MANUFACTURING METHOD OF PCB AND SEMICONDUCTOR PACKAGE USING TRANSPARENT CARRIER
The present invention relates to a method of manufacturing a PCB and a semiconductor package using a transparent carrier. The present invention relates to a method of manufacturing a semiconductor package includes forming a printed circuit board and a printed circuit by using a transparent carrier m...
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| creator | CHOI, JAE GYU |
| description | The present invention relates to a method of manufacturing a PCB and a semiconductor package using a transparent carrier. The present invention relates to a method of manufacturing a semiconductor package includes forming a printed circuit board and a printed circuit by using a transparent carrier made of various transparent materials such as polymer such as PET, PEN, transparent PI, and transparent acrylic having no electrical conductivity, inorganic materials such as glass and sapphire, and organic materials, mounting a semiconductor, and separating a transparent carrier. It is possible to perform mass production.
본 발명은 투명 캐리어를 이용한 인쇄회로기판과 반도체 패키지의 제조방법에 관한 것으로, 전기전도성이 없는 PET, PEN, 투명 PI, 투명 아크릴 등의 폴리머(Polymer)계, Glass, 사파이어 등의 무기(Inorganic)계, 유기계 등 다양한 형태의 투명 소재로 이루어지는 투명 캐리어를 이용해 인쇄회로기판과, 인쇄회로를 형성하고 반도체를 실장한 후 투명 캐리어를 분리하여 제조되는 반도체 패키지를 제조하는 방법을 제공한다. |
| format | Patent |
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본 발명은 투명 캐리어를 이용한 인쇄회로기판과 반도체 패키지의 제조방법에 관한 것으로, 전기전도성이 없는 PET, PEN, 투명 PI, 투명 아크릴 등의 폴리머(Polymer)계, Glass, 사파이어 등의 무기(Inorganic)계, 유기계 등 다양한 형태의 투명 소재로 이루어지는 투명 캐리어를 이용해 인쇄회로기판과, 인쇄회로를 형성하고 반도체를 실장한 후 투명 캐리어를 분리하여 제조되는 반도체 패키지를 제조하는 방법을 제공한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180706&DB=EPODOC&CC=KR&NR=20180077115A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180706&DB=EPODOC&CC=KR&NR=20180077115A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI, JAE GYU</creatorcontrib><title>MANUFACTURING METHOD OF PCB AND SEMICONDUCTOR PACKAGE USING TRANSPARENT CARRIER</title><description>The present invention relates to a method of manufacturing a PCB and a semiconductor package using a transparent carrier. The present invention relates to a method of manufacturing a semiconductor package includes forming a printed circuit board and a printed circuit by using a transparent carrier made of various transparent materials such as polymer such as PET, PEN, transparent PI, and transparent acrylic having no electrical conductivity, inorganic materials such as glass and sapphire, and organic materials, mounting a semiconductor, and separating a transparent carrier. It is possible to perform mass production.
본 발명은 투명 캐리어를 이용한 인쇄회로기판과 반도체 패키지의 제조방법에 관한 것으로, 전기전도성이 없는 PET, PEN, 투명 PI, 투명 아크릴 등의 폴리머(Polymer)계, Glass, 사파이어 등의 무기(Inorganic)계, 유기계 등 다양한 형태의 투명 소재로 이루어지는 투명 캐리어를 이용해 인쇄회로기판과, 인쇄회로를 형성하고 반도체를 실장한 후 투명 캐리어를 분리하여 제조되는 반도체 패키지를 제조하는 방법을 제공한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAQAOAuDqK-w4GzkChS1_OStKHkh0sylyJxEi3U90cEH8DpW751Exz6YpByYes7cDr3QUEwEOkK6BUk7SwFrwrlwBCRBuw0lPTdmdGniKx9BkJmq3nbrO7TY6m7n5tmb3Sm_lDn11iXebrVZ32PAx-FvAjRtlKe8fTf-gACMC-v</recordid><startdate>20180706</startdate><enddate>20180706</enddate><creator>CHOI, JAE GYU</creator><scope>EVB</scope></search><sort><creationdate>20180706</creationdate><title>MANUFACTURING METHOD OF PCB AND SEMICONDUCTOR PACKAGE USING TRANSPARENT CARRIER</title><author>CHOI, JAE GYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180077115A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI, JAE GYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI, JAE GYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING METHOD OF PCB AND SEMICONDUCTOR PACKAGE USING TRANSPARENT CARRIER</title><date>2018-07-06</date><risdate>2018</risdate><abstract>The present invention relates to a method of manufacturing a PCB and a semiconductor package using a transparent carrier. The present invention relates to a method of manufacturing a semiconductor package includes forming a printed circuit board and a printed circuit by using a transparent carrier made of various transparent materials such as polymer such as PET, PEN, transparent PI, and transparent acrylic having no electrical conductivity, inorganic materials such as glass and sapphire, and organic materials, mounting a semiconductor, and separating a transparent carrier. It is possible to perform mass production.
본 발명은 투명 캐리어를 이용한 인쇄회로기판과 반도체 패키지의 제조방법에 관한 것으로, 전기전도성이 없는 PET, PEN, 투명 PI, 투명 아크릴 등의 폴리머(Polymer)계, Glass, 사파이어 등의 무기(Inorganic)계, 유기계 등 다양한 형태의 투명 소재로 이루어지는 투명 캐리어를 이용해 인쇄회로기판과, 인쇄회로를 형성하고 반도체를 실장한 후 투명 캐리어를 분리하여 제조되는 반도체 패키지를 제조하는 방법을 제공한다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | MANUFACTURING METHOD OF PCB AND SEMICONDUCTOR PACKAGE USING TRANSPARENT CARRIER |
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