TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING
An upper electrode for use in a substrate processing system includes a lower surface. The lower surface includes first and second portions, and is plasma-facing. The first portion includes a first surface region having a first thickness. The second portion includes a second surface region having a v...
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| creator | MARAKHTANOV ALEXEI MANKIDY PRATIK JACOB KIM HALEY LLERA ANTHONY DELA SHIN HYUNGJOO HOLLAND JOHN PATRICK CHEN ZHIGANG |
| description | An upper electrode for use in a substrate processing system includes a lower surface. The lower surface includes first and second portions, and is plasma-facing. The first portion includes a first surface region having a first thickness. The second portion includes a second surface region having a varying thickness such that the second portion transitions from a second thickness to the first thickness.
기판 프로세싱 시스템에서 사용하기 위한 상부 전극은 하부 표면을 포함한다. 하부 표면은 제 1 부분 및 제 2 부분을 포함하고, 플라즈마-대면이다. 제 1 부분은 제 1 두께를 갖는 제 1 표면 영역을 포함한다. 제 2 부분이 제 2 두께로부터 제 1 두께로 변환하도록 (transition) 제 2 부분은 가변하는 두께를 갖는 제 2 표면을 포함한다. |
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기판 프로세싱 시스템에서 사용하기 위한 상부 전극은 하부 표면을 포함한다. 하부 표면은 제 1 부분 및 제 2 부분을 포함하고, 플라즈마-대면이다. 제 1 부분은 제 1 두께를 갖는 제 1 표면 영역을 포함한다. 제 2 부분이 제 2 두께로부터 제 1 두께로 변환하도록 (transition) 제 2 부분은 가변하는 두께를 갖는 제 2 표면을 포함한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190814&DB=EPODOC&CC=KR&NR=20190095117A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190814&DB=EPODOC&CC=KR&NR=20190095117A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARAKHTANOV ALEXEI</creatorcontrib><creatorcontrib>MANKIDY PRATIK JACOB</creatorcontrib><creatorcontrib>KIM HALEY</creatorcontrib><creatorcontrib>LLERA ANTHONY DELA</creatorcontrib><creatorcontrib>SHIN HYUNGJOO</creatorcontrib><creatorcontrib>HOLLAND JOHN PATRICK</creatorcontrib><creatorcontrib>CHEN ZHIGANG</creatorcontrib><title>TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING</title><description>An upper electrode for use in a substrate processing system includes a lower surface. The lower surface includes first and second portions, and is plasma-facing. The first portion includes a first surface region having a first thickness. The second portion includes a second surface region having a varying thickness such that the second portion transitions from a second thickness to the first thickness.
기판 프로세싱 시스템에서 사용하기 위한 상부 전극은 하부 표면을 포함한다. 하부 표면은 제 1 부분 및 제 2 부분을 포함하고, 플라즈마-대면이다. 제 1 부분은 제 1 두께를 갖는 제 1 표면 영역을 포함한다. 제 2 부분이 제 2 두께로부터 제 1 두께로 변환하도록 (transition) 제 2 부분은 가변하는 두께를 갖는 제 2 표면을 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOcQxwDXJ1UQgNANIKrj6uziFB_i6uCm7-QQqhfp5AytczJFLB2d8PKO6j4OmnEODjGOzrqBAQ5O_sGhzs6efOw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkvivYOMDAwtDQwsTQ0NzR2NiVMFAPpgLKQ</recordid><startdate>20190814</startdate><enddate>20190814</enddate><creator>MARAKHTANOV ALEXEI</creator><creator>MANKIDY PRATIK JACOB</creator><creator>KIM HALEY</creator><creator>LLERA ANTHONY DELA</creator><creator>SHIN HYUNGJOO</creator><creator>HOLLAND JOHN PATRICK</creator><creator>CHEN ZHIGANG</creator><scope>EVB</scope></search><sort><creationdate>20190814</creationdate><title>TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING</title><author>MARAKHTANOV ALEXEI ; MANKIDY PRATIK JACOB ; KIM HALEY ; LLERA ANTHONY DELA ; SHIN HYUNGJOO ; HOLLAND JOHN PATRICK ; CHEN ZHIGANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190095117A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>MARAKHTANOV ALEXEI</creatorcontrib><creatorcontrib>MANKIDY PRATIK JACOB</creatorcontrib><creatorcontrib>KIM HALEY</creatorcontrib><creatorcontrib>LLERA ANTHONY DELA</creatorcontrib><creatorcontrib>SHIN HYUNGJOO</creatorcontrib><creatorcontrib>HOLLAND JOHN PATRICK</creatorcontrib><creatorcontrib>CHEN ZHIGANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARAKHTANOV ALEXEI</au><au>MANKIDY PRATIK JACOB</au><au>KIM HALEY</au><au>LLERA ANTHONY DELA</au><au>SHIN HYUNGJOO</au><au>HOLLAND JOHN PATRICK</au><au>CHEN ZHIGANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING</title><date>2019-08-14</date><risdate>2019</risdate><abstract>An upper electrode for use in a substrate processing system includes a lower surface. The lower surface includes first and second portions, and is plasma-facing. The first portion includes a first surface region having a first thickness. The second portion includes a second surface region having a varying thickness such that the second portion transitions from a second thickness to the first thickness.
기판 프로세싱 시스템에서 사용하기 위한 상부 전극은 하부 표면을 포함한다. 하부 표면은 제 1 부분 및 제 2 부분을 포함하고, 플라즈마-대면이다. 제 1 부분은 제 1 두께를 갖는 제 1 표면 영역을 포함한다. 제 2 부분이 제 2 두께로부터 제 1 두께로 변환하도록 (transition) 제 2 부분은 가변하는 두께를 갖는 제 2 표면을 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING |
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