APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE
A vacuum adsorption apparatus for a semiconductor package and a vacuum adsorption method therefor are provided. The vacuum adsorption apparatus for a semiconductor package comprises: a housing of which an upper surface has an opening; a vacuum adsorption unit disposed inside the housing; and a stage...
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| creator | KIM, YONG KI CHOI JOO HOON |
| description | A vacuum adsorption apparatus for a semiconductor package and a vacuum adsorption method therefor are provided. The vacuum adsorption apparatus for a semiconductor package comprises: a housing of which an upper surface has an opening; a vacuum adsorption unit disposed inside the housing; and a stage formed on the opening formed in the housing and having a plurality of holes. Pressure generated in the vacuum adsorption unit is applied to the upper surface of the stage through the opening and the holes.
반도체 패키지의 진공 흡착 장치 및 방법이 제공된다. 상기 반도체 패키지의 진공 흡착 장치는 상면에 개구가 형성된 하우징, 상기 하우징 내에 배치된 진공흡착부 및 상기 하우징에 형성된 개구 상에 형성되고, 복수의 홀을 포함하는 스테이지를 포함하되, 상기 진공흡작부에서 생긴 압력은 상기 개구와 상기 복수의 홀을 통해 상기 스테이지의 상면에 작용 한다. |
| format | Patent |
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반도체 패키지의 진공 흡착 장치 및 방법이 제공된다. 상기 반도체 패키지의 진공 흡착 장치는 상면에 개구가 형성된 하우징, 상기 하우징 내에 배치된 진공흡착부 및 상기 하우징에 형성된 개구 상에 형성되고, 복수의 홀을 포함하는 스테이지를 포함하되, 상기 진공흡작부에서 생긴 압력은 상기 개구와 상기 복수의 홀을 통해 상기 스테이지의 상면에 작용 한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT ; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151105&DB=EPODOC&CC=KR&NR=20150124201A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151105&DB=EPODOC&CC=KR&NR=20150124201A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, YONG KI</creatorcontrib><creatorcontrib>CHOI JOO HOON</creatorcontrib><title>APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE</title><description>A vacuum adsorption apparatus for a semiconductor package and a vacuum adsorption method therefor are provided. The vacuum adsorption apparatus for a semiconductor package comprises: a housing of which an upper surface has an opening; a vacuum adsorption unit disposed inside the housing; and a stage formed on the opening formed in the housing and having a plurality of holes. Pressure generated in the vacuum adsorption unit is applied to the upper surface of the stage through the opening and the holes.
반도체 패키지의 진공 흡착 장치 및 방법이 제공된다. 상기 반도체 패키지의 진공 흡착 장치는 상면에 개구가 형성된 하우징, 상기 하우징 내에 배치된 진공흡착부 및 상기 하우징에 형성된 개구 상에 형성되고, 복수의 홀을 포함하는 스테이지를 포함하되, 상기 진공흡작부에서 생긴 압력은 상기 개구와 상기 복수의 홀을 통해 상기 스테이지의 상면에 작용 한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</subject><subject>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB1DAhwDHIMCQ1WcPRzUfB1DfHwd1Hwd1MIdvX1dPb3cwl1DvEPUghwdPZ2dHflYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBoamBoZGJkDa0Zg4VQBDaCYZ</recordid><startdate>20151105</startdate><enddate>20151105</enddate><creator>KIM, YONG KI</creator><creator>CHOI JOO HOON</creator><scope>EVB</scope></search><sort><creationdate>20151105</creationdate><title>APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE</title><author>KIM, YONG KI ; CHOI JOO HOON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20150124201A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</topic><topic>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, YONG KI</creatorcontrib><creatorcontrib>CHOI JOO HOON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, YONG KI</au><au>CHOI JOO HOON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE</title><date>2015-11-05</date><risdate>2015</risdate><abstract>A vacuum adsorption apparatus for a semiconductor package and a vacuum adsorption method therefor are provided. The vacuum adsorption apparatus for a semiconductor package comprises: a housing of which an upper surface has an opening; a vacuum adsorption unit disposed inside the housing; and a stage formed on the opening formed in the housing and having a plurality of holes. Pressure generated in the vacuum adsorption unit is applied to the upper surface of the stage through the opening and the holes.
반도체 패키지의 진공 흡착 장치 및 방법이 제공된다. 상기 반도체 패키지의 진공 흡착 장치는 상면에 개구가 형성된 하우징, 상기 하우징 내에 배치된 진공흡착부 및 상기 하우징에 형성된 개구 상에 형성되고, 복수의 홀을 포함하는 스테이지를 포함하되, 상기 진공흡작부에서 생긴 압력은 상기 개구와 상기 복수의 홀을 통해 상기 스테이지의 상면에 작용 한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE |
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