CONDUCTIVE STRUCTURE, TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME
The present invention relates to a conductive structure and a manufacturing method thereof. Especially, the conductive structure according to an embodiment of the present invention may include: a base material; a conductive layer formed using a copper as a material; and a blackened layer including a...
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| creator | KIM, KYUNG KAK KIM, TAE HYUN SHIN, CHUNG HWAN SONG, BYEONG KIL JUNG, KWANG HEE |
| description | The present invention relates to a conductive structure and a manufacturing method thereof. Especially, the conductive structure according to an embodiment of the present invention may include: a base material; a conductive layer formed using a copper as a material; and a blackened layer including a copper oxynitride. By the conductive structure and the manufacturing method according to the embodiment of the present invention, since the method can manufacture the conductive structure including the conductive layer capable of replacing a prior ITO electrode, the method can manufacture the conductive structure with lower costs and lower resistance than ITO, and especially, can improve concealment of the conductive layer since the conductive structure includes the blackened layer.
본 출원은 전도성 구조체 및 이의 제조방법에 관한 것으로서, 특히 본 발명의 일 실시예에 의한 전도성 구조체는, 기재; 구리를 재료로 이용하여 형성한 전도층; 및 구리 산질화물을 포함하는 흑화층을 포함할 수 있다. 본 발명의 일 실시예에 의한 전도성 구조체 및 이의 제조방법에 의하면, 종래의 ITO 전극을 대체할 수 있는 전도층을 포함하는 전도성 구조체를 제조할 수 있으므로, ITO 대비 낮은 저항과 낮은 비용으로 전도성 구조체를 제조하는 것이 가능하며, 특히 흑화층을 포함하므로 전도층의 은폐성을 향상시킬 수 있다. |
| format | Patent |
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본 출원은 전도성 구조체 및 이의 제조방법에 관한 것으로서, 특히 본 발명의 일 실시예에 의한 전도성 구조체는, 기재; 구리를 재료로 이용하여 형성한 전도층; 및 구리 산질화물을 포함하는 흑화층을 포함할 수 있다. 본 발명의 일 실시예에 의한 전도성 구조체 및 이의 제조방법에 의하면, 종래의 ITO 전극을 대체할 수 있는 전도층을 포함하는 전도성 구조체를 제조할 수 있으므로, ITO 대비 낮은 저항과 낮은 비용으로 전도성 구조체를 제조하는 것이 가능하며, 특히 흑화층을 포함하므로 전도층의 은폐성을 향상시킬 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CALCULATING ; COMPUTING ; CONDUCTORS ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRICITY ; INSULATORS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; PHYSICS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160715&DB=EPODOC&CC=KR&NR=20160085138A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160715&DB=EPODOC&CC=KR&NR=20160085138A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, KYUNG KAK</creatorcontrib><creatorcontrib>KIM, TAE HYUN</creatorcontrib><creatorcontrib>SHIN, CHUNG HWAN</creatorcontrib><creatorcontrib>SONG, BYEONG KIL</creatorcontrib><creatorcontrib>JUNG, KWANG HEE</creatorcontrib><title>CONDUCTIVE STRUCTURE, TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME</title><description>The present invention relates to a conductive structure and a manufacturing method thereof. Especially, the conductive structure according to an embodiment of the present invention may include: a base material; a conductive layer formed using a copper as a material; and a blackened layer including a copper oxynitride. By the conductive structure and the manufacturing method according to the embodiment of the present invention, since the method can manufacture the conductive structure including the conductive layer capable of replacing a prior ITO electrode, the method can manufacture the conductive structure with lower costs and lower resistance than ITO, and especially, can improve concealment of the conductive layer since the conductive structure includes the blackened layer.
본 출원은 전도성 구조체 및 이의 제조방법에 관한 것으로서, 특히 본 발명의 일 실시예에 의한 전도성 구조체는, 기재; 구리를 재료로 이용하여 형성한 전도층; 및 구리 산질화물을 포함하는 흑화층을 포함할 수 있다. 본 발명의 일 실시예에 의한 전도성 구조체 및 이의 제조방법에 의하면, 종래의 ITO 전극을 대체할 수 있는 전도층을 포함하는 전도성 구조체를 제조할 수 있으므로, ITO 대비 낮은 저항과 낮은 비용으로 전도성 구조체를 제조하는 것이 가능하며, 특히 흑화층을 포함하므로 전도층의 은폐성을 향상시킬 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>CONDUCTORS</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB39vdzCXUO8QxzVQgOCQKyQoNcdRRC_EOdPRQCHP1cfRQc_VwUfF1DPPxdFNz8gxR8Hf1C3RxB6jz93BVCPID6HH1deRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGhmYGBhamhsYWjMXGqAI8rLWg</recordid><startdate>20160715</startdate><enddate>20160715</enddate><creator>KIM, KYUNG KAK</creator><creator>KIM, TAE HYUN</creator><creator>SHIN, CHUNG HWAN</creator><creator>SONG, BYEONG KIL</creator><creator>JUNG, KWANG HEE</creator><scope>EVB</scope></search><sort><creationdate>20160715</creationdate><title>CONDUCTIVE STRUCTURE, TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME</title><author>KIM, KYUNG KAK ; KIM, TAE HYUN ; SHIN, CHUNG HWAN ; SONG, BYEONG KIL ; JUNG, KWANG HEE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20160085138A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>CONDUCTORS</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, KYUNG KAK</creatorcontrib><creatorcontrib>KIM, TAE HYUN</creatorcontrib><creatorcontrib>SHIN, CHUNG HWAN</creatorcontrib><creatorcontrib>SONG, BYEONG KIL</creatorcontrib><creatorcontrib>JUNG, KWANG HEE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, KYUNG KAK</au><au>KIM, TAE HYUN</au><au>SHIN, CHUNG HWAN</au><au>SONG, BYEONG KIL</au><au>JUNG, KWANG HEE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE STRUCTURE, TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME</title><date>2016-07-15</date><risdate>2016</risdate><abstract>The present invention relates to a conductive structure and a manufacturing method thereof. Especially, the conductive structure according to an embodiment of the present invention may include: a base material; a conductive layer formed using a copper as a material; and a blackened layer including a copper oxynitride. By the conductive structure and the manufacturing method according to the embodiment of the present invention, since the method can manufacture the conductive structure including the conductive layer capable of replacing a prior ITO electrode, the method can manufacture the conductive structure with lower costs and lower resistance than ITO, and especially, can improve concealment of the conductive layer since the conductive structure includes the blackened layer.
본 출원은 전도성 구조체 및 이의 제조방법에 관한 것으로서, 특히 본 발명의 일 실시예에 의한 전도성 구조체는, 기재; 구리를 재료로 이용하여 형성한 전도층; 및 구리 산질화물을 포함하는 흑화층을 포함할 수 있다. 본 발명의 일 실시예에 의한 전도성 구조체 및 이의 제조방법에 의하면, 종래의 ITO 전극을 대체할 수 있는 전도층을 포함하는 전도성 구조체를 제조할 수 있으므로, ITO 대비 낮은 저항과 낮은 비용으로 전도성 구조체를 제조하는 것이 가능하며, 특히 흑화층을 포함하므로 전도층의 은폐성을 향상시킬 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CALCULATING COMPUTING CONDUCTORS COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING |
| title | CONDUCTIVE STRUCTURE, TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME |
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