SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

The present invention relates to a semiconductor package, and a method for manufacturing the same. According to the present invention, the semiconductor package comprises: a lower package including a lower substrate, a lower semiconductor chip, and a lower molding layer for exposing an upper surface...

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1. Verfasser: IM, YUN HYEOK
Format: Patent
Sprache:eng ; kor
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The present invention relates to a semiconductor package, and a method for manufacturing the same. According to the present invention, the semiconductor package comprises: a lower package including a lower substrate, a lower semiconductor chip, and a lower molding layer for exposing an upper surface of the lower semiconductor chip; bumps separated from the lower semiconductor chip on the lower substrate; a lead frame arranged on the lower semiconductor chip and the bumps, and electrically connected to the bumps; and an upper package arranged on the lead frame, and electrically connected to the lead frame. 본 발명은 반도체 패키지 및 그 제조 방법을 제공한다. 본 발명에 따른 반도체 패키지는 하부 기판, 하부 반도체칩, 그리고 상기 하부 반도체칩의 상면을 노출시키는 하부 몰딩막을 포함하는 하부 패키지; 상기 하부 기판 상에서 상기 하부 반도체칩과 이격된 범프들; 상기 하부 반도체칩 및 상기 범프들 상에 배치되고, 상기 범프들과 전기적으로 연결되는 리드 프레임; 및 상기 리드 프레임 상에 배치되고, 상기 리드 프레임과 전기적으로 연결되는 상부 패키지를 포함할 수 있다.
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According to the present invention, the semiconductor package comprises: a lower package including a lower substrate, a lower semiconductor chip, and a lower molding layer for exposing an upper surface of the lower semiconductor chip; bumps separated from the lower semiconductor chip on the lower substrate; a lead frame arranged on the lower semiconductor chip and the bumps, and electrically connected to the bumps; and an upper package arranged on the lead frame, and electrically connected to the lead frame. 본 발명은 반도체 패키지 및 그 제조 방법을 제공한다. 본 발명에 따른 반도체 패키지는 하부 기판, 하부 반도체칩, 그리고 상기 하부 반도체칩의 상면을 노출시키는 하부 몰딩막을 포함하는 하부 패키지; 상기 하부 기판 상에서 상기 하부 반도체칩과 이격된 범프들; 상기 하부 반도체칩 및 상기 범프들 상에 배치되고, 상기 범프들과 전기적으로 연결되는 리드 프레임; 및 상기 리드 프레임 상에 배치되고, 상기 리드 프레임과 전기적으로 연결되는 상부 패키지를 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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