전자 모듈, 방법
본 발명은 적어도 하나의 전기/전자 부품(7) 및 상기 부품(7)을 적어도 부분적으로 둘러싸는 하우징(8)을 포함한 전자 모듈(6), 특히 전력 모듈에 관한 것이며, 하우징(8)은 시멘트 복합체(1)로 제조되고, 시멘트 복합체(1)는 적어도 하나의 미립자 충전제(2)를 갖는다. 본 발명에 따르면, 미립자 충전제(2)는 산화 알루미늄(4)으로만 이루어진 코팅을 각각 갖는 질화 알루미늄 입자들(3)을 포함한다. The invention relates to an electronic module (6), in particular a pow...
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| creator | KAESSNER STEFAN ROMETSCH BERND RITTNER MARTIN HEJTMANN GEORG |
| description | 본 발명은 적어도 하나의 전기/전자 부품(7) 및 상기 부품(7)을 적어도 부분적으로 둘러싸는 하우징(8)을 포함한 전자 모듈(6), 특히 전력 모듈에 관한 것이며, 하우징(8)은 시멘트 복합체(1)로 제조되고, 시멘트 복합체(1)는 적어도 하나의 미립자 충전제(2)를 갖는다. 본 발명에 따르면, 미립자 충전제(2)는 산화 알루미늄(4)으로만 이루어진 코팅을 각각 갖는 질화 알루미늄 입자들(3)을 포함한다.
The invention relates to an electronic module (6), in particular a power module, having at least one electrical/electronic component (7) and having a housing (8), which at least partly extends around the component (7), wherein the housing (8) is made of cement composite (1), and wherein the cement composite (1) has at least one particulate filler (2). According to the invention, the particulate filler (2) has aluminum nitride particles (3), which each have a coating only of aluminum oxide (4). |
| format | Patent |
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The invention relates to an electronic module (6), in particular a power module, having at least one electrical/electronic component (7) and having a housing (8), which at least partly extends around the component (7), wherein the housing (8) is made of cement composite (1), and wherein the cement composite (1) has at least one particulate filler (2). According to the invention, the particulate filler (2) has aluminum nitride particles (3), which each have a coating only of aluminum oxide (4).</description><language>kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190820&DB=EPODOC&CC=KR&NR=20190097082A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190820&DB=EPODOC&CC=KR&NR=20190097082A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAESSNER STEFAN</creatorcontrib><creatorcontrib>ROMETSCH BERND</creatorcontrib><creatorcontrib>RITTNER MARTIN</creatorcontrib><creatorcontrib>HEJTMANN GEORG</creatorcontrib><title>전자 모듈, 방법</title><description>본 발명은 적어도 하나의 전기/전자 부품(7) 및 상기 부품(7)을 적어도 부분적으로 둘러싸는 하우징(8)을 포함한 전자 모듈(6), 특히 전력 모듈에 관한 것이며, 하우징(8)은 시멘트 복합체(1)로 제조되고, 시멘트 복합체(1)는 적어도 하나의 미립자 충전제(2)를 갖는다. 본 발명에 따르면, 미립자 충전제(2)는 산화 알루미늄(4)으로만 이루어진 코팅을 각각 갖는 질화 알루미늄 입자들(3)을 포함한다.
The invention relates to an electronic module (6), in particular a power module, having at least one electrical/electronic component (7) and having a housing (8), which at least partly extends around the component (7), wherein the housing (8) is made of cement composite (1), and wherein the cement composite (1) has at least one particulate filler (2). According to the invention, the particulate filler (2) has aluminum nitride particles (3), which each have a coating only of aluminum oxide (4).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB9s6DlzbwJCq9XrXg9uUNH4fWGla83TeVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGhpYGBpbmBhZGjsbEqQIAEJ8nMw</recordid><startdate>20190820</startdate><enddate>20190820</enddate><creator>KAESSNER STEFAN</creator><creator>ROMETSCH BERND</creator><creator>RITTNER MARTIN</creator><creator>HEJTMANN GEORG</creator><scope>EVB</scope></search><sort><creationdate>20190820</creationdate><title>전자 모듈, 방법</title><author>KAESSNER STEFAN ; ROMETSCH BERND ; RITTNER MARTIN ; HEJTMANN GEORG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190097082A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAESSNER STEFAN</creatorcontrib><creatorcontrib>ROMETSCH BERND</creatorcontrib><creatorcontrib>RITTNER MARTIN</creatorcontrib><creatorcontrib>HEJTMANN GEORG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAESSNER STEFAN</au><au>ROMETSCH BERND</au><au>RITTNER MARTIN</au><au>HEJTMANN GEORG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>전자 모듈, 방법</title><date>2019-08-20</date><risdate>2019</risdate><abstract>본 발명은 적어도 하나의 전기/전자 부품(7) 및 상기 부품(7)을 적어도 부분적으로 둘러싸는 하우징(8)을 포함한 전자 모듈(6), 특히 전력 모듈에 관한 것이며, 하우징(8)은 시멘트 복합체(1)로 제조되고, 시멘트 복합체(1)는 적어도 하나의 미립자 충전제(2)를 갖는다. 본 발명에 따르면, 미립자 충전제(2)는 산화 알루미늄(4)으로만 이루어진 코팅을 각각 갖는 질화 알루미늄 입자들(3)을 포함한다.
The invention relates to an electronic module (6), in particular a power module, having at least one electrical/electronic component (7) and having a housing (8), which at least partly extends around the component (7), wherein the housing (8) is made of cement composite (1), and wherein the cement composite (1) has at least one particulate filler (2). According to the invention, the particulate filler (2) has aluminum nitride particles (3), which each have a coating only of aluminum oxide (4).</abstract><oa>free_for_read</oa></addata></record> |
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| title | 전자 모듈, 방법 |
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