DEVICE FOR PICKING UP SEMICONDUCTOR CHIP DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP
An objective of the present invention is to stably separate a semiconductor chip from an adhesive sheet. According to the present invention, the pick-up apparatus for a semiconductor chip picks up a semiconductor chip (t) bonded and held in an adhesive sheet (11) from the adhesive sheet (11). The pi...
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| creator | SHIGA KOICHI KONISHI NOBUAKI |
| description | An objective of the present invention is to stably separate a semiconductor chip from an adhesive sheet. According to the present invention, the pick-up apparatus for a semiconductor chip picks up a semiconductor chip (t) bonded and held in an adhesive sheet (11) from the adhesive sheet (11). The pick-up apparatus comprises: a pick-up mechanism (40) to pick up the semiconductor chip (t) from the adhesive sheet (11); a push-up mechanism (60) including a plurality of push-up bodies (62a to 62d) equally disposed on a shaft core and movably installed in a shaft core direction, applying negative pressure to a portion where the semiconductor chip (t) picked from the adhesive sheet (11) in a direction opposite to the semiconductor chip (t), and pushing up the semiconductor chip (t) by the plurality of push-up bodies (62a to 62d) when the semiconductor chip (t) is picked up by the pick-up mechanism; and a negative pressure adjustment mechanism (63b) to set the magnitude of the negative press to -85 KPa or less as a gauge pressure.
본 발명은 반도체 칩을 점착 시트로부터 안정적으로 박리하는 것을 목적으로 한다. 점착 시트(11)에 접착 유지된 반도체 칩(t)을 점착 시트(11)로부터 픽업하는 반도체 칩의 픽업 장치로서, 점착 시트(11)로부터 반도체 칩(t)을 픽업하는 픽업 기구(40)와, 축심을 동일하게 하여 배치되고 서로 축심 방향으로 이동 가능하게 설치된 복수의 밀어올림체(62a∼62d)를 가지며, 점착 시트(11)에서 픽업되는 반도체 칩(t)이 위치하는 부분에, 반도체 칩(t)과는 반대측으로부터 부압을 작용시키고, 이 반도체 칩(t)이 픽업 기구에 의해 픽업될 때에, 이 반도체 칩(t)을 복수의 밀어올림체(62a∼62d)에 의해 들어올리는 들어올림 기구(60)와, 부압의 크기를 게이지압으로 -85 ㎪ 이하로 설정하는 부압 조정 기구(63b)를 구비한다. |
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본 발명은 반도체 칩을 점착 시트로부터 안정적으로 박리하는 것을 목적으로 한다. 점착 시트(11)에 접착 유지된 반도체 칩(t)을 점착 시트(11)로부터 픽업하는 반도체 칩의 픽업 장치로서, 점착 시트(11)로부터 반도체 칩(t)을 픽업하는 픽업 기구(40)와, 축심을 동일하게 하여 배치되고 서로 축심 방향으로 이동 가능하게 설치된 복수의 밀어올림체(62a∼62d)를 가지며, 점착 시트(11)에서 픽업되는 반도체 칩(t)이 위치하는 부분에, 반도체 칩(t)과는 반대측으로부터 부압을 작용시키고, 이 반도체 칩(t)이 픽업 기구에 의해 픽업될 때에, 이 반도체 칩(t)을 복수의 밀어올림체(62a∼62d)에 의해 들어올리는 들어올림 기구(60)와, 부압의 크기를 게이지압으로 -85 ㎪ 이하로 설정하는 부압 조정 기구(63b)를 구비한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190208&DB=EPODOC&CC=KR&NR=20190012112A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25546,76297</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190208&DB=EPODOC&CC=KR&NR=20190012112A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIGA KOICHI</creatorcontrib><creatorcontrib>KONISHI NOBUAKI</creatorcontrib><title>DEVICE FOR PICKING UP SEMICONDUCTOR CHIP DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP</title><description>An objective of the present invention is to stably separate a semiconductor chip from an adhesive sheet. According to the present invention, the pick-up apparatus for a semiconductor chip picks up a semiconductor chip (t) bonded and held in an adhesive sheet (11) from the adhesive sheet (11). The pick-up apparatus comprises: a pick-up mechanism (40) to pick up the semiconductor chip (t) from the adhesive sheet (11); a push-up mechanism (60) including a plurality of push-up bodies (62a to 62d) equally disposed on a shaft core and movably installed in a shaft core direction, applying negative pressure to a portion where the semiconductor chip (t) picked from the adhesive sheet (11) in a direction opposite to the semiconductor chip (t), and pushing up the semiconductor chip (t) by the plurality of push-up bodies (62a to 62d) when the semiconductor chip (t) is picked up by the pick-up mechanism; and a negative pressure adjustment mechanism (63b) to set the magnitude of the negative press to -85 KPa or less as a gauge pressure.
