PRINTED CIRCUIT BOARD

Disclosed is a printed circuit board. The printed circuit board according to an aspect of the present invention includes an insulating layer, a via hole formed in the insulating layer, an electroless plating layer formed on an inner wall of the via hole and extending onto one surface of the insulati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, HYE LEE, LEE, JIN UK, OH, HAE SUNG, KIM, AE RIM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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