METHODS APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS
진단 장치는 리소그래피 제조 시스템을 모니터링한다. 기판에 걸친 일부 특성의 로컬 편차를 나타내는 제 1 측정 데이터는 리소그래피 장치 내의 센서(202) 및/또는 별개의 계측 툴(240)을 사용하여 획득된다. 다른 검사 툴(244, 248)은 웨이퍼 후면 검사 및/또는 레티클 후면 검사를 수행하여 제 2 측정 데이터(302)를 생성한다. 고-분해능 후면 결함 이미지는 처리되어 제 1 측정 데이터로부터의 더 저분해능 정보와 비교될 수 있는 형태가 된다. 관찰된 결함 중 어느 것이 제 1 측정 데이터에 표현된 편차들과 공간적으로 상관...
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| creator | HAUPTMANN MARC DAVIES DYLAN JOHN DAVID TSUGAMA NAOKO VIEYRA SALAS JORGE ALBERTO JANSSEN PAUL JANSSEN EDWIN JOHANNES MARIA HOEKERD KORNELIS TIJMEN BRULS RICHARD JOSEPH VAN DER WILK RONALD VAN SCHIJNDEL ANTONIUS HUBERTUS VAN DEN OEVER PETRUS JOHANNES |
| description | 진단 장치는 리소그래피 제조 시스템을 모니터링한다. 기판에 걸친 일부 특성의 로컬 편차를 나타내는 제 1 측정 데이터는 리소그래피 장치 내의 센서(202) 및/또는 별개의 계측 툴(240)을 사용하여 획득된다. 다른 검사 툴(244, 248)은 웨이퍼 후면 검사 및/또는 레티클 후면 검사를 수행하여 제 2 측정 데이터(302)를 생성한다. 고-분해능 후면 결함 이미지는 처리되어 제 1 측정 데이터로부터의 더 저분해능 정보와 비교될 수 있는 형태가 된다. 관찰된 결함 중 어느 것이 제 1 측정 데이터에 표현된 편차들과 공간적으로 상관되는지를 식별하기 위해 교차-상관(CORR)이 수행된다. 더 상세한 원본 결함 맵(520) 내의 결함의 잠재적으로 관련된 클러스터를 식별하기 위해 상관 맵(506)이 사용된다. 결과적인 장치는 자동화된 근본 원인 분석의 일부로서 패턴 인식(PREC)에 의해 식별될 수 있다.
A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20170086632A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20170086632A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20170086632A3</originalsourceid><addsrcrecordid>eNqNjj0LwjAQhrs4iPofDpyF2oK6nmnaBpsPksvgVIrESbRQ_5L_0xSKoJPTHfc8vPfOk5fkVOvCARqDFsk7KLUFfSQUSqgKCoGV0o4EA6EikkhCK7C8iUvkpAGhETGksmjqqElUvkRG3o7cWM24c9_KdBy5OzviMmazxhc_Dz-dlsns2t2GsJrmIlmXnFi9Cf2jDUPfXcI9PNuTzdLtPk0Pu12eYf6f9QaYCkg-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHODS APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS</title><source>esp@cenet</source><creator>HAUPTMANN MARC ; DAVIES DYLAN JOHN DAVID ; TSUGAMA NAOKO ; VIEYRA SALAS JORGE ALBERTO ; JANSSEN PAUL ; JANSSEN EDWIN JOHANNES MARIA ; HOEKERD KORNELIS TIJMEN ; BRULS RICHARD JOSEPH ; VAN DER WILK RONALD ; VAN SCHIJNDEL ANTONIUS HUBERTUS ; VAN DEN OEVER PETRUS JOHANNES</creator><creatorcontrib>HAUPTMANN MARC ; DAVIES DYLAN JOHN DAVID ; TSUGAMA NAOKO ; VIEYRA SALAS JORGE ALBERTO ; JANSSEN PAUL ; JANSSEN EDWIN JOHANNES MARIA ; HOEKERD KORNELIS TIJMEN ; BRULS RICHARD JOSEPH ; VAN DER WILK RONALD ; VAN SCHIJNDEL ANTONIUS HUBERTUS ; VAN DEN OEVER PETRUS JOHANNES</creatorcontrib><description>진단 장치는 리소그래피 제조 시스템을 모니터링한다. 