SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

The present invention relates to a semiconductor package, and a method for manufacturing the same. According to the present invention, the semiconductor package comprises: a lower package including a lower substrate, a lower semiconductor chip, and a lower molding layer for exposing an upper surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IM, YUN HYEOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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