PLATING METHOD

A copper electroplating bath having a surface tension of 40 mN/m is suitable for filling a via with copper, wherein such copper deposit is substantially void-free and free of surface defects. A method for filling a via in an electronic device with copper comprises: providing an acidic copper electro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GOMEZ LUIS A, SCALISI MARK A, LIEB BRYAN, HAZEBROUCK REBECCA LEA, THORSETH MATTHEW A, LEFEBVRE MARK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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