METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN
본 발명은 특정 감광성 수지 표면에 금속층을 형성하는 방법에 관한 것으로, (i) 알칼리성 수용액을 이용하여 감광성 수지 표면에 대해 세정 및 예비 활성화를 진행하는 전처리 단계; (ii) 감광성 수지를 표면 개질제 속에 침지하여 유기 개질층을 형성하는 표면 개질 단계; (iii) 촉매 금속 이온을 첨가하여, 유기 개질층과 촉매 금속 이온이 금속 이온 착물을 형성하도록 하는 표면 활성화 단계; (iv) 환원제를 이용하여 금속 이온 착물을 나노 금속 촉매로 환원시키는 환원 반응 단계; (v) 감광성 수지를 화학 증착액 속에 침지하여...
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| creator | HUANG TANG CHIEH HSU CHIA FU CHUANG CHAO CHIN |
| description | 본 발명은 특정 감광성 수지 표면에 금속층을 형성하는 방법에 관한 것으로, (i) 알칼리성 수용액을 이용하여 감광성 수지 표면에 대해 세정 및 예비 활성화를 진행하는 전처리 단계; (ii) 감광성 수지를 표면 개질제 속에 침지하여 유기 개질층을 형성하는 표면 개질 단계; (iii) 촉매 금속 이온을 첨가하여, 유기 개질층과 촉매 금속 이온이 금속 이온 착물을 형성하도록 하는 표면 활성화 단계; (iv) 환원제를 이용하여 금속 이온 착물을 나노 금속 촉매로 환원시키는 환원 반응 단계; (v) 감광성 수지를 화학 증착액 속에 침지하여 도전 금속층을 형성하는 화학 증착 단계; (vi) 감광성 수지를 100-250℃ 조건에서 베이킹하는 열처리 단계; 및 (vii) 베이킹된 감광성 수지에 대해 전기도금을 진행하여 도전 금속층의 두께를 증가시키는 전기도금에 의한 두께 증가 단계를 포함한다.
The present invention provides a method of forming a metal layer on a specific photosensitive resin. The method comprises the following steps: (i) pretreatment: cleaning and pre-activating a surface of the photosensitive resin by using an alkaline solution; (ii) surface modification: soaking the photosensitive resin in a surface modifier to form an organic modification layer; (iii) surface activation: adding catalytic metal ions to form a metal ion complex with the organic modification layer; (iv) reduction reaction: reducing the metal ion complex into a nano metal catalyst by using a reducing agent; (v) chemical plating: soaking the photosensitive resin in an chemical plating solution to form a conductive metal layer; (vi) heat treatment: baking the photosensitive resin at 100-250° C., and (vii) electroplating thickening: electroplating the baked photosensitive resin to thicken the conductive metal layer. |
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The present invention provides a method of forming a metal layer on a specific photosensitive resin. The method comprises the following steps: (i) pretreatment: cleaning and pre-activating a surface of the photosensitive resin by using an alkaline solution; (ii) surface modification: soaking the photosensitive resin in a surface modifier to form an organic modification layer; (iii) surface activation: adding catalytic metal ions to form a metal ion complex with the organic modification layer; (iv) reduction reaction: reducing the metal ion complex into a nano metal catalyst by using a reducing agent; (v) chemical plating: soaking the photosensitive resin in an chemical plating solution to form a conductive metal layer; (vi) heat treatment: baking the photosensitive resin at 100-250° C., and (vii) electroplating thickening: electroplating the baked photosensitive resin to thicken the conductive metal layer.</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CINEMATOGRAPHY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTROGRAPHY ; HOLOGRAPHY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MATERIALS THEREFOR ; METALLURGY ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190826&DB=EPODOC&CC=KR&NR=20190099112A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190826&DB=EPODOC&CC=KR&NR=20190099112A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG TANG CHIEH</creatorcontrib><creatorcontrib>HSU CHIA FU</creatorcontrib><creatorcontrib>CHUANG CHAO CHIN</creatorcontrib><title>METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN</title><description>본 발명은 특정 감광성 수지 표면에 금속층을 형성하는 방법에 관한 것으로, (i) 알칼리성 수용액을 이용하여 감광성 수지 표면에 대해 세정 및 예비 활성화를 진행하는 전처리 단계; (ii) 감광성 수지를 표면 개질제 속에 침지하여 유기 개질층을 형성하는 표면 개질 단계; (iii) 촉매 금속 이온을 첨가하여, 유기 개질층과 촉매 금속 이온이 금속 이온 착물을 형성하도록 하는 표면 활성화 단계; (iv) 환원제를 이용하여 금속 이온 착물을 나노 금속 촉매로 환원시키는 환원 반응 단계; (v) 감광성 수지를 화학 증착액 속에 침지하여 도전 금속층을 형성하는 화학 증착 단계; (vi) 감광성 수지를 100-250℃ 조건에서 베이킹하는 열처리 단계; 및 (vii) 베이킹된 감광성 수지에 대해 전기도금을 진행하여 도전 금속층의 두께를 증가시키는 전기도금에 의한 두께 증가 단계를 포함한다.
