이빙 라인을 따라 더미 부분을 제거하는 더미 제거 유닛; 더미 제거 유닛에 의해 제거된 더미 부분의 절단면 형상을 측정하는 절단면 측정 유닛; 및 절단면 측정 유닛에 의해 측정된 더미 부분의 절단면 형상을 기준으로 기판에 가압되는 스크라이빙 휠의 가압력을 조절하는 제어 유닛을 포함할 수 있다.
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HA WAN YONG ; JUNG HA JIN ; JANG HUI DONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190134005A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK JI WOONG</creatorcontrib><creatorcontrib>HA WAN YONG</creatorcontrib><creatorcontrib>JUNG HA JIN</creatorcontrib><creatorcontrib>JANG HUI DONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK JI WOONG</au><au>HA WAN YONG</au><au>JUNG HA JIN</au><au>JANG HUI DONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS AND METHOD FOR CUTTING SUBSTRATE</title><date>2019-12-04</date><risdate>2019</risdate><abstract>According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit pressurizing a scribing wheel to form a scribing line on a substrate; a dummy removing unit removing a dummy portion along the scribing line formed on the dummy portion of the substrate by the scribing unit; a cut surface measuring unit measuring a shape of a cut surface of the dummy portion removed by the dummy removing unit; and a control unit adjusting pressurizing force of the scribing wheel pressurized on the substrate based on the shape of the cut surface of the dummy portion measured by the cut surface measuring unit. 본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 휠을 가압하여 스크라이빙 라인을 형성하는 스크라이빙 유닛; 스크라이빙 유닛에 의해 기판의 더미 부분에 형성된 스크라이빙 라인을 따라 더미 부분을 제거하는 더미 제거 유닛; 더미 제거 유닛에 의해 제거된 더미 부분의 절단면 형상을 측정하는 절단면 측정 유닛; 및 절단면 측정 유닛에 의해 측정된 더미 부분의 절단면 형상을 기준으로 기판에 가압되는 스크라이빙 휠의 가압력을 조절하는 제어 유닛을 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title APPARATUS AND METHOD FOR CUTTING SUBSTRATE
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