COVER PLATE FOR DEFECT CONTROL IN SPIN COATING PROCESS
본 명세서에 개시되는 기술은, 윈드 마크 및 난류 유체 유동에 의해 야기되는 다른 결함의 형성을 억제함으로써, 보다 높은 회전 속도와 건조 시간의 단축을 가능하게 하고, 또한 필름의 균일도를 유지하는 스핀 코팅 장치 및 방법을 제공한다. 본 명세서에 개시되는 기술은 웨이퍼 또는 다른 기판의 표면 위에 위치 설정되거나 현수되는 링 또는 덮개 등의 유체 유동 부재를 포함한다. 유체 유동 부재는 코팅 및 스핀 건조 프로세스 중에 웨이퍼의 회전 동안에 윈드 마크를 방지하는 반경 방향 곡률을 갖는다. Techniques disclosed h...
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| creator | ICHINO KATSUNORI PRINTZ WALLACE P HOOGE JOSHUA S YOSHIHARA KOUSUKE BASSETT DEREK W TERASHITA YUICHI |
| description | 본 명세서에 개시되는 기술은, 윈드 마크 및 난류 유체 유동에 의해 야기되는 다른 결함의 형성을 억제함으로써, 보다 높은 회전 속도와 건조 시간의 단축을 가능하게 하고, 또한 필름의 균일도를 유지하는 스핀 코팅 장치 및 방법을 제공한다. 본 명세서에 개시되는 기술은 웨이퍼 또는 다른 기판의 표면 위에 위치 설정되거나 현수되는 링 또는 덮개 등의 유체 유동 부재를 포함한다. 유체 유동 부재는 코팅 및 스핀 건조 프로세스 중에 웨이퍼의 회전 동안에 윈드 마크를 방지하는 반경 방향 곡률을 갖는다.
Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process. |
| format | Patent |
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Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161031&DB=EPODOC&CC=KR&NR=20160125429A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76292</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161031&DB=EPODOC&CC=KR&NR=20160125429A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ICHINO KATSUNORI</creatorcontrib><creatorcontrib>PRINTZ WALLACE P</creatorcontrib><creatorcontrib>HOOGE JOSHUA S</creatorcontrib><creatorcontrib>YOSHIHARA KOUSUKE</creatorcontrib><creatorcontrib>BASSETT DEREK W</creatorcontrib><creatorcontrib>TERASHITA YUICHI</creatorcontrib><title>COVER PLATE FOR DEFECT CONTROL IN SPIN COATING PROCESS</title><description>본 명세서에 개시되는 기술은, 윈드 마크 및 난류 유체 유동에 의해 야기되는 다른 결함의 형성을 억제함으로써, 보다 높은 회전 속도와 건조 시간의 단축을 가능하게 하고, 또한 필름의 균일도를 유지하는 스핀 코팅 장치 및 방법을 제공한다. 본 명세서에 개시되는 기술은 웨이퍼 또는 다른 기판의 표면 위에 위치 설정되거나 현수되는 링 또는 덮개 등의 유체 유동 부재를 포함한다. 유체 유동 부재는 코팅 및 스핀 건조 프로세스 중에 웨이퍼의 회전 동안에 윈드 마크를 방지하는 반경 방향 곡률을 갖는다.
Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBz9g9zDVII8HEMcVVw8w9ScHF1c3UOUXD29wsJ8vdR8PRTCA4AEs7-jiGefu4KAUH-zq7BwTwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JN47yMjA0MzA0MjUxMjS0Zg4VQCYNyiW</recordid><startdate>20161031</startdate><enddate>20161031</enddate><creator>ICHINO KATSUNORI</creator><creator>PRINTZ WALLACE P</creator><creator>HOOGE JOSHUA S</creator><creator>YOSHIHARA KOUSUKE</creator><creator>BASSETT DEREK W</creator><creator>TERASHITA YUICHI</creator><scope>EVB</scope></search><sort><creationdate>20161031</creationdate><title>COVER PLATE FOR DEFECT CONTROL IN SPIN COATING PROCESS</title><author>ICHINO KATSUNORI ; PRINTZ WALLACE P ; HOOGE JOSHUA S ; YOSHIHARA KOUSUKE ; BASSETT DEREK W ; TERASHITA YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20160125429A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2016</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ICHINO KATSUNORI</creatorcontrib><creatorcontrib>PRINTZ WALLACE P</creatorcontrib><creatorcontrib>HOOGE JOSHUA S</creatorcontrib><creatorcontrib>YOSHIHARA KOUSUKE</creatorcontrib><creatorcontrib>BASSETT DEREK W</creatorcontrib><creatorcontrib>TERASHITA YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ICHINO KATSUNORI</au><au>PRINTZ WALLACE P</au><au>HOOGE JOSHUA S</au><au>YOSHIHARA KOUSUKE</au><au>BASSETT DEREK W</au><au>TERASHITA YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COVER PLATE FOR DEFECT CONTROL IN SPIN COATING PROCESS</title><date>2016-10-31</date><risdate>2016</risdate><abstract>본 명세서에 개시되는 기술은, 윈드 마크 및 난류 유체 유동에 의해 야기되는 다른 결함의 형성을 억제함으로써, 보다 높은 회전 속도와 건조 시간의 단축을 가능하게 하고, 또한 필름의 균일도를 유지하는 스핀 코팅 장치 및 방법을 제공한다. 본 명세서에 개시되는 기술은 웨이퍼 또는 다른 기판의 표면 위에 위치 설정되거나 현수되는 링 또는 덮개 등의 유체 유동 부재를 포함한다. 유체 유동 부재는 코팅 및 스핀 건조 프로세스 중에 웨이퍼의 회전 동안에 윈드 마크를 방지하는 반경 방향 곡률을 갖는다.
Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | COVER PLATE FOR DEFECT CONTROL IN SPIN COATING PROCESS |
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