METHOD FOR DRESSING POLISHING PADS
Provided is a method for dressing one polishing cloth or two polishing pads (11, 12) at the same time by using one or more dressers (4). The polishing cloths (11, 12) are attached to polishing plates (21, 22), includes one or more dressing elements (8) in contact with the dressed polishing cloths (1...
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| creator | MISTUR LESZEK OLBRICH TORSTEN SCHNAPPAUF MARKUS DUTSCHKE VLADIMIR |
| description | Provided is a method for dressing one polishing cloth or two polishing pads (11, 12) at the same time by using one or more dressers (4). The polishing cloths (11, 12) are attached to polishing plates (21, 22), includes one or more dressing elements (8) in contact with the dressed polishing cloths (11, 12) to be dressed in one or more dressers (4). At least one of the polishing plates (21, 22) is rotated at a relative rotation speed. The one or more dressers (4) are rotated at a relative rotation speed. Two or more different combinations are performed in rotation directions of the pair of polishing plates (21, 22) and a pair of pin wheels (31, 32) during simultaneous dressing of two polishing pads (11, 12), or are performed in rotation directions of the polishing plate (21) and the one or more dressers (4) during the dressing of one polishing cloth (11).
적어도 하나의 드레서(4)에 의해 하나의 폴리싱 천(polishing cloth) 또는 동시에 2개의 폴리싱 패드(11, 12)를 드레싱하는 방법을 제공한다. 폴리싱 천(11, 12)은 폴리싱 플레이트(21, 22)에 부착되며, 적어도 하나의 드레서(4)에는 드레싱될 적어도 하나의 폴리싱 천(11, 12)과 접촉하는 적어도 하나의 드레싱 요소(8)가 구비된다. 적어도 하나의 폴리싱 플레이트(21, 22)는 상대 회전 속도를 갖고 회전되고 적어도 하나의 드레서(4)는 상대 회전 속도를 갖고 회전되며, 2개의 폴리싱 패드(11, 12)의 동시 드레싱 중에 두 쌍의 폴리싱 플레이트(21, 22)와 핀 휘일(31, 32)의 회전 방향들에 있어서 또는 하나의 폴리싱 천(11)의 드레싱 중에 폴리싱 플레이트(21)와 적어도 하나의 드레서(4)의 회전 방향들에 있어서 적어도 2가지의 상이한 조합이 실행된다. |
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적어도 하나의 드레서(4)에 의해 하나의 폴리싱 천(polishing cloth) 또는 동시에 2개의 폴리싱 패드(11, 12)를 드레싱하는 방법을 제공한다. 폴리싱 천(11, 12)은 폴리싱 플레이트(21, 22)에 부착되며, 적어도 하나의 드레서(4)에는 드레싱될 적어도 하나의 폴리싱 천(11, 12)과 접촉하는 적어도 하나의 드레싱 요소(8)가 구비된다. 적어도 하나의 폴리싱 플레이트(21, 22)는 상대 회전 속도를 갖고 회전되고 적어도 하나의 드레서(4)는 상대 회전 속도를 갖고 회전되며, 2개의 폴리싱 패드(11, 12)의 동시 드레싱 중에 두 쌍의 폴리싱 플레이트(21, 22)와 핀 휘일(31, 32)의 회전 방향들에 있어서 또는 하나의 폴리싱 천(11)의 드레싱 중에 폴리싱 플레이트(21)와 적어도 하나의 드레서(4)의 회전 방향들에 있어서 적어도 2가지의 상이한 조합이 실행된다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160722&DB=EPODOC&CC=KR&NR=20160087770A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160722&DB=EPODOC&CC=KR&NR=20160087770A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MISTUR LESZEK</creatorcontrib><creatorcontrib>OLBRICH TORSTEN</creatorcontrib><creatorcontrib>SCHNAPPAUF MARKUS</creatorcontrib><creatorcontrib>DUTSCHKE VLADIMIR</creatorcontrib><title>METHOD FOR DRESSING POLISHING PADS</title><description>Provided is a method for dressing one polishing cloth or two polishing pads (11, 12) at the same time by using one or more dressers (4). The polishing cloths (11, 12) are attached to polishing plates (21, 22), includes one or more dressing elements (8) in contact with the dressed polishing cloths (11, 12) to be dressed in one or more dressers (4). At least one of the polishing plates (21, 22) is rotated at a relative rotation speed. The one or more dressers (4) are rotated at a relative rotation speed. Two or more different combinations are performed in rotation directions of the pair of polishing plates (21, 22) and a pair of pin wheels (31, 32) during simultaneous dressing of two polishing pads (11, 12), or are performed in rotation directions of the polishing plate (21) and the one or more dressers (4) during the dressing of one polishing cloth (11).
