APPARATUS FOR CUTTING SUBSTRATE
An apparatus for cutting substrate according to an embodiment of the present invention comprises a scribing unit that forms a scribing line on a substrate; a dummy removing unit including a pair of clamp members for holding a dummy portion so as to divide the dummy portion from the substrate along t...
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| creator | KIM HAK SUNG JO JIN WAN AN WOO YOUNG YANG SUNG SOO JUNG HA JIN JEONG JAE SEOK YU JEA CHUN |
| description | An apparatus for cutting substrate according to an embodiment of the present invention comprises a scribing unit that forms a scribing line on a substrate; a dummy removing unit including a pair of clamp members for holding a dummy portion so as to divide the dummy portion from the substrate along the scribing line formed in the dummy portion of the substrate by the scribing unit; an interval measuring unit for measuring the interval between the pair of clamp members; and a controlling unit that adjusts the pressing force of a pair of clamp members based on a gap between the pair of clamp members measured by the interval measuring unit.
본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 라인을 형성하는 스크라이빙 유닛; 스크라이빙 유닛에 의해 기판의 더미 부분에 형성된 스크라이빙 라인을 따라 더미 부분을 기판으로부터 분할하도록, 더미 부분을 파지하는 한 쌍의 클램프 부재를 포함하는 더미 제거 유닛; 한 쌍의 클램프 부재 사이의 간격을 측정하는 간격 측정 유닛; 및 간격 측정 유닛에 의해 측정된 한 쌍의 클램프 부재 사이의 간격을 기준으로 한 쌍의 클램프 부재의 가압력을 조절하는 제어 유닛을 포함할 수 있다. |
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본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 라인을 형성하는 스크라이빙 유닛; 스크라이빙 유닛에 의해 기판의 더미 부분에 형성된 스크라이빙 라인을 따라 더미 부분을 기판으로부터 분할하도록, 더미 부분을 파지하는 한 쌍의 클램프 부재를 포함하는 더미 제거 유닛; 한 쌍의 클램프 부재 사이의 간격을 측정하는 간격 측정 유닛; 및 간격 측정 유닛에 의해 측정된 한 쌍의 클램프 부재 사이의 간격을 기준으로 한 쌍의 클램프 부재의 가압력을 조절하는 제어 유닛을 포함할 수 있다.</description><language>eng ; kor</language><subject>CHEMISTRY ; GLASS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METALLURGY ; MINERAL OR SLAG WOOL</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190531&DB=EPODOC&CC=KR&NR=20190059573A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190531&DB=EPODOC&CC=KR&NR=20190059573A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM HAK SUNG</creatorcontrib><creatorcontrib>JO JIN WAN</creatorcontrib><creatorcontrib>AN WOO YOUNG</creatorcontrib><creatorcontrib>YANG SUNG SOO</creatorcontrib><creatorcontrib>JUNG HA JIN</creatorcontrib><creatorcontrib>JEONG JAE SEOK</creatorcontrib><creatorcontrib>YU JEA CHUN</creatorcontrib><title>APPARATUS FOR CUTTING SUBSTRATE</title><description>An apparatus for cutting substrate according to an embodiment of the present invention comprises a scribing unit that forms a scribing line on a substrate; a dummy removing unit including a pair of clamp members for holding a dummy portion so as to divide the dummy portion from the substrate along the scribing line formed in the dummy portion of the substrate by the scribing unit; an interval measuring unit for measuring the interval between the pair of clamp members; and a controlling unit that adjusts the pressing force of a pair of clamp members based on a gap between the pair of clamp members measured by the interval measuring unit.
본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 라인을 형성하는 스크라이빙 유닛; 스크라이빙 유닛에 의해 기판의 더미 부분에 형성된 스크라이빙 라인을 따라 더미 부분을 기판으로부터 분할하도록, 더미 부분을 파지하는 한 쌍의 클램프 부재를 포함하는 더미 제거 유닛; 한 쌍의 클램프 부재 사이의 간격을 측정하는 간격 측정 유닛; 및 간격 측정 유닛에 의해 측정된 한 쌍의 클램프 부재 사이의 간격을 기준으로 한 쌍의 클램프 부재의 가압력을 조절하는 제어 유닛을 포함할 수 있다.</description><subject>CHEMISTRY</subject><subject>GLASS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB3DAhwDHIMCQ1WcPMPUnAODQnx9HNXCA51Cg4BCrvyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yAjA0NLAwNTS1NzY0dj4lQBAHKEIsc</recordid><startdate>20190531</startdate><enddate>20190531</enddate><creator>KIM HAK SUNG</creator><creator>JO JIN WAN</creator><creator>AN WOO YOUNG</creator><creator>YANG SUNG SOO</creator><creator>JUNG HA JIN</creator><creator>JEONG JAE SEOK</creator><creator>YU JEA CHUN</creator><scope>EVB</scope></search><sort><creationdate>20190531</creationdate><title>APPARATUS FOR CUTTING SUBSTRATE</title><author>KIM HAK SUNG ; JO JIN WAN ; AN WOO YOUNG ; YANG SUNG SOO ; JUNG HA JIN ; JEONG JAE SEOK ; YU JEA CHUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190059573A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>CHEMISTRY</topic><topic>GLASS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM HAK SUNG</creatorcontrib><creatorcontrib>JO JIN WAN</creatorcontrib><creatorcontrib>AN WOO YOUNG</creatorcontrib><creatorcontrib>YANG SUNG SOO</creatorcontrib><creatorcontrib>JUNG HA JIN</creatorcontrib><creatorcontrib>JEONG JAE SEOK</creatorcontrib><creatorcontrib>YU JEA CHUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM HAK SUNG</au><au>JO JIN WAN</au><au>AN WOO YOUNG</au><au>YANG SUNG SOO</au><au>JUNG HA JIN</au><au>JEONG JAE SEOK</au><au>YU JEA CHUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR CUTTING SUBSTRATE</title><date>2019-05-31</date><risdate>2019</risdate><abstract>An apparatus for cutting substrate according to an embodiment of the present invention comprises a scribing unit that forms a scribing line on a substrate; a dummy removing unit including a pair of clamp members for holding a dummy portion so as to divide the dummy portion from the substrate along the scribing line formed in the dummy portion of the substrate by the scribing unit; an interval measuring unit for measuring the interval between the pair of clamp members; and a controlling unit that adjusts the pressing force of a pair of clamp members based on a gap between the pair of clamp members measured by the interval measuring unit.
본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 라인을 형성하는 스크라이빙 유닛; 스크라이빙 유닛에 의해 기판의 더미 부분에 형성된 스크라이빙 라인을 따라 더미 부분을 기판으로부터 분할하도록, 더미 부분을 파지하는 한 쌍의 클램프 부재를 포함하는 더미 제거 유닛; 한 쌍의 클램프 부재 사이의 간격을 측정하는 간격 측정 유닛; 및 간격 측정 유닛에 의해 측정된 한 쌍의 클램프 부재 사이의 간격을 기준으로 한 쌍의 클램프 부재의 가압력을 조절하는 제어 유닛을 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL |
| title | APPARATUS FOR CUTTING SUBSTRATE |
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