동장 적층판 및 그 제조 방법
본 발명은 가시광 및 자외광에 대해 높은 반사율을 가지며, 자외광 내성이나 내열성이 우수한 동장 적층판을 제공한다. 본 발명에서는, 동장 적층판을, 구리층, 백색층, 접착층 및 열전도율이 200W/m·K 이상인 고열전도 기판을 이 순서로 가지며, 백색층을 자외광 내성이 높은 오르가노폴리실록산의 매트릭스 중에 자외광 반사율이 높은 BN, ZrO, SiO, CaF, 다이아몬드 중 어느 하나의 필러를 갖는 조성으로 하고, 백색층과 고열전도 기판을 열경화성 수지로 접합한 구조로 하였다. The present invention provide...
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| creator | OOGAMI HIROYUKI ORITA TAKAHIRO UENO YASUTSUGU FURUKAWA KOUTARO IWAISAKO YASUSHI |
| description | 본 발명은 가시광 및 자외광에 대해 높은 반사율을 가지며, 자외광 내성이나 내열성이 우수한 동장 적층판을 제공한다. 본 발명에서는, 동장 적층판을, 구리층, 백색층, 접착층 및 열전도율이 200W/m·K 이상인 고열전도 기판을 이 순서로 가지며, 백색층을 자외광 내성이 높은 오르가노폴리실록산의 매트릭스 중에 자외광 반사율이 높은 BN, ZrO, SiO, CaF, 다이아몬드 중 어느 하나의 필러를 갖는 조성으로 하고, 백색층과 고열전도 기판을 열경화성 수지로 접합한 구조로 하였다.
The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m·K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin. |
| format | Patent |
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The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m·K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin.</description><language>kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181127&DB=EPODOC&CC=KR&NR=20180126458A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181127&DB=EPODOC&CC=KR&NR=20180126458A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OOGAMI HIROYUKI</creatorcontrib><creatorcontrib>ORITA TAKAHIRO</creatorcontrib><creatorcontrib>UENO YASUTSUGU</creatorcontrib><creatorcontrib>FURUKAWA KOUTARO</creatorcontrib><creatorcontrib>IWAISAKO YASUSHI</creatorcontrib><title>동장 적층판 및 그 제조 방법</title><description>본 발명은 가시광 및 자외광에 대해 높은 반사율을 가지며, 자외광 내성이나 내열성이 우수한 동장 적층판을 제공한다. 본 발명에서는, 동장 적층판을, 구리층, 백색층, 접착층 및 열전도율이 200W/m·K 이상인 고열전도 기판을 이 순서로 가지며, 백색층을 자외광 내성이 높은 오르가노폴리실록산의 매트릭스 중에 자외광 반사율이 높은 BN, ZrO, SiO, CaF, 다이아몬드 중 어느 하나의 필러를 갖는 조성으로 하고, 백색층과 고열전도 기판을 열경화성 수지로 접합한 구조로 하였다.
The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m·K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB73T_zzbylCm8WNL7ZsfVtzwSF1xv6FV5t3wEUmfNm4QYgd-XrTVN5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgaGFgaGRmYmphaMxcaoAf9wyog</recordid><startdate>20181127</startdate><enddate>20181127</enddate><creator>OOGAMI HIROYUKI</creator><creator>ORITA TAKAHIRO</creator><creator>UENO YASUTSUGU</creator><creator>FURUKAWA KOUTARO</creator><creator>IWAISAKO YASUSHI</creator><scope>EVB</scope></search><sort><creationdate>20181127</creationdate><title>동장 적층판 및 그 제조 방법</title><author>OOGAMI HIROYUKI ; ORITA TAKAHIRO ; UENO YASUTSUGU ; FURUKAWA KOUTARO ; IWAISAKO YASUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180126458A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OOGAMI HIROYUKI</creatorcontrib><creatorcontrib>ORITA TAKAHIRO</creatorcontrib><creatorcontrib>UENO YASUTSUGU</creatorcontrib><creatorcontrib>FURUKAWA KOUTARO</creatorcontrib><creatorcontrib>IWAISAKO YASUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OOGAMI HIROYUKI</au><au>ORITA TAKAHIRO</au><au>UENO YASUTSUGU</au><au>FURUKAWA KOUTARO</au><au>IWAISAKO YASUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>동장 적층판 및 그 제조 방법</title><date>2018-11-27</date><risdate>2018</risdate><abstract>본 발명은 가시광 및 자외광에 대해 높은 반사율을 가지며, 자외광 내성이나 내열성이 우수한 동장 적층판을 제공한다. 본 발명에서는, 동장 적층판을, 구리층, 백색층, 접착층 및 열전도율이 200W/m·K 이상인 고열전도 기판을 이 순서로 가지며, 백색층을 자외광 내성이 높은 오르가노폴리실록산의 매트릭스 중에 자외광 반사율이 높은 BN, ZrO, SiO, CaF, 다이아몬드 중 어느 하나의 필러를 갖는 조성으로 하고, 백색층과 고열전도 기판을 열경화성 수지로 접합한 구조로 하였다.
The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m·K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | 동장 적층판 및 그 제조 방법 |
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