COMMUNICATION EQUIPMENT METAL HOUSING AND PREPARATION METHOD THEREFOR
통신 장비 금속 하우징의 제조 방법 및 상기 제조방법으로 얻어진 통신 장비 금속 하우징이 제공된다. 본 발명의 통신 장비 금속 하우징의 제조방법은, 1)금속 기재의 내부 표면의 비-슬릿 영역에 제1 사출 성형을 실시하고; 2)상기 금속 기재의 내부 표면의 슬릿 영역에 하나 이상의 슬릿을 형성하고; 그리고 3)상기 금속 기재의 내부 표면의 슬릿 영역에 제2 사출 성형을 실시하는 것을 포함한다. The present disclosure provides a method of manufacturing a metal shell of a co...
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| creator | DONG MINGJIE ZHAO GUIWANG LI KONGLIN LIU CHENCEN GUO LIFEN |
| description | 통신 장비 금속 하우징의 제조 방법 및 상기 제조방법으로 얻어진 통신 장비 금속 하우징이 제공된다. 본 발명의 통신 장비 금속 하우징의 제조방법은, 1)금속 기재의 내부 표면의 비-슬릿 영역에 제1 사출 성형을 실시하고; 2)상기 금속 기재의 내부 표면의 슬릿 영역에 하나 이상의 슬릿을 형성하고; 그리고 3)상기 금속 기재의 내부 표면의 슬릿 영역에 제2 사출 성형을 실시하는 것을 포함한다.
The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of a communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate. |
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The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of a communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.</description><language>eng ; kor</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170802&DB=EPODOC&CC=KR&NR=20170088920A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170802&DB=EPODOC&CC=KR&NR=20170088920A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DONG MINGJIE</creatorcontrib><creatorcontrib>ZHAO GUIWANG</creatorcontrib><creatorcontrib>LI KONGLIN</creatorcontrib><creatorcontrib>LIU CHENCEN</creatorcontrib><creatorcontrib>GUO LIFEN</creatorcontrib><title>COMMUNICATION EQUIPMENT METAL HOUSING AND PREPARATION METHOD THEREFOR</title><description>통신 장비 금속 하우징의 제조 방법 및 상기 제조방법으로 얻어진 통신 장비 금속 하우징이 제공된다. 본 발명의 통신 장비 금속 하우징의 제조방법은, 1)금속 기재의 내부 표면의 비-슬릿 영역에 제1 사출 성형을 실시하고; 2)상기 금속 기재의 내부 표면의 슬릿 영역에 하나 이상의 슬릿을 형성하고; 그리고 3)상기 금속 기재의 내부 표면의 슬릿 영역에 제2 사출 성형을 실시하는 것을 포함한다.
The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of a communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB19vf1DfXzdHYM8fT3U3ANDPUM8HX1C1HwdQ1x9FHw8A8N9vRzV3D0c1EICHINcAyCqAPKevi7KIR4uAa5uvkH8TCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwNDcwMDCwtLIwNHY-JUAQBj_i1I</recordid><startdate>20170802</startdate><enddate>20170802</enddate><creator>DONG MINGJIE</creator><creator>ZHAO GUIWANG</creator><creator>LI KONGLIN</creator><creator>LIU CHENCEN</creator><creator>GUO LIFEN</creator><scope>EVB</scope></search><sort><creationdate>20170802</creationdate><title>COMMUNICATION EQUIPMENT METAL HOUSING AND PREPARATION METHOD THEREFOR</title><author>DONG MINGJIE ; ZHAO GUIWANG ; LI KONGLIN ; LIU CHENCEN ; GUO LIFEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170088920A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>DONG MINGJIE</creatorcontrib><creatorcontrib>ZHAO GUIWANG</creatorcontrib><creatorcontrib>LI KONGLIN</creatorcontrib><creatorcontrib>LIU CHENCEN</creatorcontrib><creatorcontrib>GUO LIFEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DONG MINGJIE</au><au>ZHAO GUIWANG</au><au>LI KONGLIN</au><au>LIU CHENCEN</au><au>GUO LIFEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMMUNICATION EQUIPMENT METAL HOUSING AND PREPARATION METHOD THEREFOR</title><date>2017-08-02</date><risdate>2017</risdate><abstract>통신 장비 금속 하우징의 제조 방법 및 상기 제조방법으로 얻어진 통신 장비 금속 하우징이 제공된다. 본 발명의 통신 장비 금속 하우징의 제조방법은, 1)금속 기재의 내부 표면의 비-슬릿 영역에 제1 사출 성형을 실시하고; 2)상기 금속 기재의 내부 표면의 슬릿 영역에 하나 이상의 슬릿을 형성하고; 그리고 3)상기 금속 기재의 내부 표면의 슬릿 영역에 제2 사출 성형을 실시하는 것을 포함한다.
The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of a communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | COMMUNICATION EQUIPMENT METAL HOUSING AND PREPARATION METHOD THEREFOR |
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