본 발명은 반도체 칩을 점착 시트로부터 안정적으로 박리하는 것을 목적으로 한다. 점착 시트(11)에 접착 유지된 반도체 칩(t)을 점착 시트(11)로부터 픽업하는 반도체 칩의 픽업 장치로서, 점착 시트(11)로부터 반도체 칩(t)을 픽업하는 픽업 기구(40)와, 축심을 동일하게 하여 배치되고 서로 축심 방향으로 이동 가능하게 설치된 복수의 밀어올림체(62a∼62d)를 가지며, 점착 시트(11)에서 픽업되는 반도체 칩(t)이 위치하는 부분에, 반도체 칩(t)과는 반대측으로부터 부압을 작용시키고, 이 반도체 칩(t)이 픽업 기구에 의해 픽업될 때에, 이 반도체 칩(t)을 복수의 밀어올림체(62a∼62d)에 의해 들어올리는 들어올림 기구(60)와, 부압의 크기를 게이지압으로 -85 ㎪ 이하로 설정하는 부압 조정 기구(63b)를 구비한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhycQ3zdHZVcPMPUgjwdPb29HNXCA1QCHb19XT293MJdQ4BSjh7eAYoQBU6-rko-LqGePi7gPX4-of6hYA0YergYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBoaWBgaGRoaGRo7GxKkCAPo8MmY</recordid><startdate>20190208</startdate><enddate>20190208</enddate><creator>SHIGA KOICHI</creator><creator>KONISHI NOBUAKI</creator><scope>EVB</scope></search><sort><creationdate>20190208</creationdate><title>DEVICE FOR PICKING UP SEMICONDUCTOR CHIP DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP</title><author>SHIGA KOICHI ; KONISHI NOBUAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190012112A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIGA KOICHI</creatorcontrib><creatorcontrib>KONISHI NOBUAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIGA KOICHI</au><au>KONISHI NOBUAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE FOR PICKING UP SEMICONDUCTOR CHIP DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP</title><date>2019-02-08</date><risdate>2019</risdate><abstract>An objective of the present invention is to stably separate a semiconductor chip from an adhesive sheet. According to the present invention, the pick-up apparatus for a semiconductor chip picks up a semiconductor chip (t) bonded and held in an adhesive sheet (11) from the adhesive sheet (11). The pick-up apparatus comprises: a pick-up mechanism (40) to pick up the semiconductor chip (t) from the adhesive sheet (11); a push-up mechanism (60) including a plurality of push-up bodies (62a to 62d) equally disposed on a shaft core and movably installed in a shaft core direction, applying negative pressure to a portion where the semiconductor chip (t) picked from the adhesive sheet (11) in a direction opposite to the semiconductor chip (t), and pushing up the semiconductor chip (t) by the plurality of push-up bodies (62a to 62d) when the semiconductor chip (t) is picked up by the pick-up mechanism; and a negative pressure adjustment mechanism (63b) to set the magnitude of the negative press to -85 KPa or less as a gauge pressure.
본 발명은 반도체 칩을 점착 시트로부터 안정적으로 박리하는 것을 목적으로 한다. 점착 시트(11)에 접착 유지된 반도체 칩(t)을 점착 시트(11)로부터 픽업하는 반도체 칩의 픽업 장치로서, 점착 시트(11)로부터 반도체 칩(t)을 픽업하는 픽업 기구(40)와, 축심을 동일하게 하여 배치되고 서로 축심 방향으로 이동 가능하게 설치된 복수의 밀어올림체(62a∼62d)를 가지며, 점착 시트(11)에서 픽업되는 반도체 칩(t)이 위치하는 부분에, 반도체 칩(t)과는 반대측으로부터 부압을 작용시키고, 이 반도체 칩(t)이 픽업 기구에 의해 픽업될 때에, 이 반도체 칩(t)을 복수의 밀어올림체(62a∼62d)에 의해 들어올리는 들어올림 기구(60)와, 부압의 크기를 게이지압으로 -85 ㎪ 이하로 설정하는 부압 조정 기구(63b)를 구비한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DEVICE FOR PICKING UP SEMICONDUCTOR CHIP DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP |
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