HEAT SINK STRUCTURE OF INVERTER
A heat sink structure of an inverter is disclosed. The heat sink structure of an inverter according to the present invention includes a printed circuit board on which a power conversion element and a plurality of electric elements are mounted; a lower cover on which the printed circuit board is moun...
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| creator | CHOI, JUN SAM LEE, JEONG KEE |
| description | A heat sink structure of an inverter is disclosed. The heat sink structure of an inverter according to the present invention includes a printed circuit board on which a power conversion element and a plurality of electric elements are mounted; a lower cover on which the printed circuit board is mounted; a case part for covering the upper part of the printed circuit board; and a fan formed on at least one side of the case part. A guide plate for cooling the power conversion element is vertically formed on the lower cover. An installation structure can be simplified.
인버터 방열구조가 개시된다. 본 발명에 따른 인버터 방열구조는, 전력변환소자와 다수의 전기적 소자가 실장되는 인쇄회로기판; 상기 인쇄회로기판이 장착되는 하부커버; 상기 인쇄회로기판의 상부를 커버하는 케이스부; 및 상기 케이스부의 적어도 일면에 형성되는 팬;을 포함하며, 상기 하부커버에는 상기 전력변환소자를 냉각하기 위한 가이드판이 수직으로 형성된 것을 특징으로 한다. |
| format | Patent |
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인버터 방열구조가 개시된다. 본 발명에 따른 인버터 방열구조는, 전력변환소자와 다수의 전기적 소자가 실장되는 인쇄회로기판; 상기 인쇄회로기판이 장착되는 하부커버; 상기 인쇄회로기판의 상부를 커버하는 케이스부; 및 상기 케이스부의 적어도 일면에 형성되는 팬;을 포함하며, 상기 하부커버에는 상기 전력변환소자를 냉각하기 위한 가이드판이 수직으로 형성된 것을 특징으로 한다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180626&DB=EPODOC&CC=KR&NR=20180070270A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180626&DB=EPODOC&CC=KR&NR=20180070270A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI, JUN SAM</creatorcontrib><creatorcontrib>LEE, JEONG KEE</creatorcontrib><title>HEAT SINK STRUCTURE OF INVERTER</title><description>A heat sink structure of an inverter is disclosed. The heat sink structure of an inverter according to the present invention includes a printed circuit board on which a power conversion element and a plurality of electric elements are mounted; a lower cover on which the printed circuit board is mounted; a case part for covering the upper part of the printed circuit board; and a fan formed on at least one side of the case part. A guide plate for cooling the power conversion element is vertically formed on the lower cover. An installation structure can be simplified.
인버터 방열구조가 개시된다. 본 발명에 따른 인버터 방열구조는, 전력변환소자와 다수의 전기적 소자가 실장되는 인쇄회로기판; 상기 인쇄회로기판이 장착되는 하부커버; 상기 인쇄회로기판의 상부를 커버하는 케이스부; 및 상기 케이스부의 적어도 일면에 형성되는 팬;을 포함하며, 상기 하부커버에는 상기 전력변환소자를 냉각하기 위한 가이드판이 수직으로 형성된 것을 특징으로 한다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD3cHUMUQj29PNWCA4JCnUOCQ1yVfB3U_D0C3MNCnEN4mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgaGFgYG5gZG5gaOxsSpAgBehSKE</recordid><startdate>20180626</startdate><enddate>20180626</enddate><creator>CHOI, JUN SAM</creator><creator>LEE, JEONG KEE</creator><scope>EVB</scope></search><sort><creationdate>20180626</creationdate><title>HEAT SINK STRUCTURE OF INVERTER</title><author>CHOI, JUN SAM ; LEE, JEONG KEE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180070270A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI, JUN SAM</creatorcontrib><creatorcontrib>LEE, JEONG KEE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI, JUN SAM</au><au>LEE, JEONG KEE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT SINK STRUCTURE OF INVERTER</title><date>2018-06-26</date><risdate>2018</risdate><abstract>A heat sink structure of an inverter is disclosed. The heat sink structure of an inverter according to the present invention includes a printed circuit board on which a power conversion element and a plurality of electric elements are mounted; a lower cover on which the printed circuit board is mounted; a case part for covering the upper part of the printed circuit board; and a fan formed on at least one side of the case part. A guide plate for cooling the power conversion element is vertically formed on the lower cover. An installation structure can be simplified.
인버터 방열구조가 개시된다. 본 발명에 따른 인버터 방열구조는, 전력변환소자와 다수의 전기적 소자가 실장되는 인쇄회로기판; 상기 인쇄회로기판이 장착되는 하부커버; 상기 인쇄회로기판의 상부를 커버하는 케이스부; 및 상기 케이스부의 적어도 일면에 형성되는 팬;을 포함하며, 상기 하부커버에는 상기 전력변환소자를 냉각하기 위한 가이드판이 수직으로 형성된 것을 특징으로 한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | HEAT SINK STRUCTURE OF INVERTER |
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