기판에 걸친 일부 특성의 로컬 편차를 나타내는 제 1 측정 데이터는 리소그래피 장치 내의 센서(202) 및/또는 별개의 계측 툴(240)을 사용하여 획득된다. 다른 검사 툴(244, 248)은 웨이퍼 후면 검사 및/또는 레티클 후면 검사를 수행하여 제 2 측정 데이터(302)를 생성한다. 고-분해능 후면 결함 이미지는 처리되어 제 1 측정 데이터로부터의 더 저분해능 정보와 비교될 수 있는 형태가 된다. 관찰된 결함 중 어느 것이 제 1 측정 데이터에 표현된 편차들과 공간적으로 상관되는지를 식별하기 위해 교차-상관(CORR)이 수행된다. 더 상세한 원본 결함 맵(520) 내의 결함의 잠재적으로 관련된 클러스터를 식별하기 위해 상관 맵(506)이 사용된다. 결과적인 장치는 자동화된 근본 원인 분석의 일부로서 패턴 인식(PREC)에 의해 식별될 수 있다.
A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MATERIALS THEREFOR ; MEASURING ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170726&DB=EPODOC&CC=KR&NR=20170086632A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170726&DB=EPODOC&CC=KR&NR=20170086632A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAUPTMANN MARC</creatorcontrib><creatorcontrib>DAVIES DYLAN JOHN DAVID</creatorcontrib><creatorcontrib>TSUGAMA NAOKO</creatorcontrib><creatorcontrib>VIEYRA SALAS JORGE ALBERTO</creatorcontrib><creatorcontrib>JANSSEN PAUL</creatorcontrib><creatorcontrib>JANSSEN EDWIN JOHANNES MARIA</creatorcontrib><creatorcontrib>HOEKERD KORNELIS TIJMEN</creatorcontrib><creatorcontrib>BRULS RICHARD JOSEPH</creatorcontrib><creatorcontrib>VAN DER WILK RONALD</creatorcontrib><creatorcontrib>VAN SCHIJNDEL ANTONIUS HUBERTUS</creatorcontrib><creatorcontrib>VAN DEN OEVER PETRUS JOHANNES</creatorcontrib><title>METHODS APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS</title><description>진단 장치는 리소그래피 제조 시스템을 모니터링한다. 기판에 걸친 일부 특성의 로컬 편차를 나타내는 제 1 측정 데이터는 리소그래피 장치 내의 센서(202) 및/또는 별개의 계측 툴(240)을 사용하여 획득된다. 다른 검사 툴(244, 248)은 웨이퍼 후면 검사 및/또는 레티클 후면 검사를 수행하여 제 2 측정 데이터(302)를 생성한다. 고-분해능 후면 결함 이미지는 처리되어 제 1 측정 데이터로부터의 더 저분해능 정보와 비교될 수 있는 형태가 된다. 관찰된 결함 중 어느 것이 제 1 측정 데이터에 표현된 편차들과 공간적으로 상관되는지를 식별하기 위해 교차-상관(CORR)이 수행된다. 더 상세한 원본 결함 맵(520) 내의 결함의 잠재적으로 관련된 클러스터를 식별하기 위해 상관 맵(506)이 사용된다. 결과적인 장치는 자동화된 근본 원인 분석의 일부로서 패턴 인식(PREC)에 의해 식별될 수 있다.
