SUBSTRATE TREATING APPARATUS

The present invention provides a substrate treating apparatus. The substrate treating apparatus comprises a process chamber, a substrate support unit, an antenna member, a slow wave plate, and a dielectric sheet. The slow wave plate and the dielectric sheet are made of different dielectric materials...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JANG, YONG SU, KIM, SUN RAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a substrate treating apparatus. The substrate treating apparatus comprises a process chamber, a substrate support unit, an antenna member, a slow wave plate, and a dielectric sheet. The slow wave plate and the dielectric sheet are made of different dielectric materials, improve concentration at the center of the dielectric sheet in a micro wave electric filed, thereby preventing damage of the dielectric sheet caused by non-uniform formation of plasma, and occurrence of particles, and increasing energy efficiency of the substrate treating apparatus. 본 발명은 기판 처리 장치를 제공한다. 기판 처리 장치는 공정 챔버, 기판 지지 유닛, 안테나 부재, 지파판 및 유전판 등을 포함한다. 지파판과 유전판은 서로 상이한 유전체 재질로 제공됨으로써 마이크로파 전계의 유전판 중심부 집중 현상을 개선시킴으로써 플라즈마의 불균일한 발생으로 인한 유전판 등의 손상 및 파티클 발생을 방지할 수 있고, 기판 처리 장치의 에너지 효율을 높일 수 있다.