SUPER CONFORMAL PLATING
워크피스 상의 피처를 적어도 부분적으로 충전하기 위한 방법은, 적어도 하나의 도금 금속 이온, 약 6 내지 약 13의 pH 범위, 유기 첨가제, 및 제 1 및 제 2 금속 착화제들을 갖는 도근 전해질을 사용하여, 워크피스 상에 형성된 시드 층 상에 금속화 층을 전기화학적으로 증착하는 단계를 포함한다. A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature; and...
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| creator | PABELICO CHRIS EMESH ISMAIL T SHAVIV ROEY KLOCKE JOHN L |
| description | 워크피스 상의 피처를 적어도 부분적으로 충전하기 위한 방법은, 적어도 하나의 도금 금속 이온, 약 6 내지 약 13의 pH 범위, 유기 첨가제, 및 제 1 및 제 2 금속 착화제들을 갖는 도근 전해질을 사용하여, 워크피스 상에 형성된 시드 층 상에 금속화 층을 전기화학적으로 증착하는 단계를 포함한다.
A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature; and depositing a first layer in the feature, wherein the chemistry for depositing the first layer has a pH in the range of about 6 to about 13, and includes a metal complexing agent and at least one organic or inorganic additive selected from the group consisting of accelerator, suppressor, and leveler. |
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A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature; and depositing a first layer in the feature, wherein the chemistry for depositing the first layer has a pH in the range of about 6 to about 13, and includes a metal complexing agent and at least one organic or inorganic additive selected from the group consisting of accelerator, suppressor, and leveler.</description><language>eng ; kor</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170106&DB=EPODOC&CC=KR&NR=20170002606A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170106&DB=EPODOC&CC=KR&NR=20170002606A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PABELICO CHRIS</creatorcontrib><creatorcontrib>EMESH ISMAIL T</creatorcontrib><creatorcontrib>SHAVIV ROEY</creatorcontrib><creatorcontrib>KLOCKE JOHN L</creatorcontrib><title>SUPER CONFORMAL PLATING</title><description>워크피스 상의 피처를 적어도 부분적으로 충전하기 위한 방법은, 적어도 하나의 도금 금속 이온, 약 6 내지 약 13의 pH 범위, 유기 첨가제, 및 제 1 및 제 2 금속 착화제들을 갖는 도근 전해질을 사용하여, 워크피스 상에 형성된 시드 층 상에 금속화 층을 전기화학적으로 증착하는 단계를 포함한다.
A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature; and depositing a first layer in the feature, wherein the chemistry for depositing the first layer has a pH in the range of about 6 to about 13, and includes a metal complexing agent and at least one organic or inorganic additive selected from the group consisting of accelerator, suppressor, and leveler.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAPDg1wDVJw9vdz8w_ydfRRCPBxDPH0c-dhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGhuYGBgZGZgZmjsbEqQIAVk4gSQ</recordid><startdate>20170106</startdate><enddate>20170106</enddate><creator>PABELICO CHRIS</creator><creator>EMESH ISMAIL T</creator><creator>SHAVIV ROEY</creator><creator>KLOCKE JOHN L</creator><scope>EVB</scope></search><sort><creationdate>20170106</creationdate><title>SUPER CONFORMAL PLATING</title><author>PABELICO CHRIS ; EMESH ISMAIL T ; SHAVIV ROEY ; KLOCKE JOHN L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170002606A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PABELICO CHRIS</creatorcontrib><creatorcontrib>EMESH ISMAIL T</creatorcontrib><creatorcontrib>SHAVIV ROEY</creatorcontrib><creatorcontrib>KLOCKE JOHN L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PABELICO CHRIS</au><au>EMESH ISMAIL T</au><au>SHAVIV ROEY</au><au>KLOCKE JOHN L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUPER CONFORMAL PLATING</title><date>2017-01-06</date><risdate>2017</risdate><abstract>워크피스 상의 피처를 적어도 부분적으로 충전하기 위한 방법은, 적어도 하나의 도금 금속 이온, 약 6 내지 약 13의 pH 범위, 유기 첨가제, 및 제 1 및 제 2 금속 착화제들을 갖는 도근 전해질을 사용하여, 워크피스 상에 형성된 시드 층 상에 금속화 층을 전기화학적으로 증착하는 단계를 포함한다.
A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature; and depositing a first layer in the feature, wherein the chemistry for depositing the first layer has a pH in the range of about 6 to about 13, and includes a metal complexing agent and at least one organic or inorganic additive selected from the group consisting of accelerator, suppressor, and leveler.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | SUPER CONFORMAL PLATING |
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