A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjj0LwjAQhrs4iPofDpyF2oK6nmnaBpsPksvgVIrESbRQ_5L_0xSKoJPTHfc8vPfOk5fkVOvCARqDFsk7KLUFfSQUSqgKCoGV0o4EA6EikkhCK7C8iUvkpAGhETGksmjqqElUvkRG3o7cWM24c9_KdBy5OzviMmazxhc_Dz-dlsns2t2GsJrmIlmXnFi9Cf2jDUPfXcI9PNuTzdLtPk0Pu12eYf6f9QaYCkg-</recordid><startdate>20170726</startdate><enddate>20170726</enddate><creator>HAUPTMANN MARC</creator><creator>DAVIES DYLAN JOHN DAVID</creator><creator>TSUGAMA NAOKO</creator><creator>VIEYRA SALAS JORGE ALBERTO</creator><creator>JANSSEN PAUL</creator><creator>JANSSEN EDWIN JOHANNES MARIA</creator><creator>HOEKERD KORNELIS TIJMEN</creator><creator>BRULS RICHARD JOSEPH</creator><creator>VAN DER WILK RONALD</creator><creator>VAN SCHIJNDEL ANTONIUS HUBERTUS</creator><creator>VAN DEN OEVER PETRUS JOHANNES</creator><scope>EVB</scope></search><sort><creationdate>20170726</creationdate><title>METHODS APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS</title><author>HAUPTMANN MARC ; DAVIES DYLAN JOHN DAVID ; TSUGAMA NAOKO ; VIEYRA SALAS JORGE ALBERTO ; JANSSEN PAUL ; JANSSEN EDWIN JOHANNES MARIA ; HOEKERD KORNELIS TIJMEN ; BRULS RICHARD JOSEPH ; VAN DER WILK RONALD ; VAN SCHIJNDEL ANTONIUS HUBERTUS ; VAN DEN OEVER PETRUS JOHANNES</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170086632A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HAUPTMANN MARC</creatorcontrib><creatorcontrib>DAVIES DYLAN JOHN DAVID</creatorcontrib><creatorcontrib>TSUGAMA NAOKO</creatorcontrib><creatorcontrib>VIEYRA SALAS JORGE ALBERTO</creatorcontrib><creatorcontrib>JANSSEN PAUL</creatorcontrib><creatorcontrib>JANSSEN EDWIN JOHANNES MARIA</creatorcontrib><creatorcontrib>HOEKERD KORNELIS TIJMEN</creatorcontrib><creatorcontrib>BRULS RICHARD JOSEPH</creatorcontrib><creatorcontrib>VAN DER WILK RONALD</creatorcontrib><creatorcontrib>VAN SCHIJNDEL ANTONIUS HUBERTUS</creatorcontrib><creatorcontrib>VAN DEN OEVER PETRUS JOHANNES</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAUPTMANN MARC</au><au>DAVIES DYLAN JOHN DAVID</au><au>TSUGAMA NAOKO</au><au>VIEYRA SALAS JORGE ALBERTO</au><au>JANSSEN PAUL</au><au>JANSSEN EDWIN JOHANNES MARIA</au><au>HOEKERD KORNELIS TIJMEN</au><au>BRULS RICHARD JOSEPH</au><au>VAN DER WILK RONALD</au><au>VAN SCHIJNDEL ANTONIUS HUBERTUS</au><au>VAN DEN OEVER PETRUS JOHANNES</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS</title><date>2017-07-26</date><risdate>2017</risdate><abstract>진단 장치는 리소그래피 제조 시스템을 모니터링한다. 기판에 걸친 일부 특성의 로컬 편차를 나타내는 제 1 측정 데이터는 리소그래피 장치 내의 센서(202) 및/또는 별개의 계측 툴(240)을 사용하여 획득된다. 다른 검사 툴(244, 248)은 웨이퍼 후면 검사 및/또는 레티클 후면 검사를 수행하여 제 2 측정 데이터(302)를 생성한다. 고-분해능 후면 결함 이미지는 처리되어 제 1 측정 데이터로부터의 더 저분해능 정보와 비교될 수 있는 형태가 된다. 관찰된 결함 중 어느 것이 제 1 측정 데이터에 표현된 편차들과 공간적으로 상관되는지를 식별하기 위해 교차-상관(CORR)이 수행된다. 더 상세한 원본 결함 맵(520) 내의 결함의 잠재적으로 관련된 클러스터를 식별하기 위해 상관 맵(506)이 사용된다. 결과적인 장치는 자동화된 근본 원인 분석의 일부로서 패턴 인식(PREC)에 의해 식별될 수 있다.
A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | METHODS APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS |
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