SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

A semiconductor device comprising a through hole suitable for a power system circuit part and a method of manufacturing the same are provided. An interlayer insulating film II2 has via holes VH1 and VH2. The sidewall conductive layer SWC is formed along the sidewall of the via hole VH1 and further i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOSHIMIZU MAKOTO, FUKAYA KAZUHIDE, HANAWA TOSHIKAZU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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