적어도 하나의 드레서(4)에 의해 하나의 폴리싱 천(polishing cloth) 또는 동시에 2개의 폴리싱 패드(11, 12)를 드레싱하는 방법을 제공한다. 폴리싱 천(11, 12)은 폴리싱 플레이트(21, 22)에 부착되며, 적어도 하나의 드레서(4)에는 드레싱될 적어도 하나의 폴리싱 천(11, 12)과 접촉하는 적어도 하나의 드레싱 요소(8)가 구비된다. 적어도 하나의 폴리싱 플레이트(21, 22)는 상대 회전 속도를 갖고 회전되고 적어도 하나의 드레서(4)는 상대 회전 속도를 갖고 회전되며, 2개의 폴리싱 패드(11, 12)의 동시 드레싱 중에 두 쌍의 폴리싱 플레이트(21, 22)와 핀 휘일(31, 32)의 회전 방향들에 있어서 또는 하나의 폴리싱 천(11)의 드레싱 중에 폴리싱 플레이트(21)와 적어도 하나의 드레서(4)의 회전 방향들에 있어서 적어도 2가지의 상이한 조합이 실행된다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDydQ3x8HdRcPMPUnAJcg0O9vRzVwjw9_EM9gCzHF2CeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGhmYGBhbm5uYGjMXGqALytI00</recordid><startdate>20160722</startdate><enddate>20160722</enddate><creator>MISTUR LESZEK</creator><creator>OLBRICH TORSTEN</creator><creator>SCHNAPPAUF MARKUS</creator><creator>DUTSCHKE VLADIMIR</creator><scope>EVB</scope></search><sort><creationdate>20160722</creationdate><title>METHOD FOR DRESSING POLISHING PADS</title><author>MISTUR LESZEK ; OLBRICH TORSTEN ; SCHNAPPAUF MARKUS ; DUTSCHKE VLADIMIR</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20160087770A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MISTUR LESZEK</creatorcontrib><creatorcontrib>OLBRICH TORSTEN</creatorcontrib><creatorcontrib>SCHNAPPAUF MARKUS</creatorcontrib><creatorcontrib>DUTSCHKE VLADIMIR</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MISTUR LESZEK</au><au>OLBRICH TORSTEN</au><au>SCHNAPPAUF MARKUS</au><au>DUTSCHKE VLADIMIR</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR DRESSING POLISHING PADS</title><date>2016-07-22</date><risdate>2016</risdate><abstract>Provided is a method for dressing one polishing cloth or two polishing pads (11, 12) at the same time by using one or more dressers (4). The polishing cloths (11, 12) are attached to polishing plates (21, 22), includes one or more dressing elements (8) in contact with the dressed polishing cloths (11, 12) to be dressed in one or more dressers (4). At least one of the polishing plates (21, 22) is rotated at a relative rotation speed. The one or more dressers (4) are rotated at a relative rotation speed. Two or more different combinations are performed in rotation directions of the pair of polishing plates (21, 22) and a pair of pin wheels (31, 32) during simultaneous dressing of two polishing pads (11, 12), or are performed in rotation directions of the polishing plate (21) and the one or more dressers (4) during the dressing of one polishing cloth (11).
적어도 하나의 드레서(4)에 의해 하나의 폴리싱 천(polishing cloth) 또는 동시에 2개의 폴리싱 패드(11, 12)를 드레싱하는 방법을 제공한다. 폴리싱 천(11, 12)은 폴리싱 플레이트(21, 22)에 부착되며, 적어도 하나의 드레서(4)에는 드레싱될 적어도 하나의 폴리싱 천(11, 12)과 접촉하는 적어도 하나의 드레싱 요소(8)가 구비된다. 적어도 하나의 폴리싱 플레이트(21, 22)는 상대 회전 속도를 갖고 회전되고 적어도 하나의 드레서(4)는 상대 회전 속도를 갖고 회전되며, 2개의 폴리싱 패드(11, 12)의 동시 드레싱 중에 두 쌍의 폴리싱 플레이트(21, 22)와 핀 휘일(31, 32)의 회전 방향들에 있어서 또는 하나의 폴리싱 천(11)의 드레싱 중에 폴리싱 플레이트(21)와 적어도 하나의 드레서(4)의 회전 방향들에 있어서 적어도 2가지의 상이한 조합이 실행된다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | METHOD FOR DRESSING POLISHING PADS |
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