MANUFACTURING METHOD OF CONTACT APPARATUS AND CONTACT APPARATUS

MANUFACTURING METHOD OF CONTACT APPARATUS AND CONTACT APPARATUS

The present invention relates to a method of manufacturing a contact apparatus, and more particularly, to a method of manufacturing a contact apparatus which can have a contact structure with a fine pitch. The method of manufacturing the contact apparatus includes the following steps: forming a sacr...

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Hauptverfasser: NA, JI WON, IY, HYUN GUEN
Format: Patent
Sprache:eng ; kor
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NA, JI WON
IY, HYUN GUEN
description The present invention relates to a method of manufacturing a contact apparatus, and more particularly, to a method of manufacturing a contact apparatus which can have a contact structure with a fine pitch. The method of manufacturing the contact apparatus includes the following steps: forming a sacrificial layer on a growth substrate; forming a contact holder having a predetermined thickness on the sacrificial layer; forming a plurality of contact structures on the contact holder; removing the sacrificial layer to separate a coupling structure, which includes the contact holder and the contact structure, from the growth substrate; injecting a liquid insulating material between the contact structures such that the insulating material surrounds a gap between the contact structures; curing the insulating material; and separating the contact holder from the contact structure. 본 발명은 컨택트 장치 제조 방법에 관한 것으로서, 보다 상세하게는, 미세 피치를 갖는 컨택트 구조물을 갖는 컨택트 장치 제조 방법에 관한 것이다.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MANUFACTURING METHOD OF CONTACT APPARATUS AND CONTACT APPARATUS
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