COF FLEXIBLE PRINTED CIRCUIT BOARD COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME
The present invention relates to a flexible printed circuit board with improved processability. The flexible printed circuit board comprises: a substrate including an internal area and an external area; a wiring disposed on the internal area; a protective layer disposed on the internal area to parti...
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| creator | KIM, JOO CHUL AHN, MYOUNG SOO KIM, HYUN SOO LEE, EON JONG SHIM, JAE MOON DO, KI HWAN PARK, KI TAE |
| description | The present invention relates to a flexible printed circuit board with improved processability. The flexible printed circuit board comprises: a substrate including an internal area and an external area; a wiring disposed on the internal area; a protective layer disposed on the internal area to partially cover the wiring; a plurality of alignment parts disposed on the internal area; and a plurality of dummy parts disposed on the external area.
실시예에 따른 연성인쇄회로기판은, 내부영역 및 외부영역을 포함하는 기판; 상기 내부영역 상에 배치되는 배선; 상기 내부영역 상에서 상기 배선을 부분적으로 덮으면서 배치되는 보호층; 상기 내부영역 상에 배치되는 복수 개의 얼라인부; 및 상기 외부영역 상에 배치되는 복수 개의 더미부를 포함한다. |
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실시예에 따른 연성인쇄회로기판은, 내부영역 및 외부영역을 포함하는 기판; 상기 내부영역 상에 배치되는 배선; 상기 내부영역 상에서 상기 배선을 부분적으로 덮으면서 배치되는 보호층; 상기 내부영역 상에 배치되는 복수 개의 얼라인부; 및 상기 외부영역 상에 배치되는 복수 개의 더미부를 포함한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171219&DB=EPODOC&CC=KR&NR=20170139406A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171219&DB=EPODOC&CC=KR&NR=20170139406A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, JOO CHUL</creatorcontrib><creatorcontrib>AHN, MYOUNG SOO</creatorcontrib><creatorcontrib>KIM, HYUN SOO</creatorcontrib><creatorcontrib>LEE, EON JONG</creatorcontrib><creatorcontrib>SHIM, JAE MOON</creatorcontrib><creatorcontrib>DO, KI HWAN</creatorcontrib><creatorcontrib>PARK, KI TAE</creatorcontrib><title>COF FLEXIBLE PRINTED CIRCUIT BOARD COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME</title><description>The present invention relates to a flexible printed circuit board with improved processability. The flexible printed circuit board comprises: a substrate including an internal area and an external area; a wiring disposed on the internal area; a protective layer disposed on the internal area to partially cover the wiring; a plurality of alignment parts disposed on the internal area; and a plurality of dummy parts disposed on the external area.
실시예에 따른 연성인쇄회로기판은, 내부영역 및 외부영역을 포함하는 기판; 상기 내부영역 상에 배치되는 배선; 상기 내부영역 상에서 상기 배선을 부분적으로 덮으면서 배치되는 보호층; 상기 내부영역 상에 배치되는 복수 개의 얼라인부; 및 상기 외부영역 상에 배치되는 복수 개의 더미부를 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh39ndTcPNxjfB08nFVCAjy9AtxdVFw9gxyDvUMUXDydwwC8oBKfP1dQoEKHP1cFFx9XJ1Dgvz9PJ0VXFzDPJ1dgQp8gTqDPf3cFUI8XBWCHX1deRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGhuYGhsaWJgZmjMXGqAEH4MVs</recordid><startdate>20171219</startdate><enddate>20171219</enddate><creator>KIM, JOO CHUL</creator><creator>AHN, MYOUNG SOO</creator><creator>KIM, HYUN SOO</creator><creator>LEE, EON JONG</creator><creator>SHIM, JAE MOON</creator><creator>DO, KI HWAN</creator><creator>PARK, KI TAE</creator><scope>EVB</scope></search><sort><creationdate>20171219</creationdate><title>COF FLEXIBLE PRINTED CIRCUIT BOARD COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME</title><author>KIM, JOO CHUL ; AHN, MYOUNG SOO ; KIM, HYUN SOO ; LEE, EON JONG ; SHIM, JAE MOON ; DO, KI HWAN ; PARK, KI TAE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170139406A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, JOO CHUL</creatorcontrib><creatorcontrib>AHN, MYOUNG SOO</creatorcontrib><creatorcontrib>KIM, HYUN SOO</creatorcontrib><creatorcontrib>LEE, EON JONG</creatorcontrib><creatorcontrib>SHIM, JAE MOON</creatorcontrib><creatorcontrib>DO, KI HWAN</creatorcontrib><creatorcontrib>PARK, KI TAE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, JOO CHUL</au><au>AHN, MYOUNG SOO</au><au>KIM, HYUN SOO</au><au>LEE, EON JONG</au><au>SHIM, JAE MOON</au><au>DO, KI HWAN</au><au>PARK, KI TAE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COF FLEXIBLE PRINTED CIRCUIT BOARD COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME</title><date>2017-12-19</date><risdate>2017</risdate><abstract>The present invention relates to a flexible printed circuit board with improved processability. The flexible printed circuit board comprises: a substrate including an internal area and an external area; a wiring disposed on the internal area; a protective layer disposed on the internal area to partially cover the wiring; a plurality of alignment parts disposed on the internal area; and a plurality of dummy parts disposed on the external area.
실시예에 따른 연성인쇄회로기판은, 내부영역 및 외부영역을 포함하는 기판; 상기 내부영역 상에 배치되는 배선; 상기 내부영역 상에서 상기 배선을 부분적으로 덮으면서 배치되는 보호층; 상기 내부영역 상에 배치되는 복수 개의 얼라인부; 및 상기 외부영역 상에 배치되는 복수 개의 더미부를 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | COF FLEXIBLE PRINTED CIRCUIT BOARD COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME |
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