COPPER AND/OR COPPER OXIDE DISPERSION AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION
본 발명은 경시 변화에 대하여 우수한 안정성을 나타내고, 또한, 미세한 패턴형의 도전막을 형성할 수 있는 구리 및/또는 구리 산화물 분산체, 이러한 구리 및/또는 구리 산화물 분산체를 이용하여 제조하는 도전막을 적층한 도전막 적층체, 및 도전막 트랜지스터의 제공한다. 상기 구리 및/또는 구리 산화물 분산체는, 구리 및/또는 구리 산화물 미립자 0.50 질량％ 이상 60 질량％ 이하와, 하기 (1)∼(4): (1) 표면 에너지 조정제, (2) 인산기를 갖는 유기 화합물, (3) 20℃에 있어서의 증기압 0.010 ㎩ 이상 20 ㎩ 미...
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| creator | OGAWA SHIMPEI TSURUTA MASANORI OHNO EIICHI |
| description | 본 발명은 경시 변화에 대하여 우수한 안정성을 나타내고, 또한, 미세한 패턴형의 도전막을 형성할 수 있는 구리 및/또는 구리 산화물 분산체, 이러한 구리 및/또는 구리 산화물 분산체를 이용하여 제조하는 도전막을 적층한 도전막 적층체, 및 도전막 트랜지스터의 제공한다. 상기 구리 및/또는 구리 산화물 분산체는, 구리 및/또는 구리 산화물 미립자 0.50 질량％ 이상 60 질량％ 이하와, 하기 (1)∼(4): (1) 표면 에너지 조정제, (2) 인산기를 갖는 유기 화합물, (3) 20℃에 있어서의 증기압 0.010 ㎩ 이상 20 ㎩ 미만인 용매 0.050 질량％ 이상 10 질량％ 이하, 및 (4) 20℃에 있어서의 증기압 20 ㎩ 이상 150 h㎩ 이하인 용매를 함유하고, 그리고 상기 도전막 적층체는, 구리를 함유하는 도전막을 기판 상에 적층한 것이다.
To provide a copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass% of copper and/or copper oxide microparticles and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass% of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20°C; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20°C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate. |
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To provide a copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass% of copper and/or copper oxide microparticles and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass% of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20°C; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20°C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate.</description><language>eng ; kor</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PREPARATION OF CARBON BLACK ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SEMICONDUCTOR DEVICES ; TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180307&DB=EPODOC&CC=KR&NR=20180024039A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180307&DB=EPODOC&CC=KR&NR=20180024039A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OGAWA SHIMPEI</creatorcontrib><creatorcontrib>TSURUTA MASANORI</creatorcontrib><creatorcontrib>OHNO EIICHI</creatorcontrib><title>COPPER AND/OR COPPER OXIDE DISPERSION AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION</title><description>본 발명은 경시 변화에 대하여 우수한 안정성을 나타내고, 또한, 미세한 패턴형의 도전막을 형성할 수 있는 구리 및/또는 구리 산화물 분산체, 이러한 구리 및/또는 구리 산화물 분산체를 이용하여 제조하는 도전막을 적층한 도전막 적층체, 및 도전막 트랜지스터의 제공한다. 상기 구리 및/또는 구리 산화물 분산체는, 구리 및/또는 구리 산화물 미립자 0.50 질량％ 이상 60 질량％ 이하와, 하기 (1)∼(4): (1) 표면 에너지 조정제, (2) 인산기를 갖는 유기 화합물, (3) 20℃에 있어서의 증기압 0.010 ㎩ 이상 20 ㎩ 미만인 용매 0.050 질량％ 이상 10 질량％ 이하, 및 (4) 20℃에 있어서의 증기압 20 ㎩ 이상 150 h㎩ 이하인 용매를 함유하고, 그리고 상기 도전막 적층체는, 구리를 함유하는 도전막을 기판 상에 적층한 것이다.
To provide a copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass% of copper and/or copper oxide microparticles and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass% of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20°C; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20°C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>PREPARATION OF CARBON BLACK</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhw9g8IcA1ScPRz0fcPUoDy_CM8XVwVXDyDgZxgT38_kLSCq4-rc0iQv7O_n0uoc4hnmKuCm6ePr4Kbf5Cvq4tCaLCnnzuSFh4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEu8dZGRgaGFgYGRiYGzpaEycKgDEwTJD</recordid><startdate>20180307</startdate><enddate>20180307</enddate><creator>OGAWA SHIMPEI</creator><creator>TSURUTA MASANORI</creator><creator>OHNO EIICHI</creator><scope>EVB</scope></search><sort><creationdate>20180307</creationdate><title>COPPER AND/OR COPPER OXIDE DISPERSION AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION</title><author>OGAWA SHIMPEI ; TSURUTA MASANORI ; OHNO EIICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180024039A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2018</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>PREPARATION OF CARBON BLACK</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>OGAWA SHIMPEI</creatorcontrib><creatorcontrib>TSURUTA MASANORI</creatorcontrib><creatorcontrib>OHNO EIICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGAWA SHIMPEI</au><au>TSURUTA MASANORI</au><au>OHNO EIICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER AND/OR COPPER OXIDE DISPERSION AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION</title><date>2018-03-07</date><risdate>2018</risdate><abstract>본 발명은 경시 변화에 대하여 우수한 안정성을 나타내고, 또한, 미세한 패턴형의 도전막을 형성할 수 있는 구리 및/또는 구리 산화물 분산체, 이러한 구리 및/또는 구리 산화물 분산체를 이용하여 제조하는 도전막을 적층한 도전막 적층체, 및 도전막 트랜지스터의 제공한다. 상기 구리 및/또는 구리 산화물 분산체는, 구리 및/또는 구리 산화물 미립자 0.50 질량％ 이상 60 질량％ 이하와, 하기 (1)∼(4): (1) 표면 에너지 조정제, (2) 인산기를 갖는 유기 화합물, (3) 20℃에 있어서의 증기압 0.010 ㎩ 이상 20 ㎩ 미만인 용매 0.050 질량％ 이상 10 질량％ 이하, 및 (4) 20℃에 있어서의 증기압 20 ㎩ 이상 150 h㎩ 이하인 용매를 함유하고, 그리고 상기 도전막 적층체는, 구리를 함유하는 도전막을 기판 상에 적층한 것이다.
To provide a copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass% of copper and/or copper oxide microparticles and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass% of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20°C; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20°C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PREPARATION OF CARBON BLACK PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | COPPER AND/OR COPPER OXIDE DISPERSION AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION |
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