HOLDING MEMBER METHOD OF MANUFACTURING HOLDING MEMBER HOLDING APPARATUS CONVEYING APPARATUS AND MANUFACTURING APPARATUS OF ELECTRONIC COMPONENT
The present invention relates to a holding member which reduces a manufacturing price of the holding member and shortens time for manufacturing the holding member. The holding member (1) is a holding member adsorbing a plurality of holding target objects (5) and holding, which includes: a plate memb...
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Sprache: | eng ; kor |
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Zusammenfassung: | The present invention relates to a holding member which reduces a manufacturing price of the holding member and shortens time for manufacturing the holding member. The holding member (1) is a holding member adsorbing a plurality of holding target objects (5) and holding, which includes: a plate member (2) having an adsorption hole (10) respectively responding to the holding target object (5); a resin sheet (3) arranged on the plate member (2). The resin sheet (3) is plurally arranged respectively on responding location of a forming area and a non-forming area of the adsorption hole (10) of the plate member (2) and has a small hole (11) smaller than the adsorption hole (10).
보유 지지 부재의 제조 비용을 저감하고, 또한 보유 지지 부재를 제조하는 시간을 단축한다. 보유 지지 부재(1)는, 복수의 보유 지지 대상물(5)을 흡착하여 보유 지지하는 보유 지지 부재이며, 보유 지지 대상물(5)의 각각에 대응하는 흡착 구멍(10)이 형성된 판상 부재(2)와, 판상 부재(2) 상에 배치된 수지 시트(3)를 구비하고, 수지 시트(3)는, 판상 부재(2)의 흡착 구멍(10)의 형성 영역 및 비형성 영역의 각각에 대응하는 위치에 복수 배치되고, 흡착 구멍(10)보다도 작은 소 구멍(11)이 형성되어 있다. |
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