LED LED LIGHTING UNIT
LED 조명 유닛은 지지 구조체(14), 지지 구조체 내에 장착된 LED-기반 발광 구조체(10) 및 지지 구조체의 상부 위의 광학 빔 성형 배열체(50, 52)를 포함한다. 광학 빔 성형 배열체는 광학적으로 투명하고 열적으로 안정한 재료를 포함하고, 지지 구조체는 LED-기반 발광 구조체 위에서 작은 높이로 마이크로구조화 층을 지지한다. 이 높이는 예를 들어 0.5㎜ 미만일 수 있다. 광학 빔 성형 배열체는 소형이고 낮은 높이의 조명 유닛이 광학 빔 성형 소자에 손상을 주지 않고 리플로우 납땜에 의해 캐리어 상에 장착될 수 있게...
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| creator | HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS CROMPVOETS FLORIS MARIA HERMANSZ SANDER JO MARIA JOHANNA HELENA ZAHN FRITZ HELMUT DEKKERS WOUTER VDOVIN OLEXANDR VALENTYNOVYCH KLEIJNEN CHRISTIAN JAGT HENDRIK JOHANNES BOUDEWIJN |
| description | LED 조명 유닛은 지지 구조체(14), 지지 구조체 내에 장착된 LED-기반 발광 구조체(10) 및 지지 구조체의 상부 위의 광학 빔 성형 배열체(50, 52)를 포함한다. 광학 빔 성형 배열체는 광학적으로 투명하고 열적으로 안정한 재료를 포함하고, 지지 구조체는 LED-기반 발광 구조체 위에서 작은 높이로 마이크로구조화 층을 지지한다. 이 높이는 예를 들어 0.5㎜ 미만일 수 있다. 광학 빔 성형 배열체는 소형이고 낮은 높이의 조명 유닛이 광학 빔 성형 소자에 손상을 주지 않고 리플로우 납땜에 의해 캐리어 상에 장착될 수 있게 한다.
An LED lighting unit comprising a support structure (14), an LED-based light emitting structure (10) mounted within the support structure and an optical beam shaping arrangement (50, 52) over the top of the support structure. The optical beam shaping arrangement comprises an optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement enables a compact and low height lighting unit to be mounted on a carrier by reflow soldering without damaging the optical beam-shaping component. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20170024052A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20170024052A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20170024052A3</originalsourceid><addsrcrecordid>eNrjZBD1cXVRAGNPd48QTz93hVA_zxAeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhLvHWRkYGhuYGBkYmBq5GhMnCoA8ksfZg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LED LED LIGHTING UNIT</title><source>esp@cenet</source><creator>HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS ; CROMPVOETS FLORIS MARIA HERMANSZ ; SANDER JO MARIA JOHANNA HELENA ; ZAHN FRITZ HELMUT ; DEKKERS WOUTER ; VDOVIN OLEXANDR VALENTYNOVYCH ; KLEIJNEN CHRISTIAN ; JAGT HENDRIK JOHANNES BOUDEWIJN</creator><creatorcontrib>HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS ; CROMPVOETS FLORIS MARIA HERMANSZ ; SANDER JO MARIA JOHANNA HELENA ; ZAHN FRITZ HELMUT ; DEKKERS WOUTER ; VDOVIN OLEXANDR VALENTYNOVYCH ; KLEIJNEN CHRISTIAN ; JAGT HENDRIK JOHANNES BOUDEWIJN</creatorcontrib><description>LED 조명 유닛은 지지 구조체(14), 지지 구조체 내에 장착된 LED-기반 발광 구조체(10) 및 지지 구조체의 상부 위의 광학 빔 성형 배열체(50, 52)를 포함한다. 광학 빔 성형 배열체는 광학적으로 투명하고 열적으로 안정한 재료를 포함하고, 지지 구조체는 LED-기반 발광 구조체 위에서 작은 높이로 마이크로구조화 층을 지지한다. 이 높이는 예를 들어 0.5㎜ 미만일 수 있다. 광학 빔 성형 배열체는 소형이고 낮은 높이의 조명 유닛이 광학 빔 성형 소자에 손상을 주지 않고 리플로우 납땜에 의해 캐리어 상에 장착될 수 있게 한다.
An LED lighting unit comprising a support structure (14), an LED-based light emitting structure (10) mounted within the support structure and an optical beam shaping arrangement (50, 52) over the top of the support structure. The optical beam shaping arrangement comprises an optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement enables a compact and low height lighting unit to be mounted on a carrier by reflow soldering without damaging the optical beam-shaping component.</description><language>eng ; kor</language><subject>ACCESSORIES THEREFOR ; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES ; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM ; CINEMATOGRAPHY ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; PHOTOGRAPHY ; PHYSICS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170306&DB=EPODOC&CC=KR&NR=20170024052A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170306&DB=EPODOC&CC=KR&NR=20170024052A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS</creatorcontrib><creatorcontrib>CROMPVOETS FLORIS MARIA HERMANSZ</creatorcontrib><creatorcontrib>SANDER JO MARIA JOHANNA HELENA</creatorcontrib><creatorcontrib>ZAHN FRITZ HELMUT</creatorcontrib><creatorcontrib>DEKKERS WOUTER</creatorcontrib><creatorcontrib>VDOVIN OLEXANDR VALENTYNOVYCH</creatorcontrib><creatorcontrib>KLEIJNEN CHRISTIAN</creatorcontrib><creatorcontrib>JAGT HENDRIK JOHANNES BOUDEWIJN</creatorcontrib><title>LED LED LIGHTING UNIT</title><description>LED 조명 유닛은 지지 구조체(14), 지지 구조체 내에 장착된 LED-기반 발광 구조체(10) 및 지지 구조체의 상부 위의 광학 빔 성형 배열체(50, 52)를 포함한다. 광학 빔 성형 배열체는 광학적으로 투명하고 열적으로 안정한 재료를 포함하고, 지지 구조체는 LED-기반 발광 구조체 위에서 작은 높이로 마이크로구조화 층을 지지한다. 이 높이는 예를 들어 0.5㎜ 미만일 수 있다. 광학 빔 성형 배열체는 소형이고 낮은 높이의 조명 유닛이 광학 빔 성형 소자에 손상을 주지 않고 리플로우 납땜에 의해 캐리어 상에 장착될 수 있게 한다.
