접착제 조성물 및 구조체
라디칼 중합 가능한 관능기를 갖는 제1 실란 화합물과, 상기 제1 실란 화합물과 반응하는 제2 실란 화합물과, 라디칼 중합성 화합물(상기 제1 실란 화합물에 해당하는 화합물을 제외함)과, 1분간 반감기 온도가 120℃ 이하인 과산화물을 함유하는, 접착제 조성물. This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with t...
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| creator | MORIJIRI TOMOKI TAKETATSU JUN TATSUZAWA TAKASHI KUDOU SUNAO TANAKA MASARU |
| description | 라디칼 중합 가능한 관능기를 갖는 제1 실란 화합물과, 상기 제1 실란 화합물과 반응하는 제2 실란 화합물과, 라디칼 중합성 화합물(상기 제1 실란 화합물에 해당하는 화합물을 제외함)과, 1분간 반감기 온도가 120℃ 이하인 과산화물을 함유하는, 접착제 조성물.
This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with the first silane compound; a radical-polymerizable compound (except for compounds classified as said first silane compound); and a peroxide having a one-minute half-life temperature of 120°C or lower. |
| format | Patent |
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This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with the first silane compound; a radical-polymerizable compound (except for compounds classified as said first silane compound); and a peroxide having a one-minute half-life temperature of 120°C or lower.</description><language>kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180710&DB=EPODOC&CC=KR&NR=20180079370A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180710&DB=EPODOC&CC=KR&NR=20180079370A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORIJIRI TOMOKI</creatorcontrib><creatorcontrib>TAKETATSU JUN</creatorcontrib><creatorcontrib>TATSUZAWA TAKASHI</creatorcontrib><creatorcontrib>KUDOU SUNAO</creatorcontrib><creatorcontrib>TANAKA MASARU</creatorcontrib><title>접착제 조성물 및 구조체</title><description>라디칼 중합 가능한 관능기를 갖는 제1 실란 화합물과, 상기 제1 실란 화합물과 반응하는 제2 실란 화합물과, 라디칼 중합성 화합물(상기 제1 실란 화합물에 해당하는 화합물을 제외함)과, 1분간 반감기 온도가 120℃ 이하인 과산화물을 함유하는, 접착제 조성물.
This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with the first silane compound; a radical-polymerizable compound (except for compounds classified as said first silane compound); and a peroxide having a one-minute half-life temperature of 120°C or lower.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB8s2Dimw0r3yyYo_Bm4YY3LRtfr9mj8HpDv8KrrWtAApu28DCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwNDCwMDc0tjcwNHY-JUAQBdwzCN</recordid><startdate>20180710</startdate><enddate>20180710</enddate><creator>MORIJIRI TOMOKI</creator><creator>TAKETATSU JUN</creator><creator>TATSUZAWA TAKASHI</creator><creator>KUDOU SUNAO</creator><creator>TANAKA MASARU</creator><scope>EVB</scope></search><sort><creationdate>20180710</creationdate><title>접착제 조성물 및 구조체</title><author>MORIJIRI TOMOKI ; TAKETATSU JUN ; TATSUZAWA TAKASHI ; KUDOU SUNAO ; TANAKA MASARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180079370A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2018</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>MORIJIRI TOMOKI</creatorcontrib><creatorcontrib>TAKETATSU JUN</creatorcontrib><creatorcontrib>TATSUZAWA TAKASHI</creatorcontrib><creatorcontrib>KUDOU SUNAO</creatorcontrib><creatorcontrib>TANAKA MASARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORIJIRI TOMOKI</au><au>TAKETATSU JUN</au><au>TATSUZAWA TAKASHI</au><au>KUDOU SUNAO</au><au>TANAKA MASARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>접착제 조성물 및 구조체</title><date>2018-07-10</date><risdate>2018</risdate><abstract>라디칼 중합 가능한 관능기를 갖는 제1 실란 화합물과, 상기 제1 실란 화합물과 반응하는 제2 실란 화합물과, 라디칼 중합성 화합물(상기 제1 실란 화합물에 해당하는 화합물을 제외함)과, 1분간 반감기 온도가 120℃ 이하인 과산화물을 함유하는, 접착제 조성물.
This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with the first silane compound; a radical-polymerizable compound (except for compounds classified as said first silane compound); and a peroxide having a one-minute half-life temperature of 120°C or lower.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | 접착제 조성물 및 구조체 |
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