METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES
Provided is a method for operating a bonding machine for bonding a semiconductor element. The method comprises the steps of: (a) measuring time dependent z-axis height measured value characteristics of a bonding head assembly during a model bonding process; (b) determining z-axis adjustment profile...
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| creator | COLOSIMO THOMAS J WASSERMAN MATTHEW B SCHMIDT LANGE MICHAEL P |
| description | Provided is a method for operating a bonding machine for bonding a semiconductor element. The method comprises the steps of: (a) measuring time dependent z-axis height measured value characteristics of a bonding head assembly during a model bonding process; (b) determining z-axis adjustment profile for a next bonding process based on the measured time dependent z-axis height measured value characteristics; and (c) adjusting the z-axis location of the bonding head assembly by a z-axis moving system by using the z-axis adjustment profile during the next bonding process.
반도체 요소를 본딩하기 위한 본딩 기계를 작동하는 방법이 제공된다. 본 방법은 (a) 모델 본딩 공정 중에 본딩 헤드 어셈블리의 시간 종속 z-축 높이 측정치 특성을 측정하는 단계; (b) 측정된 시간 종속 z-축 높이 측정치 특성에 근거하여 다음 본딩 공정을 위한 z-축 조정 프로파일을 결정하는 단계; 및 (c) 다음 본딩 공정 중에 z-축 조정 프로파일을 사용하여 z-축 운동 시스템으로 본딩 헤드 어셈블리의 z-축 위치를 조정하는 단계를 포함한다. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20150070974A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20150070974A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20150070974A3</originalsourceid><addsrcrecordid>eNrjZIjzdQ3x8HcJVvB3U_APcA1yDPH0c1dw8vdzAdG-js4enn6uwQpu_kFwwWBXX09nIDvUOQQo6urj6uvqFxKso-Do54KhkYeBNS0xpziVF0pzMyi7uYY4e-imFuTHpxYXJCan5qWWxHsHGRkYmhoYmBtYmps4GhOnCgDMvDOO</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES</title><source>esp@cenet</source><creator>COLOSIMO THOMAS J ; WASSERMAN MATTHEW B ; SCHMIDT LANGE MICHAEL P</creator><creatorcontrib>COLOSIMO THOMAS J ; WASSERMAN MATTHEW B ; SCHMIDT LANGE MICHAEL P</creatorcontrib><description>Provided is a method for operating a bonding machine for bonding a semiconductor element. The method comprises the steps of: (a) measuring time dependent z-axis height measured value characteristics of a bonding head assembly during a model bonding process; (b) determining z-axis adjustment profile for a next bonding process based on the measured time dependent z-axis height measured value characteristics; and (c) adjusting the z-axis location of the bonding head assembly by a z-axis moving system by using the z-axis adjustment profile during the next bonding process.
반도체 요소를 본딩하기 위한 본딩 기계를 작동하는 방법이 제공된다. 본 방법은 (a) 모델 본딩 공정 중에 본딩 헤드 어셈블리의 시간 종속 z-축 높이 측정치 특성을 측정하는 단계; (b) 측정된 시간 종속 z-축 높이 측정치 특성에 근거하여 다음 본딩 공정을 위한 z-축 조정 프로파일을 결정하는 단계; 및 (c) 다음 본딩 공정 중에 z-축 조정 프로파일을 사용하여 z-축 운동 시스템으로 본딩 헤드 어셈블리의 z-축 위치를 조정하는 단계를 포함한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150625&DB=EPODOC&CC=KR&NR=20150070974A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150625&DB=EPODOC&CC=KR&NR=20150070974A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>COLOSIMO THOMAS J</creatorcontrib><creatorcontrib>WASSERMAN MATTHEW B</creatorcontrib><creatorcontrib>SCHMIDT LANGE MICHAEL P</creatorcontrib><title>METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES</title><description>Provided is a method for operating a bonding machine for bonding a semiconductor element. The method comprises the steps of: (a) measuring time dependent z-axis height measured value characteristics of a bonding head assembly during a model bonding process; (b) determining z-axis adjustment profile for a next bonding process based on the measured time dependent z-axis height measured value characteristics; and (c) adjusting the z-axis location of the bonding head assembly by a z-axis moving system by using the z-axis adjustment profile during the next bonding process.
반도체 요소를 본딩하기 위한 본딩 기계를 작동하는 방법이 제공된다. 본 방법은 (a) 모델 본딩 공정 중에 본딩 헤드 어셈블리의 시간 종속 z-축 높이 측정치 특성을 측정하는 단계; (b) 측정된 시간 종속 z-축 높이 측정치 특성에 근거하여 다음 본딩 공정을 위한 z-축 조정 프로파일을 결정하는 단계; 및 (c) 다음 본딩 공정 중에 z-축 조정 프로파일을 사용하여 z-축 운동 시스템으로 본딩 헤드 어셈블리의 z-축 위치를 조정하는 단계를 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjzdQ3x8HcJVvB3U_APcA1yDPH0c1dw8vdzAdG-js4enn6uwQpu_kFwwWBXX09nIDvUOQQo6urj6uvqFxKso-Do54KhkYeBNS0xpziVF0pzMyi7uYY4e-imFuTHpxYXJCan5qWWxHsHGRkYmhoYmBtYmps4GhOnCgDMvDOO</recordid><startdate>20150625</startdate><enddate>20150625</enddate><creator>COLOSIMO THOMAS J</creator><creator>WASSERMAN MATTHEW B</creator><creator>SCHMIDT LANGE MICHAEL P</creator><scope>EVB</scope></search><sort><creationdate>20150625</creationdate><title>METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES</title><author>COLOSIMO THOMAS J ; WASSERMAN MATTHEW B ; SCHMIDT LANGE MICHAEL P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20150070974A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>COLOSIMO THOMAS J</creatorcontrib><creatorcontrib>WASSERMAN MATTHEW B</creatorcontrib><creatorcontrib>SCHMIDT LANGE MICHAEL P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>COLOSIMO THOMAS J</au><au>WASSERMAN MATTHEW B</au><au>SCHMIDT LANGE MICHAEL P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES</title><date>2015-06-25</date><risdate>2015</risdate><abstract>Provided is a method for operating a bonding machine for bonding a semiconductor element. The method comprises the steps of: (a) measuring time dependent z-axis height measured value characteristics of a bonding head assembly during a model bonding process; (b) determining z-axis adjustment profile for a next bonding process based on the measured time dependent z-axis height measured value characteristics; and (c) adjusting the z-axis location of the bonding head assembly by a z-axis moving system by using the z-axis adjustment profile during the next bonding process.
반도체 요소를 본딩하기 위한 본딩 기계를 작동하는 방법이 제공된다. 본 방법은 (a) 모델 본딩 공정 중에 본딩 헤드 어셈블리의 시간 종속 z-축 높이 측정치 특성을 측정하는 단계; (b) 측정된 시간 종속 z-축 높이 측정치 특성에 근거하여 다음 본딩 공정을 위한 z-축 조정 프로파일을 결정하는 단계; 및 (c) 다음 본딩 공정 중에 z-축 조정 프로파일을 사용하여 z-축 운동 시스템으로 본딩 헤드 어셈블리의 z-축 위치를 조정하는 단계를 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES |
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