BOARD ANGLE CORRECTION DEVICE AND METHOD
The present invention relates to a substrate angle correction apparatus (700) and a correction method thereof. The substrate angle correction apparatus (700) includes a probe unit which includes needle pains which are connected to a plurality of test pads arranged in a line, respectively and provide...
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| description | The present invention relates to a substrate angle correction apparatus (700) and a correction method thereof. The substrate angle correction apparatus (700) includes a probe unit which includes needle pains which are connected to a plurality of test pads arranged in a line, respectively and provide test signals, a vision unit for photographing the test pins and the needle pins, a calculation unit for calculating a tilt angle of one edge of the test pad and a reference line formed by connecting at least two of the needle pins, and a correction unit for correcting an angle between the reference line and the edge by rotating a substrate by corresponding to the tilt angle. Accordingly, the present invention can reduce failure determination due to a contact failure.
본 발명은 기판 각도 보정장치(700) 및 보정방법에 관한 것으로, 기판 각도 보정장치(700)는 기판에 다수개가 일렬로 배치된 테스트패드들에 각각 접속되어 테스트 신호를 제공하는 니들핀들을 포함하는 프로브유닛, 상기 테스트패드들과 니들핀들을 촬영하는 비전유닛, 적어도 2개의 상기 니들핀들을 연결하여 형성된 기준선과 상기 테스트패드의 일측 에지의 기울어진 각도를 산출하는 산출유닛, 및 상기 각도에 대응하여 상기 기판을 회전시켜 상기 기준선 및 상기 에지가 이루는 각도를 보정하는 보정유닛을 포함할 수 있다. |
| format | Patent |
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본 발명은 기판 각도 보정장치(700) 및 보정방법에 관한 것으로, 기판 각도 보정장치(700)는 기판에 다수개가 일렬로 배치된 테스트패드들에 각각 접속되어 테스트 신호를 제공하는 니들핀들을 포함하는 프로브유닛, 상기 테스트패드들과 니들핀들을 촬영하는 비전유닛, 적어도 2개의 상기 니들핀들을 연결하여 형성된 기준선과 상기 테스트패드의 일측 에지의 기울어진 각도를 산출하는 산출유닛, 및 상기 각도에 대응하여 상기 기판을 회전시켜 상기 기준선 및 상기 에지가 이루는 각도를 보정하는 보정유닛을 포함할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170804&DB=EPODOC&CC=KR&NR=20170089541A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170804&DB=EPODOC&CC=KR&NR=20170089541A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JEON, BYEONG SEON</creatorcontrib><title>BOARD ANGLE CORRECTION DEVICE AND METHOD</title><description>The present invention relates to a substrate angle correction apparatus (700) and a correction method thereof. The substrate angle correction apparatus (700) includes a probe unit which includes needle pains which are connected to a plurality of test pads arranged in a line, respectively and provide test signals, a vision unit for photographing the test pins and the needle pins, a calculation unit for calculating a tilt angle of one edge of the test pad and a reference line formed by connecting at least two of the needle pins, and a correction unit for correcting an angle between the reference line and the edge by rotating a substrate by corresponding to the tilt angle. Accordingly, the present invention can reduce failure determination due to a contact failure.
본 발명은 기판 각도 보정장치(700) 및 보정방법에 관한 것으로, 기판 각도 보정장치(700)는 기판에 다수개가 일렬로 배치된 테스트패드들에 각각 접속되어 테스트 신호를 제공하는 니들핀들을 포함하는 프로브유닛, 상기 테스트패드들과 니들핀들을 촬영하는 비전유닛, 적어도 2개의 상기 니들핀들을 연결하여 형성된 기준선과 상기 테스트패드의 일측 에지의 기울어진 각도를 산출하는 산출유닛, 및 상기 각도에 대응하여 상기 기판을 회전시켜 상기 기준선 및 상기 에지가 이루는 각도를 보정하는 보정유닛을 포함할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBw8ncMclFw9HP3cVVw9g8KcnUO8fT3U3BxDfN0dgWKuyj4uoZ4-LvwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yAjA0NzAwMLS1MTQ0dj4lQBAG_tJKA</recordid><startdate>20170804</startdate><enddate>20170804</enddate><creator>JEON, BYEONG SEON</creator><scope>EVB</scope></search><sort><creationdate>20170804</creationdate><title>BOARD ANGLE CORRECTION DEVICE AND METHOD</title><author>JEON, BYEONG SEON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170089541A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JEON, BYEONG SEON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEON, BYEONG SEON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BOARD ANGLE CORRECTION DEVICE AND METHOD</title><date>2017-08-04</date><risdate>2017</risdate><abstract>The present invention relates to a substrate angle correction apparatus (700) and a correction method thereof. The substrate angle correction apparatus (700) includes a probe unit which includes needle pains which are connected to a plurality of test pads arranged in a line, respectively and provide test signals, a vision unit for photographing the test pins and the needle pins, a calculation unit for calculating a tilt angle of one edge of the test pad and a reference line formed by connecting at least two of the needle pins, and a correction unit for correcting an angle between the reference line and the edge by rotating a substrate by corresponding to the tilt angle. Accordingly, the present invention can reduce failure determination due to a contact failure.
본 발명은 기판 각도 보정장치(700) 및 보정방법에 관한 것으로, 기판 각도 보정장치(700)는 기판에 다수개가 일렬로 배치된 테스트패드들에 각각 접속되어 테스트 신호를 제공하는 니들핀들을 포함하는 프로브유닛, 상기 테스트패드들과 니들핀들을 촬영하는 비전유닛, 적어도 2개의 상기 니들핀들을 연결하여 형성된 기준선과 상기 테스트패드의 일측 에지의 기울어진 각도를 산출하는 산출유닛, 및 상기 각도에 대응하여 상기 기판을 회전시켜 상기 기준선 및 상기 에지가 이루는 각도를 보정하는 보정유닛을 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | BOARD ANGLE CORRECTION DEVICE AND METHOD |
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