APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE

A vacuum adsorption apparatus for a semiconductor package and a vacuum adsorption method therefor are provided. The vacuum adsorption apparatus for a semiconductor package comprises: a housing of which an upper surface has an opening; a vacuum adsorption unit disposed inside the housing; and a stage...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, YONG KI, CHOI JOO HOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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