ROTARY-TYPE SURFACE TREATMENT APPARATUS
Provided is a rotary-type surface treatment apparatus with high treatment efficiency that allows a treatment liquid to be discharged in a short time. When a treatment bath (2) is rotated, parts (20) contact an electrode (50) to be electroplated. In the event, a plating liquid (16) is used as circula...
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| creator | SHIMIZU KOUJI UTSUMI MASAYUKI ARATANI MASATO HOTTA TERUYUKI |
| description | Provided is a rotary-type surface treatment apparatus with high treatment efficiency that allows a treatment liquid to be discharged in a short time. When a treatment bath (2) is rotated, parts (20) contact an electrode (50) to be electroplated. In the event, a plating liquid (16) is used as circulated by a pump (P). The plating liquid (16) is discharged to the outside through a gap in a side wall (80) for replacement of the plating liquid (16) or the like. During discharge, the plating liquid (16) is not circulated by the pump (P). The gap (8) which is formed in the side wall (80) is formed to be smaller than the minimum dimension of the parts (20) on the inner side. The gap (8) is formed to be wider toward the outer side. Thus, water is discharged immediately.
처리액의 배출 시간이 짧고 처리 효율이 좋은 회전식 표면 처리 장치를 제공한다. 처리조(2)의 회전에 의해 부품(20)이 전극(50)에 접하고, 전기 도금이 실시된다. 이 때, 도금액(16)은 펌프(P)에 의해 순환되어 사용된다. 도금액(16)의 교환 시 등 도금액(16)을 배출할 때에는 측벽(80)의 공극으로부터 외부로 방출된다. 배출할 때에는 펌프(P)에 의한 순환은 행해지지 않는다. 측벽(80)에 형성된 공극(8)은 내측에 있어서 부품(20)의 최소 치수보다 작게 형성되어 있다. 외측을 향해 넓어지도록 형성되어 있다. 따라서, 배수가 신속하게 행해진다. |
| format | Patent |
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처리액의 배출 시간이 짧고 처리 효율이 좋은 회전식 표면 처리 장치를 제공한다. 처리조(2)의 회전에 의해 부품(20)이 전극(50)에 접하고, 전기 도금이 실시된다. 이 때, 도금액(16)은 펌프(P)에 의해 순환되어 사용된다. 도금액(16)의 교환 시 등 도금액(16)을 배출할 때에는 측벽(80)의 공극으로부터 외부로 방출된다. 배출할 때에는 펌프(P)에 의한 순환은 행해지지 않는다. 측벽(80)에 형성된 공극(8)은 내측에 있어서 부품(20)의 최소 치수보다 작게 형성되어 있다. 외측을 향해 넓어지도록 형성되어 있다. 따라서, 배수가 신속하게 행해진다.</description><language>eng ; kor</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191010&DB=EPODOC&CC=KR&NR=20190114727A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191010&DB=EPODOC&CC=KR&NR=20190114727A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMIZU KOUJI</creatorcontrib><creatorcontrib>UTSUMI MASAYUKI</creatorcontrib><creatorcontrib>ARATANI MASATO</creatorcontrib><creatorcontrib>HOTTA TERUYUKI</creatorcontrib><title>ROTARY-TYPE SURFACE TREATMENT APPARATUS</title><description>Provided is a rotary-type surface treatment apparatus with high treatment efficiency that allows a treatment liquid to be discharged in a short time. When a treatment bath (2) is rotated, parts (20) contact an electrode (50) to be electroplated. In the event, a plating liquid (16) is used as circulated by a pump (P). The plating liquid (16) is discharged to the outside through a gap in a side wall (80) for replacement of the plating liquid (16) or the like. During discharge, the plating liquid (16) is not circulated by the pump (P). The gap (8) which is formed in the side wall (80) is formed to be smaller than the minimum dimension of the parts (20) on the inner side. The gap (8) is formed to be wider toward the outer side. Thus, water is discharged immediately.
처리액의 배출 시간이 짧고 처리 효율이 좋은 회전식 표면 처리 장치를 제공한다. 처리조(2)의 회전에 의해 부품(20)이 전극(50)에 접하고, 전기 도금이 실시된다. 이 때, 도금액(16)은 펌프(P)에 의해 순환되어 사용된다. 도금액(16)의 교환 시 등 도금액(16)을 배출할 때에는 측벽(80)의 공극으로부터 외부로 방출된다. 배출할 때에는 펌프(P)에 의한 순환은 행해지지 않는다. 측벽(80)에 형성된 공극(8)은 내측에 있어서 부품(20)의 최소 치수보다 작게 형성되어 있다. 외측을 향해 넓어지도록 형성되어 있다. 따라서, 배수가 신속하게 행해진다.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAP8g9xDIrUDYkMcFUIDg1yc3R2VQgJcnUM8XX1C1FwDAhwDHIMCQ3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBoaWBoaGJuZG5o7GxKkCAJw_JQw</recordid><startdate>20191010</startdate><enddate>20191010</enddate><creator>SHIMIZU KOUJI</creator><creator>UTSUMI MASAYUKI</creator><creator>ARATANI MASATO</creator><creator>HOTTA TERUYUKI</creator><scope>EVB</scope></search><sort><creationdate>20191010</creationdate><title>ROTARY-TYPE SURFACE TREATMENT APPARATUS</title><author>SHIMIZU KOUJI ; UTSUMI MASAYUKI ; ARATANI MASATO ; HOTTA TERUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190114727A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMIZU KOUJI</creatorcontrib><creatorcontrib>UTSUMI MASAYUKI</creatorcontrib><creatorcontrib>ARATANI MASATO</creatorcontrib><creatorcontrib>HOTTA TERUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMIZU KOUJI</au><au>UTSUMI MASAYUKI</au><au>ARATANI MASATO</au><au>HOTTA TERUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ROTARY-TYPE SURFACE TREATMENT APPARATUS</title><date>2019-10-10</date><risdate>2019</risdate><abstract>Provided is a rotary-type surface treatment apparatus with high treatment efficiency that allows a treatment liquid to be discharged in a short time. When a treatment bath (2) is rotated, parts (20) contact an electrode (50) to be electroplated. In the event, a plating liquid (16) is used as circulated by a pump (P). The plating liquid (16) is discharged to the outside through a gap in a side wall (80) for replacement of the plating liquid (16) or the like. During discharge, the plating liquid (16) is not circulated by the pump (P). The gap (8) which is formed in the side wall (80) is formed to be smaller than the minimum dimension of the parts (20) on the inner side. The gap (8) is formed to be wider toward the outer side. Thus, water is discharged immediately.
처리액의 배출 시간이 짧고 처리 효율이 좋은 회전식 표면 처리 장치를 제공한다. 처리조(2)의 회전에 의해 부품(20)이 전극(50)에 접하고, 전기 도금이 실시된다. 이 때, 도금액(16)은 펌프(P)에 의해 순환되어 사용된다. 도금액(16)의 교환 시 등 도금액(16)을 배출할 때에는 측벽(80)의 공극으로부터 외부로 방출된다. 배출할 때에는 펌프(P)에 의한 순환은 행해지지 않는다. 측벽(80)에 형성된 공극(8)은 내측에 있어서 부품(20)의 최소 치수보다 작게 형성되어 있다. 외측을 향해 넓어지도록 형성되어 있다. 따라서, 배수가 신속하게 행해진다.</abstract><oa>free_for_read</oa></addata></record> |
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| title | ROTARY-TYPE SURFACE TREATMENT APPARATUS |
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