FLUID MIXING HUB FOR SEMICONDUCTOR PROCESSING TOOL

FLUID MIXING HUB FOR SEMICONDUCTOR PROCESSING TOOL

A mixing hub for use in a semiconductor-processing tool is provided. The hub may include a plurality of ports disposed about a shaft, a mixing chamber, and a plurality of flow paths. Each of the flow paths may fluidly connect a corresponding port of the ports to the mixing chamber, and each of the f...

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Hauptverfasser: SHAREEF IQBAL A, TASKAR MARK
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Sprache:eng ; kor
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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TASKAR MARK
description A mixing hub for use in a semiconductor-processing tool is provided. The hub may include a plurality of ports disposed about a shaft, a mixing chamber, and a plurality of flow paths. Each of the flow paths may fluidly connect a corresponding port of the ports to the mixing chamber, and each of the flow paths may include a first passage, a second passage, and a valve interface. Each of the valve interfaces may be configured to interface with a valve such that the valve adjusts fluid flow between the first passage and the second passage when the valve is installed in the valve interface. Each of the valve interfaces may be positioned between a first reference plane vertical to the shaft and passing through the corresponding port and a second reference plane vertical to the shaft and passing through the mixing chamber. 반도체 프로세싱 툴 내의 사용을 위한 혼합 허브가 제공된다. 허브는 축을 중심으로 배치된 복수의 포트들, 혼합 챔버, 및 복수의 플로우 경로들을 포함할 수도 있다. 플로우 경로들 각각은 혼합 챔버에 포트들 중 대응하는 포트를 유체적으로 연결할 수도 있고 그리고 플로우 경로 각각은 제 1 통로, 제 2 통로, 및 밸브 인터페이스를 포함할 수도 있다. 밸브 인터페이스 각각은, 밸브가 밸브 인터페이스 내에 설치될 때, 밸브가 제 1 통로와 제 2 통로 사이의 유체 플로우를 조절할 수 있도록 밸브와 인터페이싱하도록 구성될 수도 있다. 밸브 인터페이스 각각은, 축에 대해 수직이고 대응하는 포트를 통과하는 제 1 기준 플레인과 축에 대해 수직이고 혼합 챔버를 통과하는 제 2 기준 플레인 사이에 위치될 수도 있다.
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The hub may include a plurality of ports disposed about a shaft, a mixing chamber, and a plurality of flow paths. Each of the flow paths may fluidly connect a corresponding port of the ports to the mixing chamber, and each of the flow paths may include a first passage, a second passage, and a valve interface. Each of the valve interfaces may be configured to interface with a valve such that the valve adjusts fluid flow between the first passage and the second passage when the valve is installed in the valve interface. Each of the valve interfaces may be positioned between a first reference plane vertical to the shaft and passing through the corresponding port and a second reference plane vertical to the shaft and passing through the mixing chamber. 반도체 프로세싱 툴 내의 사용을 위한 혼합 허브가 제공된다. 허브는 축을 중심으로 배치된 복수의 포트들, 혼합 챔버, 및 복수의 플로우 경로들을 포함할 수도 있다. 플로우 경로들 각각은 혼합 챔버에 포트들 중 대응하는 포트를 유체적으로 연결할 수도 있고 그리고 플로우 경로 각각은 제 1 통로, 제 2 통로, 및 밸브 인터페이스를 포함할 수도 있다. 밸브 인터페이스 각각은, 밸브가 밸브 인터페이스 내에 설치될 때, 밸브가 제 1 통로와 제 2 통로 사이의 유체 플로우를 조절할 수 있도록 밸브와 인터페이싱하도록 구성될 수도 있다. 밸브 인터페이스 각각은, 축에 대해 수직이고 대응하는 포트를 통과하는 제 1 기준 플레인과 축에 대해 수직이고 혼합 챔버를 통과하는 제 2 기준 플레인 사이에 위치될 수도 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170202&amp;DB=EPODOC&amp;CC=KR&amp;NR=20170012124A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170202&amp;DB=EPODOC&amp;CC=KR&amp;NR=20170012124A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAREEF IQBAL A</creatorcontrib><creatorcontrib>TASKAR MARK</creatorcontrib><title>FLUID MIXING HUB FOR SEMICONDUCTOR PROCESSING TOOL</title><description>A mixing hub for use in a semiconductor-processing tool is provided. 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The hub may include a plurality of ports disposed about a shaft, a mixing chamber, and a plurality of flow paths. Each of the flow paths may fluidly connect a corresponding port of the ports to the mixing chamber, and each of the flow paths may include a first passage, a second passage, and a valve interface. Each of the valve interfaces may be configured to interface with a valve such that the valve adjusts fluid flow between the first passage and the second passage when the valve is installed in the valve interface. Each of the valve interfaces may be positioned between a first reference plane vertical to the shaft and passing through the corresponding port and a second reference plane vertical to the shaft and passing through the mixing chamber. 반도체 프로세싱 툴 내의 사용을 위한 혼합 허브가 제공된다. 허브는 축을 중심으로 배치된 복수의 포트들, 혼합 챔버, 및 복수의 플로우 경로들을 포함할 수도 있다. 플로우 경로들 각각은 혼합 챔버에 포트들 중 대응하는 포트를 유체적으로 연결할 수도 있고 그리고 플로우 경로 각각은 제 1 통로, 제 2 통로, 및 밸브 인터페이스를 포함할 수도 있다. 밸브 인터페이스 각각은, 밸브가 밸브 인터페이스 내에 설치될 때, 밸브가 제 1 통로와 제 2 통로 사이의 유체 플로우를 조절할 수 있도록 밸브와 인터페이싱하도록 구성될 수도 있다. 밸브 인터페이스 각각은, 축에 대해 수직이고 대응하는 포트를 통과하는 제 1 기준 플레인과 축에 대해 수직이고 혼합 챔버를 통과하는 제 2 기준 플레인 사이에 위치될 수도 있다.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title FLUID MIXING HUB FOR SEMICONDUCTOR PROCESSING TOOL
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T11%3A10%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHAREEF%20IQBAL%20A&rft.date=2017-02-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20170012124A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true