COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING FILM

The present invention provides a technology, obtaining a copper electrolytic plating film with excellent physical properties such as strength and hardness even after high-temperature heating treatment at about 200°C or higher to significantly restrain co-deposition of sulfur in a copper electrolytic...

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Bibliographische Detailangaben
Hauptverfasser:	IKUMOTO RAIHEI, KATO KAZUNARI, OMURA NAOYUKI, ITAKURA YUKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a technology, obtaining a copper electrolytic plating film with excellent physical properties such as strength and hardness even after high-temperature heating treatment at about 200°C or higher to significantly restrain co-deposition of sulfur in a copper electrolytic plating containing silver ions as an alloy component. The present invention relates to the copper electrolytic plating bath, comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises the silver ions as the alloy component, and methionine or a derivative of the methionine is contained as the complexing agent. (과제) 합금 성분으로서 은 이온을 포함하는 전기 구리 도금에 있어서의 황의 공석을 대폭 억제할 수 있어, 약 200 ℃ 이상의 고온 가열 처리 후에도 강도, 경도 등의 물성이 우수한 전기 구리 도금 피막이 얻어지는 기술을 제공한다. (해결 수단) 구리 이온, 산, 염화물 이온, 및 착화제를 포함하는 전기 구리 도금욕으로서, 합금 성분으로서 은 이온을 추가로 포함하고, 또한, 착화제로서 메티오닌 또는 그 유도체를 함유하는 것을 특징으로 하는 전기 구리 도금욕이다.