An LED lighting unit comprising a support structure (14), an LED-based light emitting structure (10) mounted within the support structure and an optical beam shaping arrangement (50, 52) over the top of the support structure. The optical beam shaping arrangement comprises an optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement enables a compact and low height lighting unit to be mounted on a carrier by reflow soldering without damaging the optical beam-shaping component.</description><subject>ACCESSORIES THEREFOR</subject><subject>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</subject><subject>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>PHOTOGRAPHY</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD1cXVRAGNPd48QTz93hVA_zxAeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhLvHWRkYGhuYGBkYmBq5GhMnCoA8ksfZg</recordid><startdate>20170306</startdate><enddate>20170306</enddate><creator>HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS</creator><creator>CROMPVOETS FLORIS MARIA HERMANSZ</creator><creator>SANDER JO MARIA JOHANNA HELENA</creator><creator>ZAHN FRITZ HELMUT</creator><creator>DEKKERS WOUTER</creator><creator>VDOVIN OLEXANDR VALENTYNOVYCH</creator><creator>KLEIJNEN CHRISTIAN</creator><creator>JAGT HENDRIK JOHANNES BOUDEWIJN</creator><scope>EVB</scope></search><sort><creationdate>20170306</creationdate><title>LED LED LIGHTING UNIT</title><author>HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS ; CROMPVOETS FLORIS MARIA HERMANSZ ; SANDER JO MARIA JOHANNA HELENA ; ZAHN FRITZ HELMUT ; DEKKERS WOUTER ; VDOVIN OLEXANDR VALENTYNOVYCH ; KLEIJNEN CHRISTIAN ; JAGT HENDRIK JOHANNES BOUDEWIJN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170024052A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>ACCESSORIES THEREFOR</topic><topic>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</topic><topic>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>PHOTOGRAPHY</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS</creatorcontrib><creatorcontrib>CROMPVOETS FLORIS MARIA HERMANSZ</creatorcontrib><creatorcontrib>SANDER JO MARIA JOHANNA HELENA</creatorcontrib><creatorcontrib>ZAHN FRITZ HELMUT</creatorcontrib><creatorcontrib>DEKKERS WOUTER</creatorcontrib><creatorcontrib>VDOVIN OLEXANDR VALENTYNOVYCH</creatorcontrib><creatorcontrib>KLEIJNEN CHRISTIAN</creatorcontrib><creatorcontrib>JAGT HENDRIK JOHANNES BOUDEWIJN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HEUTS JACOBUS JOHANNES FRANCISCUS GERARDUS</au><au>CROMPVOETS FLORIS MARIA HERMANSZ</au><au>SANDER JO MARIA JOHANNA HELENA</au><au>ZAHN FRITZ HELMUT</au><au>DEKKERS WOUTER</au><au>VDOVIN OLEXANDR VALENTYNOVYCH</au><au>KLEIJNEN CHRISTIAN</au><au>JAGT HENDRIK JOHANNES BOUDEWIJN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED LED LIGHTING UNIT</title><date>2017-03-06</date><risdate>2017</risdate><abstract>LED 조명 유닛은 지지 구조체(14), 지지 구조체 내에 장착된 LED-기반 발광 구조체(10) 및 지지 구조체의 상부 위의 광학 빔 성형 배열체(50, 52)를 포함한다. 광학 빔 성형 배열체는 광학적으로 투명하고 열적으로 안정한 재료를 포함하고, 지지 구조체는 LED-기반 발광 구조체 위에서 작은 높이로 마이크로구조화 층을 지지한다. 이 높이는 예를 들어 0.5㎜ 미만일 수 있다. 광학 빔 성형 배열체는 소형이고 낮은 높이의 조명 유닛이 광학 빔 성형 소자에 손상을 주지 않고 리플로우 납땜에 의해 캐리어 상에 장착될 수 있게 한다.
An LED lighting unit comprising a support structure (14), an LED-based light emitting structure (10) mounted within the support structure and an optical beam shaping arrangement (50, 52) over the top of the support structure. The optical beam shaping arrangement comprises an optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement enables a compact and low height lighting unit to be mounted on a carrier by reflow soldering without damaging the optical beam-shaping component.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CINEMATOGRAPHY ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY PHOTOGRAPHY PHYSICS |
| title | LED LED LIGHTING UNIT |
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