SEMICONDUCTOR PACKAGE

A semiconductor package is provided. The semiconductor package comprises: a base film having an upper surface and a rear surface; a circuit pattern arranged on the upper surface of the base film and connected to a ground line; a penetration hole configured to penetrate the base film; and a lower shi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI, KYOUNG SEI, PARK, JI YONG, KIM, WOON BAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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