POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDING INCULDING THE SAME

A polyoxymethylene resin composition according to an embodiment of the present invention comprises 5 to 30 wt% of a filler, 0.01 to 1 wt% by of a formaldehyde reducing agent, and a polyoxymethylene resin as the remainder, wherein the polyoxymethylene resin comprises 30 to 40 μmol of terminal formate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHA, SOON YOUNG, JEONG, KIE YOUN, KIM, HYEON CHEOL, SONG, JOON YONG, BAE, SHIN TAE, CHAE, HONG WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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