INTERCONNECT STRUCTURES AND METHODS OF FORMING SAME

A semiconductor device of an embodiment includes a first conductive feature part in a dielectric layer, and a second conductive feature part which is on the dielectric layer and is electrically connected to the first conductive feature part. The second conductive feature part includes a dual damasce...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG YING WEN, CHENG JYE YEN, HUANG YI CHUN, CHIANG WEN CHUAN, YAO CHIH HSIANG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!