POLISHING PAD AND PREPARATION METHOD THEREOF
The present invention relates to a method for manufacturing a polishing pad, and a polishing pad manufactured thereby, wherein the polishing pad can prevent not only a reduction in optical permeability but also delamination between layers. Moreover, the polishing pad comprises: a polishing layer hav...
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| creator | SEO, JANG WON YUN, SUNG HOON KWON, TAE KYOUNG RYOU, JOON SUNG |
| description | The present invention relates to a method for manufacturing a polishing pad, and a polishing pad manufactured thereby, wherein the polishing pad can prevent not only a reduction in optical permeability but also delamination between layers. Moreover, the polishing pad comprises: a polishing layer having a first through hole; a support layer having a second through hole; an adhesion layer having a third through hole and disposed between the polishing layer and the support layer; and a window inserted into the first through hole.
실시예는 제1관통홀이 형성된 연마층; 제2관통홀이 형성된 지지층; 제3관통홀이 형성되고 상기 연마층과 상기 지지층 사이에 개재된 접착층; 및 상기 제1관통홀 내에 삽입된 윈도우;를 포함하는 연마패드의 제조방법이 개시된다. |
| format | Patent |
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실시예는 제1관통홀이 형성된 연마층; 제2관통홀이 형성된 지지층; 제3관통홀이 형성되고 상기 연마층과 상기 지지층 사이에 개재된 접착층; 및 상기 제1관통홀 내에 삽입된 윈도우;를 포함하는 연마패드의 제조방법이 개시된다.</description><language>eng ; kor</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180801&DB=EPODOC&CC=KR&NR=20180086671A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180801&DB=EPODOC&CC=KR&NR=20180086671A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEO, JANG WON</creatorcontrib><creatorcontrib>YUN, SUNG HOON</creatorcontrib><creatorcontrib>KWON, TAE KYOUNG</creatorcontrib><creatorcontrib>RYOU, JOON SUNG</creatorcontrib><title>POLISHING PAD AND PREPARATION METHOD THEREOF</title><description>The present invention relates to a method for manufacturing a polishing pad, and a polishing pad manufactured thereby, wherein the polishing pad can prevent not only a reduction in optical permeability but also delamination between layers. Moreover, the polishing pad comprises: a polishing layer having a first through hole; a support layer having a second through hole; an adhesion layer having a third through hole and disposed between the polishing layer and the support layer; and a window inserted into the first through hole.
실시예는 제1관통홀이 형성된 연마층; 제2관통홀이 형성된 지지층; 제3관통홀이 형성되고 상기 연마층과 상기 지지층 사이에 개재된 접착층; 및 상기 제1관통홀 내에 삽입된 윈도우;를 포함하는 연마패드의 제조방법이 개시된다.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJ8PfxDPbw9HNXCHB0UXD0c1EICHINcAxyDPH091PwdQ3x8HdRCPFwDXL1d-NhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGhhYGBhZmZuaGjsbEqQIAJH8mBQ</recordid><startdate>20180801</startdate><enddate>20180801</enddate><creator>SEO, JANG WON</creator><creator>YUN, SUNG HOON</creator><creator>KWON, TAE KYOUNG</creator><creator>RYOU, JOON SUNG</creator><scope>EVB</scope></search><sort><creationdate>20180801</creationdate><title>POLISHING PAD AND PREPARATION METHOD THEREOF</title><author>SEO, JANG WON ; YUN, SUNG HOON ; KWON, TAE KYOUNG ; RYOU, JOON SUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180086671A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2018</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SEO, JANG WON</creatorcontrib><creatorcontrib>YUN, SUNG HOON</creatorcontrib><creatorcontrib>KWON, TAE KYOUNG</creatorcontrib><creatorcontrib>RYOU, JOON SUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEO, JANG WON</au><au>YUN, SUNG HOON</au><au>KWON, TAE KYOUNG</au><au>RYOU, JOON SUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD AND PREPARATION METHOD THEREOF</title><date>2018-08-01</date><risdate>2018</risdate><abstract>The present invention relates to a method for manufacturing a polishing pad, and a polishing pad manufactured thereby, wherein the polishing pad can prevent not only a reduction in optical permeability but also delamination between layers. Moreover, the polishing pad comprises: a polishing layer having a first through hole; a support layer having a second through hole; an adhesion layer having a third through hole and disposed between the polishing layer and the support layer; and a window inserted into the first through hole.
실시예는 제1관통홀이 형성된 연마층; 제2관통홀이 형성된 지지층; 제3관통홀이 형성되고 상기 연마층과 상기 지지층 사이에 개재된 접착층; 및 상기 제1관통홀 내에 삽입된 윈도우;를 포함하는 연마패드의 제조방법이 개시된다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | POLISHING PAD AND PREPARATION METHOD THEREOF |
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