FLEXIBLE PRINTED CIRCUIT BOARDS

Provided is a flexible circuit board which can test a short-circuit/open state without generating a terminal defect in a via-land. The flexible circuit board comprises: a base substrate defining a test region on one surface; at least one first connection pad electrically connected to a first wiring...

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Hauptverfasser: HONG, SUNG MIN, SON, DONG EUN, PARK, SUNG BIN
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Sprache:eng ; kor
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creator HONG, SUNG MIN
SON, DONG EUN
PARK, SUNG BIN
description Provided is a flexible circuit board which can test a short-circuit/open state without generating a terminal defect in a via-land. The flexible circuit board comprises: a base substrate defining a test region on one surface; at least one first connection pad electrically connected to a first wiring pattern formed on the one surface of the base substrate, respectively; at least one second connection pad arranged on the one surface of the base substrate, and electrically connected to a second wiring pattern formed on the other surface opposite to the one surface of the base substrate, respectively; and a test pattern extended to the test region from the second connection pad. 연성 회로 기판이 제공된다. 연성 회로 기판은, 일면 상에, 테스트 영역이 정의된 베이스 기판, 상기 베이스 기판의 상기 일면 상에 형성된 제1 배선 패턴과 각각 전기적으로 연결되는 적어도 하나 이상의 제1 접속 패드, 상기 베이스 기판의 상기 일면 상에 배치되고, 상기 베이스 기판의 상기 일면의 반대면인 타면에 형성된 제2 배선 패턴과 각각 전기적으로 연결되는 적어도 하나 이상의 제2 접속 패드, 및 상기 제2 접속 패드로부터 상기 테스트 영역 상으로 연장된 테스트 패턴을 포함한다.
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The flexible circuit board comprises: a base substrate defining a test region on one surface; at least one first connection pad electrically connected to a first wiring pattern formed on the one surface of the base substrate, respectively; at least one second connection pad arranged on the one surface of the base substrate, and electrically connected to a second wiring pattern formed on the other surface opposite to the one surface of the base substrate, respectively; and a test pattern extended to the test region from the second connection pad. 연성 회로 기판이 제공된다. 연성 회로 기판은, 일면 상에, 테스트 영역이 정의된 베이스 기판, 상기 베이스 기판의 상기 일면 상에 형성된 제1 배선 패턴과 각각 전기적으로 연결되는 적어도 하나 이상의 제1 접속 패드, 상기 베이스 기판의 상기 일면 상에 배치되고, 상기 베이스 기판의 상기 일면의 반대면인 타면에 형성된 제2 배선 패턴과 각각 전기적으로 연결되는 적어도 하나 이상의 제2 접속 패드, 및 상기 제2 접속 패드로부터 상기 테스트 영역 상으로 연장된 테스트 패턴을 포함한다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB383GN8HTycVUICPL0C3F1UXD2DHIO9QxRcPJ3DHIJ5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgaGFgYGRgYmxgaOxsSpAgBS_iJZ</recordid><startdate>20180228</startdate><enddate>20180228</enddate><creator>HONG, SUNG MIN</creator><creator>SON, DONG EUN</creator><creator>PARK, SUNG BIN</creator><scope>EVB</scope></search><sort><creationdate>20180228</creationdate><title>FLEXIBLE PRINTED CIRCUIT BOARDS</title><author>HONG, SUNG MIN ; SON, DONG EUN ; PARK, SUNG BIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180020430A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HONG, SUNG MIN</creatorcontrib><creatorcontrib>SON, DONG EUN</creatorcontrib><creatorcontrib>PARK, SUNG BIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONG, SUNG MIN</au><au>SON, DONG EUN</au><au>PARK, SUNG BIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLEXIBLE PRINTED CIRCUIT BOARDS</title><date>2018-02-28</date><risdate>2018</risdate><abstract>Provided is a flexible circuit board which can test a short-circuit/open state without generating a terminal defect in a via-land. The flexible circuit board comprises: a base substrate defining a test region on one surface; at least one first connection pad electrically connected to a first wiring pattern formed on the one surface of the base substrate, respectively; at least one second connection pad arranged on the one surface of the base substrate, and electrically connected to a second wiring pattern formed on the other surface opposite to the one surface of the base substrate, respectively; and a test pattern extended to the test region from the second connection pad. 연성 회로 기판이 제공된다. 연성 회로 기판은, 일면 상에, 테스트 영역이 정의된 베이스 기판, 상기 베이스 기판의 상기 일면 상에 형성된 제1 배선 패턴과 각각 전기적으로 연결되는 적어도 하나 이상의 제1 접속 패드, 상기 베이스 기판의 상기 일면 상에 배치되고, 상기 베이스 기판의 상기 일면의 반대면인 타면에 형성된 제2 배선 패턴과 각각 전기적으로 연결되는 적어도 하나 이상의 제2 접속 패드, 및 상기 제2 접속 패드로부터 상기 테스트 영역 상으로 연장된 테스트 패턴을 포함한다.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
TESTING
title FLEXIBLE PRINTED CIRCUIT BOARDS
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