The present invention provides a method of forming a metal layer on a specific photosensitive resin. The method comprises the following steps: (i) pretreatment: cleaning and pre-activating a surface of the photosensitive resin by using an alkaline solution; (ii) surface modification: soaking the photosensitive resin in a surface modifier to form an organic modification layer; (iii) surface activation: adding catalytic metal ions to form a metal ion complex with the organic modification layer; (iv) reduction reaction: reducing the metal ion complex into a nano metal catalyst by using a reducing agent; (v) chemical plating: soaking the photosensitive resin in an chemical plating solution to form a conductive metal layer; (vi) heat treatment: baking the photosensitive resin at 100-250° C., and (vii) electroplating thickening: electroplating the baked photosensitive resin to thicken the conductive metal layer.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD0dQ3x8HdR8HdTcPMP8vX0c1dwVACKOfoo-DhGugYp-PsBBQI8_EP8g139gj1DPMNcFYJcgz39eBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGhpYGBpaWhoZGjMXGqAAfXKVw</recordid><startdate>20190826</startdate><enddate>20190826</enddate><creator>HUANG TANG CHIEH</creator><creator>HSU CHIA FU</creator><creator>CHUANG CHAO CHIN</creator><scope>EVB</scope></search><sort><creationdate>20190826</creationdate><title>METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN</title><author>HUANG TANG CHIEH ; HSU CHIA FU ; CHUANG CHAO CHIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190099112A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG TANG CHIEH</creatorcontrib><creatorcontrib>HSU CHIA FU</creatorcontrib><creatorcontrib>CHUANG CHAO CHIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG TANG CHIEH</au><au>HSU CHIA FU</au><au>CHUANG CHAO CHIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN</title><date>2019-08-26</date><risdate>2019</risdate><abstract>본 발명은 특정 감광성 수지 표면에 금속층을 형성하는 방법에 관한 것으로, (i) 알칼리성 수용액을 이용하여 감광성 수지 표면에 대해 세정 및 예비 활성화를 진행하는 전처리 단계; (ii) 감광성 수지를 표면 개질제 속에 침지하여 유기 개질층을 형성하는 표면 개질 단계; (iii) 촉매 금속 이온을 첨가하여, 유기 개질층과 촉매 금속 이온이 금속 이온 착물을 형성하도록 하는 표면 활성화 단계; (iv) 환원제를 이용하여 금속 이온 착물을 나노 금속 촉매로 환원시키는 환원 반응 단계; (v) 감광성 수지를 화학 증착액 속에 침지하여 도전 금속층을 형성하는 화학 증착 단계; (vi) 감광성 수지를 100-250℃ 조건에서 베이킹하는 열처리 단계; 및 (vii) 베이킹된 감광성 수지에 대해 전기도금을 진행하여 도전 금속층의 두께를 증가시키는 전기도금에 의한 두께 증가 단계를 포함한다.
The present invention provides a method of forming a metal layer on a specific photosensitive resin. The method comprises the following steps: (i) pretreatment: cleaning and pre-activating a surface of the photosensitive resin by using an alkaline solution; (ii) surface modification: soaking the photosensitive resin in a surface modifier to form an organic modification layer; (iii) surface activation: adding catalytic metal ions to form a metal ion complex with the organic modification layer; (iv) reduction reaction: reducing the metal ion complex into a nano metal catalyst by using a reducing agent; (v) chemical plating: soaking the photosensitive resin in an chemical plating solution to form a conductive metal layer; (vi) heat treatment: baking the photosensitive resin at 100-250° C., and (vii) electroplating thickening: electroplating the baked photosensitive resin to thicken the conductive metal layer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN |
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